WO1988009598A1 - Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes - Google Patents

Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes Download PDF

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Publication number
WO1988009598A1
WO1988009598A1 PCT/CH1988/000090 CH8800090W WO8809598A1 WO 1988009598 A1 WO1988009598 A1 WO 1988009598A1 CH 8800090 W CH8800090 W CH 8800090W WO 8809598 A1 WO8809598 A1 WO 8809598A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic circuits
application
ink jet
circuits according
manufacturing electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH1988/000090
Other languages
English (en)
French (fr)
Inventor
Rino Doriguzzi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO1988009598A1 publication Critical patent/WO1988009598A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

Definitions

  • development consists in the development of a lay-out and then a photo-graphic film on a 1/1 scale which will be used for the production of screen-printing screens, the manufacturing being done by serigraphy on ceramic substrate, one per layer; the layers are then baked in an oven.
  • development consists in developing a lay-out and then a photographic plate on a 1/1 scale, one for each layer of different materials, the manufacturing being done by evaporation under vacuum on a ceramic substrate, one per layer followed by a selective chemical attack on each layer after having exposed a sensitive photo layer serving as a mask.
  • the development consists in the elaboration of a lay-out then of a photographic plate on the scale 1/1 which will be used in the manufacturing to expose a sensitive photo layer deposited on the support in gold material ⁇ ganique followed by a selective chemical attack.
  • Figure 1 gives the principle of manufacturing electronic circuits by ink jet according to the invention.
  • a pump 1 sends a very fine ink jet 2 which, while passing through the electro ⁇ of 3, is charged with static electricity. It then passes between two pairs of deflection electrodes VI and V2 for the vertical deflection, Hl and H2 for the horizontal deflection to finish on the substrate 4 which will constitute the electronic circuit.
  • the deflection of the ink jet by the deflection plates VI, V2, Hl and H2 is controlled by a computer 5.
  • inks necessary for the manufacture of hybrid electronic circuits printed by the method described above will be of several categories which depend on the support. For example, inks for hybrid circuits made on ceramic support are baked at high temperature: about 800 to 900 K, inks for hybrid circuits made on porcelain support are baked at medium temperature: about 600 ° K, inks for circuits prints made on organic support such as epoxy are cooked at low temperature: about 125 to 150 ° K,
  • the circuits can be made on substrates of any shape and large dimensions.
  • an inkjet device is less expensive than an automatic screen printer, a vacuum evaporator or a mask aligner.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
PCT/CH1988/000090 1987-05-19 1988-05-17 Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes Ceased WO1988009598A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH191287A CH673920A5 (cs) 1987-05-19 1987-05-19
CH1912/87-3 1987-05-19

Publications (1)

Publication Number Publication Date
WO1988009598A1 true WO1988009598A1 (fr) 1988-12-01

Family

ID=4221501

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1988/000090 Ceased WO1988009598A1 (fr) 1987-05-19 1988-05-17 Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes

Country Status (2)

Country Link
CH (1) CH673920A5 (cs)
WO (1) WO1988009598A1 (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718142A1 (fr) * 1994-03-31 1995-10-06 Toxot Science & Appl Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre.
WO1999053738A1 (de) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen
WO2001015504A1 (fr) * 1999-08-25 2001-03-01 Gemplus Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4003273B2 (ja) 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
GB2360489A (en) 2000-03-23 2001-09-26 Seiko Epson Corp Deposition of soluble materials
GB0030095D0 (en) * 2000-12-09 2001-01-24 Xaar Technology Ltd Method of ink jet printing
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
EP1672971B1 (en) * 2003-09-12 2017-11-01 National Institute of Advanced Industrial Science and Technology Method for manufacturing a substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986003366A1 (en) * 1984-11-24 1986-06-05 Plessey Overseas Limited Improvements relating to protectively coating electrical equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986003366A1 (en) * 1984-11-24 1986-06-05 Plessey Overseas Limited Improvements relating to protectively coating electrical equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, vol. 15, no. 9, fevrier 1973, E.P. Damm, Jr.: "Forming metallized patterns on ceramic substrates", pages 2841, 2842 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718142A1 (fr) * 1994-03-31 1995-10-06 Toxot Science & Appl Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre.
WO1999053738A1 (de) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen
WO2001015504A1 (fr) * 1999-08-25 2001-03-01 Gemplus Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede
FR2797976A1 (fr) * 1999-08-25 2001-03-02 Gemplus Card Int Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede

Also Published As

Publication number Publication date
CH673920A5 (cs) 1990-04-12

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