WO1988008171A1 - Support pour piece d'identite et procede de fabrication de ce support - Google Patents

Support pour piece d'identite et procede de fabrication de ce support Download PDF

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Publication number
WO1988008171A1
WO1988008171A1 PCT/CH1988/000023 CH8800023W WO8808171A1 WO 1988008171 A1 WO1988008171 A1 WO 1988008171A1 CH 8800023 W CH8800023 W CH 8800023W WO 8808171 A1 WO8808171 A1 WO 8808171A1
Authority
WO
WIPO (PCT)
Prior art keywords
band
carrier
plastic
die
recess
Prior art date
Application number
PCT/CH1988/000023
Other languages
German (de)
English (en)
Inventor
Alban Siegfried
Rudolf RÖCK
Walter Trächslin
Original Assignee
Lgz Landis & Gyr Zug Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lgz Landis & Gyr Zug Ag filed Critical Lgz Landis & Gyr Zug Ag
Publication of WO1988008171A1 publication Critical patent/WO1988008171A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a carrier of the type mentioned in the preamble of claim 1, as used for electronic ID cards or similar data carriers.
  • An electronic ID card shows that for credit cards. usual format and contains a semiconductor circuit whose information content can be read and / or changed in special signal processing devices.
  • the standardized coupling surfaces and the semiconductor circuit are purchased from a card manufacturer as ready-made units on a tape ready for installation.
  • the installation height of these units is approximately 0.5 mm and is therefore smaller than the thickness of the carrier of 0.76 mm.
  • a stepped recess with predetermined dimensions must not completely penetrate the carrier.
  • the front and back of the carrier must not have a bulge, as this makes the functioning of the standardized devices impossible.
  • the unit with the semiconductor circuit is inserted into the recess in the carrier and fastened, for example, by gluing.
  • Free surfaces of the card usually have a print with information of all kinds.
  • the unit with the semiconductor circuit against damage and position the unit precisely in the device. It consists of a stiff, dimensionally stable and impact-resistant material.
  • Carriers currently in use consist of a laminate of at least three foils a plastic with adhesive layers in between.
  • the recess in the carrier is produced in the predetermined shape by punching out recesses in at least two of the foils and by precisely aligning the foils during the joining process.
  • the invention has for its object to provide a permanent, stress-free, completely flat and dimensionally accurate carrier that is cheap with a simple process can be made.
  • FIG. 4 a second device for producing the carrier according to FIG. 2 in a cross section
  • FIG. 5 a third device for producing the carrier according to FIG. 2 in a cross section.
  • FIG. 1 shows schematically the cross section through a carrier 1, which is constructed according to the prior art. At least three individual foils 2 are glued to one another by means of intermediate adhesive layers and form adhesive joints 3.
  • a stepped recess 4 which is intended for receiving a semiconductor circuit and has predetermined dimensions, is formed on the top 5 of the carrier 1 by punching out a large recess 6 in a cover foil 7 and a smaller recess 8 in an underlying interlayer 9 before assembly and the subsequent precise gluing of the individual foils 2.
  • Inner sides 10 of the recess 4 therefore have a structure determined by the layering of the foils. The position and the dimensions of the recess 4 are predetermined and must be precisely observed.
  • the top 5 are completely flat except for the recess 4 and the back 11 of the carrier 1.
  • the embodiment of the carrier 1 according to the invention is shown in FIG. 2 in a cross section through the carrier 1.
  • the carrier 1 consists of a flat, solid body made of plastic, has the necessary recess 4 for receiving the semiconductor circuit and is z. B. generated by one of the methods of claims 4 to 10 or by injection molding.
  • the top 5 and the back 11 of the carrier 1 are completely flat even after the depression 4 has been produced.
  • the carrier 1 is not laminated, i.e. H. the inner sides 10 of the recess 4 have no adhesive joints 3 (FIG. 1) caused by the lamination.
  • the starting material of the carrier 1 (FIG. 3) is a thermoplastic plastic in the form of a band 12.
  • the thickness of the band 12 corresponds to the thickness of the carrier 1.
  • the thickness is 0.76 mm for cards according to ISO 2894.
  • the band 12 becomes performed in a press tool between a punch 13 and a plate 14.
  • the stamp 13 covers at least the entire surface 5 of the carrier 1 and has a raised die 15 with a negative of the depression 4 at the predetermined location, which can advantageously be displaced in the stamp.
  • the plastic is at least in the area of the recess 4, for example by means of the die 15, first heated to the range of the flow temperature and then molded under pressure, material 16 displaced by the die 15 from the area of the depression 4 at a predetermined point by a Ventilation duct 17, which is predetermined by the level of the necessary pressing pressure Dimension has escapes. After the plastic has solidified again, the pressing tool can be opened.
  • the position of the ventilation duct 17 depends on the design of the press tool. In particular, it is advantageous to also arrange the ventilation duct 17 in the plate 14 or to provide more than one ventilation duct 17.
  • Plastics that have a very high dielectric loss factor that increases with temperature such as B. polyamide-6, hard polyvinyl chloride, copolymers of polyvinyl chloride - vinyl acetate or other derivatives of polyvinyl chloride are particularly advantageous for the preparation of the carrier 1.
