WO1993016576A1 - Cablage auxiliaire de cartes a circuit imprime - Google Patents

Cablage auxiliaire de cartes a circuit imprime Download PDF

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Publication number
WO1993016576A1
WO1993016576A1 PCT/US1993/001516 US9301516W WO9316576A1 WO 1993016576 A1 WO1993016576 A1 WO 1993016576A1 US 9301516 W US9301516 W US 9301516W WO 9316576 A1 WO9316576 A1 WO 9316576A1
Authority
WO
WIPO (PCT)
Prior art keywords
clips
pcb
slot
clip
substrate
Prior art date
Application number
PCT/US1993/001516
Other languages
English (en)
Inventor
Brian Michael Coll
Original Assignee
Digital Equipment Corporation
Digital Equipment International Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corporation, Digital Equipment International Ltd. filed Critical Digital Equipment Corporation
Publication of WO1993016576A1 publication Critical patent/WO1993016576A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Definitions

  • the present invention relates to printed circuit boards (PCBs), and more specifically to the addition of auxiliary wiring thereto to modify their function.
  • a typical PCB consists of an insulating substrate with conductive tracks formed ("printed") thereon and with various electrical/electronic components attached thereto.
  • the conductive tracks may be on one or both sides of the 10 board; some complicated boards may be multi-layer (i.e. have a number of conductive layers, some consisting of conductive tracks and others of voltage supply and ground planes).
  • the components may be discrete and/or integrated circuits.
  • breaks can be made in the appropriate conductive paths on the board by cutting through them (either before or after the components are attached), or the appropriate legs of integrated circuits can be broken off or bent up before they are attached to the board.
  • Each wire is a thin insulated wire laid along the surface of the board between the appropriate two points and soldered to those points. (For general neatness, and to avoid the wires interfering with the components on the board, they are generally routed parallel to the edges of the board rather than diagonally across the board (“as the crow- flies") directly between the points they connect.)
  • wires It is important to ensure that these wires do not catch on other boards or parts of the chassis of the system receiving the board when the board is being transported or inserted into the equipment or removed from it.
  • the wires must therefore be kept close to the board along their whole lengths.
  • the standard method of achieving this is to glue the wires to the board at suitable intervals, typically at all bends and at 25 or 50 mm intervals on straight runs. This is a labour-intensive process, and the reliability of the gluing is doubtful. Further, the wires may have to be done during repair of the PCB. This is difficult, and the removal of the wires and the cleaning of the glue from the surface of the board is liable to damage the board and/or the components to which the wires are attached.
  • the general object of the invention is to provide an improved system for attaching added wires to PCBs.
  • the crux of the invention lies in the use of clips which are mounted on the PCB and are used to retain the auxiliary wires close against the substrate.
  • Various aspects of the invention are concerned with the clips themselves, PCBs using the clips, and the processes of attaching the clips to the PCBs, adding the auxiliary wires, and retaining them in the clips.
  • the clip may be a small block having either a plurality of parallel holes through it or a slot (preferably with a narrowed mouth along at least one side).
  • the clips may be mounted on the substrate either manually or automatically along with the other components of the PCB. If they are mounted automatically, they are first put on a tape and reel and loaded onto the mounting machine ("onsertion machine") in the same way as the other components.
  • Figure 1 is a simplified and partial perspective view of the PCB with a clip on it;
  • Figure 2 is a perspective view of an alternative form of clip
  • Figure 2A is a section through the clip of Figure 2.
  • Figure 3 is a perspective view of a further alternative form of clip.
  • the PCB comprises an insulating substrate 10 with a considerable number of integrated circuits mounted on it, only one of which is shown (at 11).
  • This integrated circuit has sets of leads 12 along two sides (only one set being shown).
  • Each lead is soldered to a respective conductive pad 13 on the substrate 10.
  • the substrate has conductive paths 14 formed on its upper surface connecting the pads to other components or to through holes 15 which are connected to similar conductive paths (not shown) on its under surface.
  • the present PCB has wiring clips attached to it at suitable locations, one such wiring clip 20 being shown.
  • Eadh wiring clip has a convenient number of holes
  • a second auxiliary wire 23 is connected between two more components (not shown), and is routed through another hole in the clip 20; the route of this wire 23 changes direction at this point, as shown.
  • the first step is depositing adhesive at the appropriate ' locations on the board; a convenient adhesive is a suitable epoxy resin.
  • the clips are then placed on the board.
  • the board is then passed through an infra-red machine, to heat the adhesive and cause it to set, and then passed through a vapour phase machine to reflow the solder.
  • the vapour phase machine is optional; the infra-red machine can also be used to reflow the solder.
  • the board has its integrated circuits and other electrical components attached to it in the same way as the clips, with the infra-red and vapour phase operations fixing all components (integrated circuits, other electrical components, and clips) to it.
  • the board then typically undergoes the further processes of being washed, passed through a wave solder machine to form the soldered connections of the integrated circuits and other electrical components, and washed again. (The wave solder machine is also optional.)
  • the auxiliary wires are added manually. Each auxiliary wire is threaded through the appropriate clips and has its ends soldered to the appropriate pads under slight tension to hold it in place.
  • the clips are preferably formed of plastics material, which must obviously be sufficiently heat-resistant to withstand the operations (infra-red, vapour phase> waver soldering, and washing) which follow their placing on the board.
  • a convenient size for the clips is about 2.5 x 4 x 7 mm;. this size is sufficient to allow the automatic component placing machinery to handle them without loss or misalignment.
  • the height, 2.5 mm is chosen to be no greater than the height of the other components on the PCB, and the width, 7 mm, is chosen to allow say 3 holes to be accommodated across the face of the clip, the holes may be some 1.1 to 1.4 m diameter.
  • the hole size is determined by the wire size to be used; the larger size would-be used for twisted pairs. Obviously there may be any convenient number of holes through the clips, with the width being chosen accordingly.
  • Figure 2 shows a second form of clip
  • Figure 2A is a section through it.
  • the clip is in the form of a pair of parallel plates joined by a central pillar 32, effectively forming a slot around the sides of the clip.
  • An auxiliary wire of appropriate size can be pushed in between the two plates. The wire will automatically be held in place if it passes round the clip and changes direction. If a wire has a straight run past several of these clips, it can be held in place by giving it a slight zig-zag, passing it alternately to the right and left of the clips, or by slightly offsetting the clips to the right and left alternately.
  • the corners of the upper plate 30 preferably have slight downward extensions 33, which will hold a wire of the appropriate size in place in the clip once it has been pushed into the clip.
  • the clips of Figure 2 can be placed on the PCB either with the edges aligned with the edges of the PCB or with a 45° turn.
  • FIG 3 shows a third form of clip 40.
  • This has a central generally vertical slot 41 for receiving the auxiliary wires; the sides of this slot have matching corrugations so that if several wires are placed in their clip, they are held at predetermined heights.
  • the slot 41 is open at its upper end; this opening 42 is offset to the side of the clip so that the clip can be picked up by an automatic placement machine using a vacuum pick-up.
  • the clip has a closed channel 44 below the slot 41 , as shown, performing a weakening function to make it easier for the sides of the slot 41 to be pushed apart while a wire is being inserted.
  • This form of clip can be made to accommodate a larger number of wires than the Figure 1 or Figure 2 forms without taking up a lot of space on the PCB.
  • two or more vertical slots can be provided side by side, to multiply the wore capacity.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Une carte à circuit imprimé type se compose d'un substrat isolant (10) avec des pistes conductives imprimées (14) et de divers composants électriques/électroniques associés (11) (circuits integrés et/ou à composants discrets). Une fois que la carte de circuit imprimée a été élaborée, il peut être nécessaire de la modifier en ajoutant des connexions. Souvent, cette opération est réalisée en rajoutant des fils auxiliaires (22, 23). Ces derniers sont généralement collés à la carte, à certains intervalles, de manière à ce qu'ils restent contre la carte sur toute leur longueur. Selon ladite invention, des clips (20) en matière plastique résistant à la chaleur sont fixés sur la carte, lesdits clips (20) servant à retenir les fils auxiliaires. Ces clips (20) peuvent être rajoutés manuellement, ou automatiquement en même temps que les autres composants de la carte à circuit imprimé. Comme l'illustre le dessin, lesdits clips peuvent être pourvus de trous (21) ou de rainures horizontales ou verticales dans lesquelles on peut engager les fils auxiliaires.
PCT/US1993/001516 1992-02-07 1993-02-05 Cablage auxiliaire de cartes a circuit imprime WO1993016576A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE920421A IE920421A1 (en) 1992-02-07 1992-02-07 Added wiring on printed circuit boards
IE920421 1992-02-07

