WO1983001219A1 - Rotary table system with electrical and chemical processes for planing, lapping, polishing, grinding, fine grinding and plane grinding machines - Google Patents

Rotary table system with electrical and chemical processes for planing, lapping, polishing, grinding, fine grinding and plane grinding machines Download PDF

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Publication number
WO1983001219A1
WO1983001219A1 PCT/JP1981/000277 JP8100277W WO8301219A1 WO 1983001219 A1 WO1983001219 A1 WO 1983001219A1 JP 8100277 W JP8100277 W JP 8100277W WO 8301219 A1 WO8301219 A1 WO 8301219A1
Authority
WO
WIPO (PCT)
Prior art keywords
grinding
rotary table
lapping
polishing
electrical
Prior art date
Application number
PCT/JP1981/000277
Other languages
French (fr)
Japanese (ja)
Inventor
Ltd Shibayama Kikai Co.
Original Assignee
Ishimura, Yoshio
Kobayashi, Kajuo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishimura, Yoshio, Kobayashi, Kajuo filed Critical Ishimura, Yoshio
Priority to PCT/JP1981/000277 priority Critical patent/WO1983001219A1/en
Publication of WO1983001219A1 publication Critical patent/WO1983001219A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks

Definitions

  • Rotary single-table method including surface, lapping, polishing, gliding, fine riding, and electrical and chemical usage in flat grinders.
  • VTR computers, tape recorders, lasers-sound or communication such as applied devices, ff computing devices, etc.
  • ff computing devices has been remarkable.
  • the head of a tape recorder is from permalloy to ferrite or sendust
  • the semiconductor is from germanium to silicon
  • the circuit is from a transistor to an IC, LSI, or VLSI, ferrites such as S, 0, S, silicon, etc.
  • Development. Determining the degree of flatness, accuracy, and surface finish of these processing damages is the most important and basic processing method for commercializing them.
  • An object of the present invention is to provide a composite machine capable of performing ultra-precision machining of ultra-hard and ultra-brittle materials such as ferrite, silicon, sendust, ceramic, and super hard alloy.
  • 1 is a rotary table drive shaft.
  • 2 is a table pre-pied spring.
  • 3 is a mouthpiece.
  • 4 is a rotary table drive pin.
  • a table preload spring is used for a rotary table that is fixed to a rotary shaft 1 that supplies rotary power and that supplies rotation and imbalance to a workpiece.
  • the vertical runout which could only be suppressed to about / micron / micron with the conventional glaze, can be suppressed to / micron or less, and ultra-precision processing can be performed.
  • the use of a pre-loaded spring ⁇ in the head reduces vertical deflection and enables ultra-precision machining.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

This rotary table system can suppress the longitudinal fluctuation of a bearing to within one micron, which cannot be suppressed with a conventional bearing to less than 10 to 15 microns, by a table preload spring (3) for a rotary table (2) fixed to a rotary table driving shaft (1) for supplying the rotary force to rotate and move a workpiece.