  • These plastics can be easily in the electromagnetic field between z. B. locally heat the die 15 and the plate 14 and bring it into the mold according to FIG. 2 by means of an extrusion process.
  • Electromagnetic fields used with preference have frequencies of 10 MHz and more.
  • the individual components of the pressing tool are used to generate and concentrate the electromagnetic field in the band 12 in between.
  • the design of the punch 13, the die 15 and the plate 14 is adapted to the method, and the band 12 is heated to an area that is necessary for the method.
  • the stamp 13 is advantageously produced from a low-loss dielectric.
  • the electrically conductive die 15 is slidably formed in the punch 13 and is connected to a first connection of a high-frequency source 18.
  • the electrically conductive plate 14 is connected with a second connection
  • the ventilation duct 17 is not required.
  • a hole 19 (FIG. 4) is punched into the band 12 at the point intended for the recess 4.
  • the amount of the material 16 displaced by the die 15 determines the dimension of the hole 19.
  • FIG. The band 12 with holes 19 is pushed forward by the distance between two holes 19 after each pressing operation.
  • the plastic located between the die 15 and the plate 14 is heated.
  • the die 15 deforms the flowable plastic. Since the cold plastic and the plate 14 held between the punch 13 and the plate 14 prevent the displaced material 16 from flowing away, the hole 19 is filled up and closed by the displaced material 16. After cooling, the press tool releases the belt 12 and the process is repeated.
  • a third embodiment of the method additionally allows the top side 5 of the carrier 1 to be designed.
  • the stamp 13 has at least the dimensions of the identification card. Raised on the surface of the stamp 13 are conceivable Markings 20 of numbers, lettering or even just a certain surface texture.
  • the die 15 is embedded in the punch 13.
  • the punch 13 is surrounded by a ring 21 which can be moved independently of the punch 13 and which lies lowered on the band 12 along the edge of the carrier 1.
  • the ring 21 is advantageously beveled downwards in a wedge shape and forms a cutting edge 22 as a bearing surface.
  • the ventilation duct 17 is let into the ring 21 at one point.
  • the ring 21 is first lowered onto the band 12 and the plastic located under the cutting edge 22 is heated.
  • the cutting edge 22 sinks into the band 1 to such an extent that a connecting skin 23 remains between the cutting edge 22 and the plate 14 with a thickness of a few hundredths of a millimeter.
  • the ring 21 encloses the plastic of the carrier 1 in the pressing tool.
  • the stamp 13 and the die 15 heat the enclosed plastic simultaneously or successively and press it into the predetermined shape of the carrier 1.
  • the depression 4 and any structure 24 determined by the markings 20 are formed on the top.
  • the excess, displaced material 16 escapes through the ventilation duct 17.
  • the pressing tool releases the carrier 1 connected to the band 12 by means of the thin connecting skin 23 for further processing.
  • band 12 Since in this process the band 12 is brought to the flow temperature within the ring 21, it is conceivable to use instead of one band 12 also several differently colored bands of the same material with a prescribed total thickness, which is necessary for the production of the carrier 1, to feed the press tool and to weld it over the entire carrier surface during the pressing process.
  • the use of a band 12 with holes 19 (FIG. 4) is also conceivable here.
  • the displaced material 16 (FIG. 5) fills the hole 19 located within the ring 21. If the dimension of the hole 19 is selected precisely, only displaced air and no material 16 escapes through the ventilation duct 17.
  • the carriers 1 can be produced individually or several at the same time in a multiple tool. Each of the methods is also suitable for repetitive production after a feed determined by the card dimensions after each pressing operation.
  • the carrier 1 can also be produced from cut plastic plates.
  • the supply of the Kunststoff ⁇ described in Volume 12 i ⁇ t only a vorteilhafte ⁇ method as an ⁇ chlie ⁇ send printing of the top side 5 and the rear side 11 and an insertion is simplified in the semiconductor circuit associated with the support band 12 1 prior to punching out '.
  • the solidification is advantageously accelerated by means of a cooling device.
  • a method with direct heating of the band 12 made of impact-resistant polyvinyl chloride by means of displacement currents allows cycle times of approximately 10 seconds. About half of this cycle time is used to heat the plastic to a flow temperature of at least 150 ° C. below the injection temperature of 220 ° C. and to mold the carrier 1. Cooling supported by an effective cooling device, the solidification of the plastic, that is Releasing the shaped carrier 1 and the tape feed require the remaining cycle time.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Le support massif (1) en forme de pièce d'identité est dépourvu de parties saillantes et présente une cavité (4) ayant des surfaces intérieures (10) exemptes de joints adhésifs (3) pour la réception d'un circuit à semi-conducteurs. Le support (1) est réalisé au moyen d'une presse d'extrusion et de découpage à partir d'une matière plastique en bande. Ces supports (1) sont économiques, plats et exemptes de contraintes internes.
PCT/CH1988/000023 1987-04-14 1988-02-02 Support pour piece d'identite et procede de fabrication de ce support WO1988008171A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1444/87-7 1987-04-14
CH144487A CH672285A5 (fr) 1987-04-14 1987-04-14

