WO1994013008A3 - Forming a layer - Google Patents

Forming a layer Download PDF

Info

Publication number
WO1994013008A3
WO1994013008A3 PCT/GB1993/002359 GB9302359W WO9413008A3 WO 1994013008 A3 WO1994013008 A3 WO 1994013008A3 GB 9302359 W GB9302359 W GB 9302359W WO 9413008 A3 WO9413008 A3 WO 9413008A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
article
forming
recess
methods
Prior art date
Application number
PCT/GB1993/002359
Other languages
French (fr)
Other versions
WO1994013008A2 (en
Inventor
Christopher David Dobson
Original Assignee
Electrotech Ltd
Christopher David Dobson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrotech Ltd, Christopher David Dobson filed Critical Electrotech Ltd
Priority to JP6512877A priority Critical patent/JPH07503106A/en
Priority to EP94900220A priority patent/EP0621980A1/en
Priority to KR1019940702401A priority patent/KR940704056A/en
Publication of WO1994013008A2 publication Critical patent/WO1994013008A2/en
Publication of WO1994013008A3 publication Critical patent/WO1994013008A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76837—Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76882—Reflowing or applying of pressure to better fill the contact hole

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

The method comprises depositing a layer (10) of a material (10) on the surface of an article (1) such that the layer (10) covers the mouth of a recess (3) leaving a void below the closed mouth. Subsequently, without elevating their temperature, the article (11) and layer (10) are subjected to elevated pressures (e.g. pressurised liquid) sufficient to cause the layer (10) to deform into the recess (3). Furthermore, the invention provides a method for forming a layer on such a surface, using the technique of magnetron sputtering and heating the article to increase the mobility of the deposited material. Also provided is apparatus for use in carrying out these methods, which methods are of particular use in the processing of semiconductor wafers.
PCT/GB1993/002359 1992-11-19 1993-11-16 Forming a layer WO1994013008A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6512877A JPH07503106A (en) 1992-11-19 1993-11-16 formation of layers
EP94900220A EP0621980A1 (en) 1992-11-19 1993-11-16 Forming a layer
KR1019940702401A KR940704056A (en) 1992-11-19 1993-11-16 Layer Formation Method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9224260.1 1992-11-19
GB929224260A GB9224260D0 (en) 1992-11-19 1992-11-19 Forming a layer

Publications (2)

Publication Number Publication Date
WO1994013008A2 WO1994013008A2 (en) 1994-06-09
WO1994013008A3 true WO1994013008A3 (en) 1994-07-21

Family

ID=10725348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1993/002359 WO1994013008A2 (en) 1992-11-19 1993-11-16 Forming a layer

Country Status (6)

Country Link
EP (1) EP0621980A1 (en)
JP (1) JPH07503106A (en)
KR (1) KR940704056A (en)
GB (1) GB9224260D0 (en)
TW (1) TW296461B (en)
WO (1) WO1994013008A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932289A (en) * 1991-05-28 1999-08-03 Trikon Technologies Limited Method for filling substrate recesses using pressure and heat treatment
GB9414145D0 (en) * 1994-07-13 1994-08-31 Electrotech Ltd Forming a layer
KR960026249A (en) * 1994-12-12 1996-07-22 윌리엄 이. 힐러 High Pressure, Low Temperature Semiconductor Gap Filling Process
EP0793268A3 (en) * 1995-05-23 1999-03-03 Texas Instruments Incorporated Process for filling a cavity in a semiconductor device
JPH09102541A (en) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp Semiconductor device and its manufacture
JPH09115866A (en) 1995-10-17 1997-05-02 Mitsubishi Electric Corp Semiconductor device manufacturing method
US6171957B1 (en) 1997-07-16 2001-01-09 Mitsubishi Denki Kabushiki Kaisha Manufacturing method of semiconductor device having high pressure reflow process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011793A (en) * 1990-06-19 1991-04-30 Nihon Shinku Gijutsu Kabushiki Kaisha Vacuum deposition using pressurized reflow process
EP0430040A2 (en) * 1989-11-27 1991-06-05 Micron Technology, Inc. Method of forming a conductive via plug or an interconnect line of ductile metal within an integrated circuit using mechanical smearing
EP0526889A2 (en) * 1991-08-06 1993-02-10 Nec Corporation Method of depositing a metal or passivation fabric with high adhesion on an insulated semiconductor substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222459A (en) * 1985-03-28 1986-10-02 日本電気株式会社 Medical irradiation field projector
JPS63294839A (en) * 1987-05-27 1988-12-01 Nec Corp Ct simulator for radiotherapy
JPS6491199A (en) * 1987-10-02 1989-04-10 Toshiba Corp Operation controller using voice recognizing function
DE8713524U1 (en) * 1987-10-08 1989-02-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPH01218466A (en) * 1988-02-26 1989-08-31 Shimadzu Corp Thermotherapy device
JPH01280444A (en) * 1988-04-30 1989-11-10 Toshiba Corp X-ray ct scanner device
JPH0268042A (en) * 1988-09-02 1990-03-07 Yokogawa Medical Syst Ltd Table device for medical equipment
JPH0422344A (en) * 1990-05-17 1992-01-27 Toshiba Corp Control device for operation of medical photographing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0430040A2 (en) * 1989-11-27 1991-06-05 Micron Technology, Inc. Method of forming a conductive via plug or an interconnect line of ductile metal within an integrated circuit using mechanical smearing
US5011793A (en) * 1990-06-19 1991-04-30 Nihon Shinku Gijutsu Kabushiki Kaisha Vacuum deposition using pressurized reflow process
EP0526889A2 (en) * 1991-08-06 1993-02-10 Nec Corporation Method of depositing a metal or passivation fabric with high adhesion on an insulated semiconductor substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
H.HIGUCHI ET AL.: "PLANAR TECHNOLOGY FOR MULTILAYER METALLIZATION", EXTENDED ABSTRACTS, vol. 80, no. 1, May 1980 (1980-05-01), PRINCETON, NEW JERSEY US, pages 456 - 458 *

Also Published As

Publication number Publication date
TW296461B (en) 1997-01-21
JPH07503106A (en) 1995-03-30
EP0621980A1 (en) 1994-11-02
WO1994013008A2 (en) 1994-06-09
GB9224260D0 (en) 1993-01-06
KR940704056A (en) 1994-12-12

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