WO1993015142A1 - Composite dissipant l'electricite statique - Google Patents

Composite dissipant l'electricite statique Download PDF

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Publication number
WO1993015142A1
WO1993015142A1 PCT/US1992/006805 US9206805W WO9315142A1 WO 1993015142 A1 WO1993015142 A1 WO 1993015142A1 US 9206805 W US9206805 W US 9206805W WO 9315142 A1 WO9315142 A1 WO 9315142A1
Authority
WO
WIPO (PCT)
Prior art keywords
package
heat
film
composite
metal foil
Prior art date
Application number
PCT/US1992/006805
Other languages
English (en)
Inventor
Hua-Feng Huang
Original Assignee
E.I. Du Pont De Nemours And Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/873,178 external-priority patent/US5376446A/en
Application filed by E.I. Du Pont De Nemours And Company filed Critical E.I. Du Pont De Nemours And Company
Priority to EP92918535A priority Critical patent/EP0625171A1/fr
Priority to JP5513174A priority patent/JPH07506384A/ja
Publication of WO1993015142A1 publication Critical patent/WO1993015142A1/fr
Priority to KR1019940702652A priority patent/KR950700356A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an electrically dissipative composite free of any blowing agent and consisting essentially of 97.5-95.5 wt % ionically cross-linked thermoplastic polymer and 2.5-4.5 wt % electroconductive carbon powder having a surface area of 1000-1500 m 2 /gm and a pore volume of 480-510 ml/100 gm.
  • the invention relates to an electrically dissipative package comprising a continuous, heat-sealable, flexible sheet of the above composite and optionally, a continuous layer of metal foil. In packages comprising a composite layer and a metal foil layer, the composite layer is adhered to the face of the metal foil layer that constitutes the inner surface of the package.
  • a carbon weight percent in the composite of less than 5 likewise has a surface resistivity greater than the 10 5 to lO 1 ⁇ ohms per square range.
  • an ionomer resin is compounded with 2.5-4.5 wt % of the carbon powder of this invention, particularly Ketjenblack® EC600 D
  • the two components work together to enable better control of the surface resistivity of the final-blend non-foamed film (e.g., 0.5 mil-5 mils) to within the static dissipative range (e.g., 10 5 to 10 12 ohms per square, more preferably 10 ⁇ to lO 1 ⁇ ohms per square at or below an ambient humidity of 12%) .
  • Carbon particle emission and transfer when rubbed against a clean surface is also substantially reduced. It was surprising that the ionomer/carbon compositions of the invention had such advantageous properties in the absence of element
  • the ionomer/foil laminate was fed through the laminator a second time and preheated in the drying tunnel at 100°F (37.8°C).
  • the preheated laminate was further heated by the chrome-surface hot-roll (heated by 190°F (87.8°C) circulating oil) with the foil side contacting the hot-roll and laminated with the carbon/ionomer blended film made in Example I on the Teflon®-covered rubber nip roll side.
  • the nip pressure used was 100 psi.
  • the laminate was then chilled (45°F (7.2 C) chill roll temperature) and wound-up.
  • the film and laminate speed was 25 feet per minute. The web tension was again kept low.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Textile Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention se rapporte à un composite d'emballage dissipant l'électricité statique, résistant à l'huile et thermoscellable, qui se compose essentiellement de 95,5 à 97,5 % en poids d'ionomères et de 4,5 à 2,5 % en poids de poudre de carbone électroconductrice ayant une surface de 1000 à 1500 m2/g et un volume de pore de 480 à 510 ml/100 g. Le composite est utile dans les emballages de protection de composants et d'ensembles électroniques sensibles, électrostatiques.
PCT/US1992/006805 1992-02-03 1992-08-20 Composite dissipant l'electricite statique WO1993015142A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP92918535A EP0625171A1 (fr) 1992-02-03 1992-08-20 Composite dissipant l'electricite statique
JP5513174A JPH07506384A (ja) 1992-04-24 1992-08-20 電気放散性複合物
KR1019940702652A KR950700356A (ko) 1992-04-24 1994-08-02 전기 소산성 복합체(Electrically dissipative composite)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US9200830 1992-02-03
ATPCT/US92/00830 1992-02-03
US873,178 1992-04-24
US07/873,178 US5376446A (en) 1991-02-01 1992-04-24 Electrically dissipative composite

Publications (1)

Publication Number Publication Date
WO1993015142A1 true WO1993015142A1 (fr) 1993-08-05

Family

ID=26784605

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/006805 WO1993015142A1 (fr) 1992-02-03 1992-08-20 Composite dissipant l'electricite statique

Country Status (3)

Country Link
EP (1) EP0625171A1 (fr)
CA (1) CA2129443A1 (fr)
WO (1) WO1993015142A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1140476A1 (fr) * 1999-05-07 2001-10-10 Static Control Components, Inc. Blindage electrostatique, film etanche a faible retention de charge
WO2006042903A2 (fr) * 2004-10-20 2006-04-27 Ionphase Oy Materiau d'emballage

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0219315A2 (fr) * 1985-10-09 1987-04-22 Minnesota Mining And Manufacturing Company Matériau antistatique en feuille, emballage et procédé de fabrication
EP0419274A2 (fr) * 1989-09-21 1991-03-27 Dupont-Mitsui Polychemicals Co., Ltd. Composition ionomère

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0219315A2 (fr) * 1985-10-09 1987-04-22 Minnesota Mining And Manufacturing Company Matériau antistatique en feuille, emballage et procédé de fabrication
EP0419274A2 (fr) * 1989-09-21 1991-03-27 Dupont-Mitsui Polychemicals Co., Ltd. Composition ionomère

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Derwent Accession No. 90-287 686 (38), Questel Telesytems (WPIL), Derwent Publications Ltd., London, *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1140476A1 (fr) * 1999-05-07 2001-10-10 Static Control Components, Inc. Blindage electrostatique, film etanche a faible retention de charge
EP1140476A4 (fr) * 1999-05-07 2004-12-01 Static Control Components Inc Blindage electrostatique, film etanche a faible retention de charge
WO2006042903A2 (fr) * 2004-10-20 2006-04-27 Ionphase Oy Materiau d'emballage
WO2006042903A3 (fr) * 2004-10-20 2006-08-31 Ionphase Oy Materiau d'emballage

Also Published As

Publication number Publication date
EP0625171A1 (fr) 1994-11-23
CA2129443A1 (fr) 1993-08-04

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