WO1991016472A1 - Verfahren zur steuerung von metallabscheidungsbädern - Google Patents
Verfahren zur steuerung von metallabscheidungsbädern Download PDFInfo
- Publication number
- WO1991016472A1 WO1991016472A1 PCT/DE1991/000312 DE9100312W WO9116472A1 WO 1991016472 A1 WO1991016472 A1 WO 1991016472A1 DE 9100312 W DE9100312 W DE 9100312W WO 9116472 A1 WO9116472 A1 WO 9116472A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- charge
- deposition
- electrolyte
- measured
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001465 metallisation Methods 0.000 title claims abstract description 13
- 239000010453 quartz Substances 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000007791 liquid phase Substances 0.000 claims abstract description 4
- 239000003792 electrolyte Substances 0.000 claims description 19
- 239000013078 crystal Substances 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 12
- 238000011065 in-situ storage Methods 0.000 claims description 8
- 238000004090 dissolution Methods 0.000 claims description 7
- 238000005137 deposition process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 241000080590 Niso Species 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000002484 cyclic voltammetry Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
- 238000000840 electrochemical analysis Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 238000012625 in-situ measurement Methods 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000012088 reference solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
- G01N29/032—Analysing fluids by measuring attenuation of acoustic waves
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/011—Velocity or travel time
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/018—Impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02818—Density, viscosity
Definitions
- Control parameters that are developed from the bulk phase of the electrolyte have so far been preferred for monitoring galvanic and electroless metal deposition baths. This means the tracking of process-relevant bath parameters via wet chemical, instrumental-analytical and physical measurement methods. On the basis of these measurement data, the dosages required for process control are carried out.
- a monitoring method for galvanic baths is known from DE-OS 30 43 066, in which the concentration of a bath substance is determined continuously or intermittently by measuring the electrical conductivity, the density or the refractive index.
- Cyclic voltammetry can be used to check the content of organic additives in galvanic baths; please refer .
- DAHMS continuous monitoring of acidic copper electrolytes by cyclic voltammetry, Metall Chemistry 43, 345 (1989).
- impedance and mixed potential measurements have been successfully used to control copper baths without external current. These methods are electrochemical test methods and contain in-situ information about the surface process.
- independent variables such as mass, charge, impedance, elastic coating properties and viscosity of the liquid phase (electrolyte) by means of in-situ measurements using a detector (oscillating quartz crystal), and in particular in the case of continuous registration of mass changes to determine at least one or more of the quantities mentioned and to use the information obtained in this way about layer properties and the electrolyte to control the metallization process.
- quartz crystal surface which is in contact with the electrolyte, is also the working electrode of the electrolytic cell, and in addition to changes in mass, other electrochemical in-situ variables such as charge flow and impedance can also be measured.
- this methodological approach is also suitable for tracking the elastic surface properties of the deposited coatings or the viscosity of the electrolyte.
- the (texture-dependent) surface tension or expressed as a synonym, the elastic coating properties as a function of the layer thickness, K.E. HEUSLER et al. , Ber. Bunsenges. Phys. Chem. 92, (1988), 1218 and H. SP ⁇ HN, Metall Chemistry, 16, (1962), 109.
- the metal film can be removed either chemically or in-situ by applying a suitable potential.
- pulse technology can also be used as a measurement variant, i.e. H. the periodic switching on and off of the measuring probe.
- the measuring probe is an electrochemical cell with a classic three-electrode arrangement, see Figure 1.
- the control takes place via a potentiostat and a function generator.
- the working electrode of this system is the side of the quartz crystal facing the electrolyte. A change in mass at this electrode leads to a detuning of the resonance frequency of the quartz oscillator, which is measured via a frequency counter and fed to the small computer for processing.
- the charge is measured in the circuit between the counter electrode (CE) and working electrode (WE) using a coulometer.
- a voltage pulse is impressed on the measuring probe and evaluated together with the current response as a Fourier transformation.
- Elastic coating properties correlate with frequency detuning which result from the tension effects of these layers; the measurement is carried out by pressure compensation on the quartz crystal side facing away from the electrolyte. The surface tension can be calculated from these measurement data.
- the frequency detuning which results only from the electrolyte contact, is measured.
- the metallization process is carried out by appropriate
- the new control method is used for example at
- Frequency detuning is carried out as a function of the foreign mass assignment.
- the mass can optionally be registered with the other sizes mentioned.
- the measurement takes place with oscillating, mass sensitive
- Quartz crystals which can be coated on both sides with metal films and usually only one side of the
- Liquid contact will increase the sensitivity of the detection
- the process is based on the periodically repeated deposition and dissolution of the nickel / phosphor layers.