Publications (1)

Publication Number Publication Date
WO1988008171A1 true WO1988008171A1 (fr) 1988-10-20

Family

ID=4210606

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1988/000023 WO1988008171A1 (fr) 1987-04-14 1988-02-02 Support pour piece d'identite et procede de fabrication de ce support

Country Status (3)

Country Link
CH (1) CH672285A5 (fr)
ES (1) ES2007191A6 (fr)
WO (1) WO1988008171A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2650530A1 (fr) * 1989-08-07 1991-02-08 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2695854A1 (fr) * 1992-09-22 1994-03-25 Leroux Ets Gilles Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.
DE4241482A1 (de) * 1992-12-09 1994-06-16 Siemens Ag Verfahren und Einrichtung zur Herstellung von IC-Karten
DE4444788C2 (de) * 1994-12-15 1999-06-24 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen laminierter Chipkartenkörper
EP2074560B1 (fr) * 2007-10-05 2011-10-05 Smartrac IP B.V. Procédé de fabrication pour un insert transpondeur pour un document personnel

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19854986A1 (de) * 1998-11-27 2000-05-31 Giesecke & Devrient Gmbh Verfahren zur Herstellung ein- oder mehrschichtiger Karten mit in geschäumtem Kunststoff eingebetteten elektronischen Bauelementen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0128822A1 (fr) * 1983-06-09 1984-12-19 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
EP0132183A1 (fr) * 1983-06-29 1985-01-23 Sligos Procédé pour la fabrication de cartes à mémoire
EP0197847A1 (fr) * 1985-03-28 1986-10-15 Schlumberger Industries Procédé de fabrication de cartes à mémoire électronique et cartes obtenues suivant ledit procédé

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0128822A1 (fr) * 1983-06-09 1984-12-19 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
EP0132183A1 (fr) * 1983-06-29 1985-01-23 Sligos Procédé pour la fabrication de cartes à mémoire
EP0197847A1 (fr) * 1985-03-28 1986-10-15 Schlumberger Industries Procédé de fabrication de cartes à mémoire électronique et cartes obtenues suivant ledit procédé

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2650530A1 (fr) * 1989-08-07 1991-02-08 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
EP0412893A1 (fr) * 1989-08-07 1991-02-13 Schlumberger Industries Procédé de réalisation de corps de carte et de cartes à graphisme, et corps de carte ainsi obtenus
FR2695854A1 (fr) * 1992-09-22 1994-03-25 Leroux Ets Gilles Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.
EP0589771A1 (fr) 1992-09-22 1994-03-30 Gilles Leroux S.A. Dispositif de fabrication de cartes à puces
US5397426A (en) * 1992-09-22 1995-03-14 Giles Leroux, S.A. Device for producing smart cards
DE4241482A1 (de) * 1992-12-09 1994-06-16 Siemens Ag Verfahren und Einrichtung zur Herstellung von IC-Karten
DE4444788C2 (de) * 1994-12-15 1999-06-24 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen laminierter Chipkartenkörper
EP2074560B1 (fr) * 2007-10-05 2011-10-05 Smartrac IP B.V. Procédé de fabrication pour un insert transpondeur pour un document personnel
US8188867B2 (en) 2007-10-05 2012-05-29 Smartrac Ip B.V. Transponder inlay for a personal document and method for the production thereof

Also Published As

Publication number Publication date
ES2007191A6 (es) 1989-06-01
CH672285A5 (fr) 1989-11-15

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