WO1990006208A1 - Jonction de materiaux - Google Patents

Jonction de materiaux Download PDF

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Publication number
WO1990006208A1
WO1990006208A1 PCT/US1989/005276 US8905276W WO9006208A1 WO 1990006208 A1 WO1990006208 A1 WO 1990006208A1 US 8905276 W US8905276 W US 8905276W WO 9006208 A1 WO9006208 A1 WO 9006208A1
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WIPO (PCT)
Prior art keywords
bonding
joint
dynamic
stresses
grading
Prior art date
Application number
PCT/US1989/005276
Other languages
English (en)
Inventor
Chou H. Li
Original Assignee
Li Chou H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/277,666 external-priority patent/US4890783A/en
Application filed by Li Chou H filed Critical Li Chou H
Publication of WO1990006208A1 publication Critical patent/WO1990006208A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • C—CHEMISTRY; METALLURGY
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1057—Reactive infiltration
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/08—Making alloys containing metallic or non-metallic fibres or filaments by contacting the fibres or filaments with molten metal, e.g. by infiltrating the fibres or filaments placed in a mould
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/122—Metallic interlayers based on refractory metals
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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    • C04B2237/124—Metallic interlayers based on copper
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/363—Carbon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/595—Aspects relating to the structure of the interlayer whereby the interlayer is continuous, but heterogeneous on macro-scale, e.g. one part of the interlayer being a joining material, another part being an electrode material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/61—Joining two substrates of which at least one is porous by infiltrating the porous substrate with a liquid, such as a molten metal, causing bonding of the two substrates, e.g. joining two porous carbon substrates by infiltrating with molten silicon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2204/00—End product comprising different layers, coatings or parts of cermet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • This invention relates to ceramic-metal joining, and more particularly relates to ceramic-metal joining with uniform ceramic metallizing compositions and specially graded seals to make reproducibly strong and thermomechanically shock-resistant joints.
  • a serious problem with present ceramic metallizing methods is the difficulty of achieving uniform metallized layers formed on the ceramic.
  • the commonly used heavy metal processes such as W-yttria (W-Y 2 O 3 ), W-Fe, or Mo-Mn.
  • W-yttria W-Y 2 O 3
  • W-Fe W-Fe
  • Mo-Mn Mo-Mn
  • segregation of the mixed metal or other powders takes place due to their differing specific gravities, shapes, sizes, porosities, and surface smoothness. These segregations occur at all times: during the mixing of the powders, storing of the powder suspensions, application of the suspensions, settling of the suspended powder particles after the application, and drying of the applied layer. Further, these segregations occur so fast as to be practically uncontrollable, as will be shown shortly.
  • the time to completely settle out is only 147 ms (milliseconds) for W powders, if uniform acceleration is assumed.
  • the complete settling time of these same W powders is merely 25.4 ms, while on a horizontally painted or sprayed layer 0.1 cm thick, the same settling time is only 14.7 ms.
  • the complete settling time for the Y 2 O 3 powders is always the square root of 930.8/767.0, i.e., 1.21 times or 21% longer.
  • powder segregations with uniform accelerations may be completed within 147 to 14.7 ms.
  • the metallized surface may contain loose and unmetallized spots with high content of heavy refractory metal, and also non-wettable spots due to high flux content. The entire process is critical and involved, and yet nonuniform.
  • the resultant ceramic-metal joints or ceramic coatings on metals are weak, costly, nonreproducible, and usually not vacuum-tight, or temperature-resistant.
  • a second important problem with common joining processes is the lack of control, or even understanding, of dynamic mismatches of temperature, stress, and strain profiles in the joint region, and their variations with time.
  • Another aspect of this invention is therefore to describe such dynamic mismatch phenomena, and to specially tailor-grade the composition and/or physical property profiles of the joint region so that the maximum or critical transient mismatch stresses never exceed the local material strength at any point inside the joint region, at any time during the heating or cooling of such joints in processing or service.
  • an object of this invention is to provide improved ceramic-metal joints and joining methods
  • a further object of this invention is to provide improved ceramic metallizing methods for these joints
  • a broad object of this invention is to minimize gravitational segregations of the components in the metallizing methods prior to the joining;