- the electroless (chemically reductive) deposition of nickel-phosphorus films takes place on the surface of the quartz crystal that is in contact with the electrolyte. From the detuning of the resonance frequency of the quartz crystal, the foreign mass assignment and thus the layer thickness and deposition speed can be directly determined. derive; G. SAUERBREY, Z. Phys. , 155, (1955), 206. - 6 -
- the coated side of the quartz crystal is switched as a working electrode in the three-electrode arrangement.
- the anodic dissolution takes place by means of a potential that is constant over time or a potential ramp.
- the chemical composition of the nickel-phosphorus layer can be determined by simultaneously registering the electrical charge converted during this process and the change in mass. The following reaction is used:
- the chemical composition of the layer can be inferred from the ratio of charge to mass change ( ⁇ Q. / ⁇ m).
- step two of the method possible either in the deposition electrolyte or in any other, for example indifferent, electrolyte.
- an electrolyte becomes the composition
- a nickel-phosphorus layer is also deposited from a bath of the composition mentioned in Example 1 at temperatures between 86-90 ° C. at a pH of 4.8 after the addition of 5 ⁇ 10 mol / 1 thiourea.
- the current-voltage curves of the anodic dissolution show a strong change compared to the layers that were deposited from a bath without addition ( Figure 5).
- the current-voltage curves can be correlated with data on corrosion resistance, which are obtained from independent tests (such as salt spray test, "Kesternich test"). It is shown that the nickel-phosphorus alloys which are deposited from baths with additions of thiourea or other sulfur homologues have significantly poorer corrosion resistance.
- compositions of chemical-reductive nickel baths which can be monitored and controlled using the described method are listed in Examples 3-6.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Acoustics & Sound (AREA)
- Health & Medical Sciences (AREA)
- Automation & Control Theory (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19904012556 DE4012556C1 (enrdf_load_stackoverflow) | 1990-04-17 | 1990-04-17 | |
DEP4012556.4 | 1990-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1991016472A1 true WO1991016472A1 (de) | 1991-10-31 |
Family
ID=6404698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1991/000312 WO1991016472A1 (de) | 1990-04-17 | 1991-04-12 | Verfahren zur steuerung von metallabscheidungsbädern |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE4012556C1 (enrdf_load_stackoverflow) |
WO (1) | WO1991016472A1 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0564780A1 (en) * | 1992-04-06 | 1993-10-13 | Shipley Company Inc. | Methods and apparatus for maintaining electroless plating solutions |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19636492C2 (de) * | 1996-09-09 | 1999-01-21 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Überwachung und Steuerung der flächigen galvanischen Abscheidung dicker Schichten auf elektrisch leitfähigen flexiblen Substraten |
DE10043560B4 (de) * | 2000-09-01 | 2004-05-06 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Herstellung einer Metallschicht |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU831857A1 (ru) * | 1979-11-30 | 1981-05-23 | Белорусский Ордена Трудовогокрасного Знамени Политехническийинститут | Установка дл контрол толщиныпОКРыТи пРи ХиМичЕСКОМ НиКЕли-РОВАНии |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4353933A (en) * | 1979-11-14 | 1982-10-12 | C. Uyemura & Co., Ltd. | Method for controlling electroless plating bath |
-
1990
- 1990-04-17 DE DE19904012556 patent/DE4012556C1/de not_active Expired - Lifetime
-
1991
- 1991-04-12 WO PCT/DE1991/000312 patent/WO1991016472A1/de unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU831857A1 (ru) * | 1979-11-30 | 1981-05-23 | Белорусский Ордена Трудовогокрасного Знамени Политехническийинститут | Установка дл контрол толщиныпОКРыТи пРи ХиМичЕСКОМ НиКЕли-РОВАНии |
Non-Patent Citations (2)
Title |
---|
Extended Abstracts, Fall Meeting, Honolulu, Hawaii, 87-2, Oktober 18-23, 1987 A.J. Ricco et al.: "Acoustic wave electroless deposition monitor", Seiten 711-712 * |
Soviet Inventions Illustrated, Derwent Publications Ltd, Sektie "Chemical", Woche E-11, 28. April 1982, Zusammenfassung Nr. 21433 & SU-A-831857 (BELORUSSIAN POLY) 23. Mai 1981 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0564780A1 (en) * | 1992-04-06 | 1993-10-13 | Shipley Company Inc. | Methods and apparatus for maintaining electroless plating solutions |
US5484626A (en) * | 1992-04-06 | 1996-01-16 | Shipley Company L.L.C. | Methods and apparatus for maintaining electroless plating solutions |
Also Published As
Publication number | Publication date |
---|---|
DE4012556C1 (enrdf_load_stackoverflow) | 1991-12-05 |
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