Publications (1)

Publication Number Publication Date
WO1993016576A1 true WO1993016576A1 (fr) 1993-08-19

Family

ID=11039566

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1993/001516 WO1993016576A1 (fr) 1992-02-07 1993-02-05 Cablage auxiliaire de cartes a circuit imprime

Country Status (3)

Country Link
AU (1) AU3726993A (fr)
IE (1) IE920421A1 (fr)
WO (1) WO1993016576A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1725089A1 (fr) * 2005-04-28 2006-11-22 Kitagawa Industries Co., Ltd. Borne

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH84521A (de) * 1919-06-20 1920-03-16 Adolphus Eoll Formstück für Kabelkanäle
US3944719A (en) * 1972-12-26 1976-03-16 United Wiring And Manufacturing Co. Wire routing apparatus
US4294008A (en) * 1979-06-27 1981-10-13 Western Electric Company, Inc. Methods of manufacturing and securing tubular wire-retaining anchors to circuit boards
EP0284757A1 (fr) * 1987-03-23 1988-10-05 Siemens Aktiengesellschaft Plaque de circuit
DE3831394A1 (de) * 1988-09-15 1990-03-22 Prithwis Basu Verfahren und vorrichtung zum kontaktieren eines elektrischen leitungsdrahtes mit kontaktstellen auf einer leiterplatte

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH84521A (de) * 1919-06-20 1920-03-16 Adolphus Eoll Formstück für Kabelkanäle
US3944719A (en) * 1972-12-26 1976-03-16 United Wiring And Manufacturing Co. Wire routing apparatus
US4294008A (en) * 1979-06-27 1981-10-13 Western Electric Company, Inc. Methods of manufacturing and securing tubular wire-retaining anchors to circuit boards
EP0284757A1 (fr) * 1987-03-23 1988-10-05 Siemens Aktiengesellschaft Plaque de circuit
DE3831394A1 (de) * 1988-09-15 1990-03-22 Prithwis Basu Verfahren und vorrichtung zum kontaktieren eines elektrischen leitungsdrahtes mit kontaktstellen auf einer leiterplatte

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1725089A1 (fr) * 2005-04-28 2006-11-22 Kitagawa Industries Co., Ltd. Borne
US7387281B2 (en) 2005-04-28 2008-06-17 Kitagawa Industries Co., Ltd. Clamp

Also Published As

Publication number Publication date
IE920421A1 (en) 1993-08-11
AU3726993A (en) 1993-09-03

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