  • Another broad object of the invention is to specially tailor-grade the composition and/or property profiles in the joint regions to ensure that the maximum dynamic or transient stresses do not exceed the local material strengths at any point and time.
  • the present invention provides a method for improving the reliability of a ceramic-metal or other joint between two similar or dissimilar solid materials against dynamic mismatch stresses due to temperature differentials and differing thermal expansions during nonuniforra dynamic heating or cooling of the joint.
  • This method comprises grading the thermal conductivity, thermal expansion coefficient, and/or softness or shock- absorbing ability of the bonding metal layer.
  • the grading is done laterally or in directions parallel to the bonding interfacial region, rather than axially or normally of the interfacial region as to the thermal expansion coefficient alone for commonly reducing static thermal mismatch stresses.
  • Fig. 1 is a top view showing the ceramic end of the joint.
  • Fig. 2 is a cross-section view of the joint taken along the cross-section line 2-2 of Fig. 1.
  • the small sphere settling in the fluid or suspension medium is acted on by the downward force of gravity with gravitational constant g, ⁇ D 3 d p g/6; and by the upward buoyant force of the fluid, ⁇ D 3 d m g/6 , giyen by Archimedes' principle.
  • the resultant net gravitational force G is ⁇ D 3 (d p -d m )g/6 actinn downward, producing a downward acceleration, a.
  • v (1 - exp(-R t /M)) x v f ;
  • the settling distance at time t is:
  • the powders in the mixed oxide processes e.g., WC 3 -Fe 2 C 3
  • the WO 3 -Fe 2 O 3 process shows density and velocity constant ratios of 1.366 and 1.455, vs 2.459 and 2.674, respectively, for the W-Fe process.
  • replacing the metal powders by their respective oxides reduces the differences in the ratios of velocity constants, v c , and final velocities, v f , from 48.2 % to only 9.0 % and 19.2 % to 4.2 %, respectively.
  • the metal particles, i.e., W, Fe, Mo, and Mn when reduced by hydrogen during metallizing from their respective oxides are smaller than the initial oxide powders. These smaller sizes further promote uniform metallizing results.
  • the final settling velocities of the two mixed powders, v f 's come only after some settling time, t s , when a specific amount, Q, of the mixed powders has already settled out at differing velocities.
  • the settled amount Q and material use efficiency at this settling time, t s can be computed from the materials remaining after t s .
  • the materials already settled before t s is the presettled distances, s t , multiplied by the initial material densities.
  • the already settled materials are, however, not lost, since they can be recirculated and reused in subsequent metallizing runs.
  • the best mixed-powder metallizing process for combined metallizing uniformity and material use efficiency can be determined. Basedon these principles, method and equipment can be developed for controlling the turn-on time for starting to deposit the mixed powder at a nearly equal final settling velocity, v f , into metallizing layers with the size-ratioed powders.
  • solution metallizing is ideal.
  • One difficulty of metallizing MACOR, Corning Glass's machinable glass ceramic, by the solutionmethod is the relatively low, allowable metallizing temperature of about 950°C.
  • the solubilities of the metallizing compounds are also restricting factors.
  • many potential metallizing compounds are soluble or at least partly soluble.
  • Zinc chloride and sodium molybdate, for example, are soluble up to 432 and 65 grams, respectively, per 100 cc of cold water.
  • Such a mixed solution may be used for MACOR or other ceramics.
  • thermal expansion coefficients and differentials relate only to the static or equilibrium case, and may not truly represent dynamic or transient conditions when the joint is unevenly being heated up or cooled down. Such transient conditions often exist during the processing and services of the joint.
  • the dynamic mismatch in thermal expansion coefficients is no constant, but varies with the bonded material shapes and sizes, physical and surface properties, and heating or cooling conditions and times.
  • the dynamic expansion strain mismatch may exceed the yield point of the ceramic materials, while the dynamic mismatch stress may exceed the flexure or even comprehensive strengths of these same materials.
  • What fails most ceramic-metal joints is the dynamic, rather than the static, thermal expansion mismatch.
  • the ceramic may be, for example, Corning Glass's machinable glass ceramic (MACOR)
  • the metal may be SAE 1010 carbon steel.
  • the joint is brazed at 950°C and is, for the worst-case condition, suddenly air quenched in a room-temperature (20°C) ambient.
  • the cooling down of a MACOR-metal joint from the brazing to room temperatures represents one of the most severe thermal changes, because of the wide temperature range involved.
  • linear thermal expansion coefficients are defined as the thermal expansion per unit length per unit degree Centigrade. As given in the literature, they refer only to the static case. For a given material, these coefficients are constants in given temperature ranges. Within these ranges, they do not depend on specimen geometries, sizes, diffusivities surface characteristics, heating or cooling conditions, and initial and final temperatures.
  • e m f m x ⁇ u m .
  • dynamic thermal expansion coefficients, f*, and the resultant dynamic mismatch strains, e*, and stresses, s strongly depend on the joint materials, geometries, sizes, physical and surface properties, and heating or cooling conditions.
  • ⁇ e* f s x ⁇ u s - f m x ⁇ u m .
  • the total dynamic coefficient mismatch over the temperature range of 930°C far exceeds the maximum of 100 ppm considered allowable by Hagy and Ritland. According to their criterion, cooling only a few degrees would cause failures.
  • the steel specimen has thus shrunk from unit length to 1 - f s x ⁇ u g , while the MACOR to 1 - f m x ⁇ u m .
  • the steel has shrunk more than MACOR, since both f s and ⁇ u s are greater than f m and A u m, respectively.
  • the originally stress-free but overshrunk steel must be stretched with dynamic tensile stress s s * by the adjoining MACOR, to length y from length 1 - f s x ⁇ u s.
  • the undershrunk MACOR must be compressed with dynamic compressive stress s m * by the steel, to the same length y from length of 1 - f m x ⁇ u m .
  • E m is the Young's modulus of MACOR, i.e., 5,000,000 psi
  • Measures must therefore be taken to reduce the dynamic mismatch stresses on the relatively weak ceramic or one of the similar materials so that the ceramic or this one material is no longer subjected to the high stresses. This reduction can be achieved by, e.g., reducing the temperature differential or absorbing a major portion of the dynamic mismatch stresses normally present in the ceramic through the use of a soft, yieldable metallic braze. These measures prevent the brazed joint failures particularly from these dynamic mismatch stresses. This is because residual or actual mismatch stress between the two joined materials is the theoretical mismatch stress with a portion thereof absorbed in the metallized or brazed layer.
  • the thermal expansion' coefficient of-the braze layer to minimize direct mechanical interaction between the two materials.
  • This axial grading practiced alone, is old.
  • the first two methods are achieved by providing a novel composite metallic braze disc used for joining the metallized ceramic cylinder 11 to the metal cylinder 12 to form the joint 10.
  • the ceramic cylinder has a metallized layer 13 at its lower end.
  • the composite braze disc has a soft, pure copper central core 14 within the opening of an outer harder copper alloy (e.g., 70:30 Zn Cartridge brass) ring or washer 15.
  • the entire metallized layer 13 and the composite braze disc 14 and washer 15 form the joint 10 or bonding interfacial region.
  • the linear thermal expansion coefficient of pure copper is 16.5 ppm/°C, while that of 70 Cu:30 Zn Cartridge brass is 19.9 ppm/°C.
  • the tensile strength of the brazing-annealed, soft pure copper is only 15,000 psi (1,055 kg/mm 2 ), while that of the 70:30 Cartridge brass is over 40,000 psi (2,812 kg/mm 2 ), or about three times greater.
  • the outer peripheral regions of the braze disc is made of relatively highly expansive but the low thermal-conducting brass. At these peripheral regions, the mismatch temperature differentials are relative small. The higher tensile strength is even desirable at the peripheral regions to enhance the joint strength.
  • This composite braze disc design will thus provide the required radially tailor-graded profiles of braze composition, thermal expansion coefficient, braze softness, and thermal conductivity needed to overcome the critical dynamic mismatch stresses in, e.g., the preforms for electronic device packages.
  • the composite braze discs can be made by, for example, metallurgically cladding; or mechanical press-forming a sphere and a washer, at least two layers or two tubes, or other combinations together into a single layer.
  • Elemental interdiffusion during the braze manufacture, brazing operation, or special pre- or post-brazing heat- treatments can modify or provide any reasonable composition profiling in the braze discs for even improved results.
  • the single-step metallizing-brazing step can be done at temperatures as low as about 800°C. If all these measures still do not prevent dynamic thermal mismatch failures, the common axial elemental grading or sudden composition changes may be added.
  • One method consists of providing a disc of low-expansive metals such as Sylvania #4, Dumet, 50% nickel alloy, chrome-iron stainless, platinum, Sealmet, and titanium placed intermediately between the steel and the copper braze. In this way, the ceramic MACOR is mechanically isolated from the highly expansive steel.
  • the desired axial elemental profiling can also be achieved through controlled diffusion.
  • Skilled persons can, of course, select other soft metals such as gold, silver, tin, lead, indium, zinc, or even iron or nickel, or other materials to replace copper, and select other chemical elements to replace the copper-strengthening zinc (or tin).
  • the resultant new alloys will, of course, be different in compositions, strengths, softnesses, or shock-absorbing abilities, diffusivities, thermal conductivities, melting or softening points, and other properties.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

Un procédé permet d'améliorer la fiabilité d'un joint métallo-céramique par réduction du déséquilibre entre les efforts et les contraintes dynamiques subis par le matériau céramique en raison de la différence entre les températures dynamiques et entre les dilatations thermiques des deux matériaux. A cet effet, on unit le matériau céramique au matériau métallique avec une couche métallique de façon à former une région de liaison entre le matériau céramique (11) et le matériau métallique (12); puis on fait varier graduellement, latéralement (14, 15) ou parallèlement à cette région de liaison, la conductivité thermique, le coefficient de dilatation thermique ou la malléabilité de la couche métallique. L'invention concerne également un disque composite métallique de liaison à variation graduelle latérale qui sert à résoudre des problèmes causés par une différence importante entre les efforts et contraintes dynamiques dans, par exemple, des boîtiers de dispositifs électroniques.
PCT/US1989/005276 1988-11-29 1989-11-28 Jonction de materiaux WO1990006208A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US277,666 1988-11-29
US07/277,666 US4890783A (en) 1988-11-29 1988-11-29 Ceramic-metal joining
US27767288A 1988-12-14 1988-12-14
US277,672 1988-12-14

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WO1990006208A1 true WO1990006208A1 (fr) 1990-06-14

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10348336A1 (de) * 2003-10-17 2005-05-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mechatronisches System sowie dessen Verwendung
CN110870098A (zh) * 2017-07-14 2020-03-06 日本电气株式会社 用于蓄电装置的袋状隔板、用于其的热结合方法和热结合装置以及蓄电装置

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JPS60231472A (ja) * 1984-04-26 1985-11-18 住友電気工業株式会社 セラミツクスと金属の接合体及びその接合方法
JPS60231471A (ja) * 1984-04-26 1985-11-18 住友電気工業株式会社 金属セラミツクス複合体
JPS60251179A (ja) * 1984-05-24 1985-12-11 三菱重工業株式会社 セラミツク部材と金属部材との接合方法
JPS6131368A (ja) * 1984-07-25 1986-02-13 住友電気工業株式会社 セラミツクスと金属の接合方法
JPS6153174A (ja) * 1984-08-24 1986-03-17 株式会社日立製作所 セラミツク接合用緩衝材
JPS61151070A (ja) * 1984-12-25 1986-07-09 有限会社　宮田技研 セラミツク部材の接合体
US4710235A (en) * 1984-03-05 1987-12-01 Dresser Industries, Inc. Process for preparation of liquid phase bonded amorphous materials
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Publication number Priority date Publication date Assignee Title
US3132044A (en) * 1957-11-19 1964-05-05 Varian Associates Metalized ceramic for bonding to metals
US3805372A (en) * 1970-12-21 1974-04-23 Krupp Ag Huettenwerke Method of manufacturing large rotatable members by welding
US4348131A (en) * 1979-05-09 1982-09-07 Hitachi, Ltd. Welded structure having improved mechanical strength and process for making same
JPS5895671A (ja) * 1981-11-30 1983-06-07 トヨタ自動車株式会社 セラミツクスと金属との接合方法
JPS5935075A (ja) * 1982-08-20 1984-02-25 東陶機器株式会社 セラミツクスと金属との接合方法
US4710235A (en) * 1984-03-05 1987-12-01 Dresser Industries, Inc. Process for preparation of liquid phase bonded amorphous materials
JPS60231471A (ja) * 1984-04-26 1985-11-18 住友電気工業株式会社 金属セラミツクス複合体
JPS60231472A (ja) * 1984-04-26 1985-11-18 住友電気工業株式会社 セラミツクスと金属の接合体及びその接合方法
JPS60251179A (ja) * 1984-05-24 1985-12-11 三菱重工業株式会社 セラミツク部材と金属部材との接合方法
JPS6131368A (ja) * 1984-07-25 1986-02-13 住友電気工業株式会社 セラミツクスと金属の接合方法
JPS6153174A (ja) * 1984-08-24 1986-03-17 株式会社日立製作所 セラミツク接合用緩衝材
JPS61151070A (ja) * 1984-12-25 1986-07-09 有限会社　宮田技研 セラミツク部材の接合体
US4757934A (en) * 1987-02-06 1988-07-19 Motorola, Inc. Low stress heat sinking for semiconductors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10348336A1 (de) * 2003-10-17 2005-05-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mechatronisches System sowie dessen Verwendung
CN110870098A (zh) * 2017-07-14 2020-03-06 日本电气株式会社 用于蓄电装置的袋状隔板、用于其的热结合方法和热结合装置以及蓄电装置

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