Description

明 細 書  Specification
発明の名称  Title of invention
平面、 ラッピング、 ポリヅシング、 グライディング、 ファイングライディング及び、 平 面研削盤における電気的、 化学的用法を含むロータリ一テーブル方式。  Rotary single-table method including surface, lapping, polishing, gliding, fine riding, and electrical and chemical usage in flat grinders.
野  Field
- 最近の工業界の著しい発展により、 新材料及'び新しい機器も多数開発され近代的な機器 も多く発明されつつある。 特に V T R ヽ コンピューター、 テープレコーダ一、 レーザ —応用攛器等の音響又は通信、 ff算装置 0開発は著しく、 それぞれに応じた材料もそれに ともない開発されている。 例えばテープレコーダ一のへッドがパーマロイからフェラ イトやセンダストへ、 半導体がゲルマニュー厶からシリコンへ、 回路はトランジスターか ら I C、 L S I さらに V L S I や S, 0 , S 等のフェライト、 シリコン等への開発である。 これらの加工ダメージを微少に平担度、 精度、 面組さを出すことは、 これ等を製品化 せしめる上で最も重要かつ基礎的な加工方法である。  -With the recent remarkable development of the industry, many new materials and new equipment have been developed, and many modern equipment has been invented. In particular, VTR computers, tape recorders, lasers-sound or communication such as applied devices, ff computing devices, etc. The development of ff computing devices has been remarkable. For example, the head of a tape recorder is from permalloy to ferrite or sendust, the semiconductor is from germanium to silicon, and the circuit is from a transistor to an IC, LSI, or VLSI, ferrites such as S, 0, S, silicon, etc. Development. Determining the degree of flatness, accuracy, and surface finish of these processing damages is the most important and basic processing method for commercializing them.
前記のことから多目的、 多品種の用途材の精度向上は必須状件と考えられる。 そこ で最終工程の精度目的を達成する加工技術として、 複合的なマシーンを完成させる必要に せまられている。  From the above, it is considered essential to improve the accuracy of multipurpose and multi-product materials. Therefore, it is necessary to complete a complex machine as a processing technology to achieve the accuracy goal of the final process.
背景技術 Background art
昔はもっぱら手作業で行なはれ、 職人の熟線にたよっていたこれ等の加工が/ ？ /ヲ年 にアメリカで平面ラヅプ盤が発明されてから、 読いて各種の研削愨、 ラップ盤、 ポリッシ ング盤、 洗浄装置が出現し、 現在ではどんどん機械化が進んでいる。  In the past, this was done exclusively by hand, and was based on the skillful line of artisans. Since the invention of the flat lapping machine in the United States in 1975, various kinds of grinding machines, lapping machines, polishing machines, and cleaning devices have emerged, and are now being machined more and more.
発明の開示 Disclosure of the invention
本発明はフェライト、 シリコン、 センダスト、 セラミック、 超硬合会等の超硬度、 超ぜ い性材料を超精密加工を ^能とせる複合的マシーンを提供するにある。  An object of the present invention is to provide a composite machine capable of performing ultra-precision machining of ultra-hard and ultra-brittle materials such as ferrite, silicon, sendust, ceramic, and super hard alloy.
図面の簡単な説明 BRIEF DESCRIPTION OF THE FIGURES
OMPI 図は本発明の実施例を示すものであってその新面図を示す。 OMPI The drawings show an embodiment of the present invention and show a new view thereof.
1はロータリテーブル · ドライブシャフ卜 2はテーブルプリ π—ドスプリング 3は口 一タリテーブル 4はロータリテーブルドライブピンである。  1 is a rotary table drive shaft. 2 is a table pre-pied spring. 3 is a mouthpiece. 4 is a rotary table drive pin.
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
次いで図によって本発明を説明すれば、 回転カを俟給する口一タリテ一プルシャフト 1 に固定され、 被加工物に回転と違動とを洪給するロータリテーブル にテーブルプリロー ドスプリング を使甩することにより、 従来の釉受では/り〜 / ミクロン程度にしか抑 えられなかった縦ぶれが、 /ミクロン以 に抑えることが出来、 超精密加工をせしめるこ とが出来るもので、 このようにテ一プルプリロードスプリング βを使用することで縦ぶれ を抑え、 超精密加工を 能とせるものである。  Next, the present invention will be described with reference to the drawings. A table preload spring is used for a rotary table that is fixed to a rotary shaft 1 that supplies rotary power and that supplies rotation and imbalance to a workpiece. By doing so, the vertical runout, which could only be suppressed to about / micron / micron with the conventional glaze, can be suppressed to / micron or less, and ultra-precision processing can be performed. The use of a pre-loaded spring β in the head reduces vertical deflection and enables ultra-precision machining.
™上の莉用可能性 Possibility of ™ on
電子工学等の進歩にともない、 ますます超高精度の極超/ J、型電子部品 ο作れる高度の工 怍機械の必要性が増すもので、 その開発は目下の急務であり、 本発明の装置を提俟するこ とにより超硬度超ぜぃ性材料を使用する半導体、 V T R 、 コンビユタ一、 オーディオ等の 努展に宪分に寄与するものである。 '  With the advancement of electronics, etc., ultra-high precision ultra-high precision / J, type electronic parts ο The need for advanced engineering machines that can be made is increasing, and the development is urgently needed. This will contribute to the development of semiconductors, VTRs, convenience stores, audio equipment, etc. that use super-hard and super brittle materials. '
OMPI OMPI
V/IPO  V / IPO

Claims

—一― 3 一■  —One― Three one
請求の範西 Scope of claim
ロータリテーブル · ドライブシャフ卜に固定されるロータリテーブルに、 テーブルプリ ロードスプリングを使用することを特徴とせる、 平面、 ラッピング、 ポリツシング、 グラ イデイング、 ファイングライディング及び、 平面研削盤における電気的、 化学的用法を舍 むロータリ一テーブル方式。  Rotary table · The rotary table fixed to the drive shaft is characterized by using a table preload spring. Flat, lapping, polishing, grinding, finishing riding, and electrical and chemical usage in surface grinding machines. Rotary one-table system.
OMPI OMPI
\ΥΙ?ό  \ ΥΙ? Ό
PCT/JP1981/000277 1981-10-12 1981-10-12 Rotary table system with electrical and chemical processes for planing, lapping, polishing, grinding, fine grinding and plane grinding machines WO1983001219A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP1981/000277 WO1983001219A1 (en) 1981-10-12 1981-10-12 Rotary table system with electrical and chemical processes for planing, lapping, polishing, grinding, fine grinding and plane grinding machines

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1981/000277 WO1983001219A1 (en) 1981-10-12 1981-10-12 Rotary table system with electrical and chemical processes for planing, lapping, polishing, grinding, fine grinding and plane grinding machines

Publications (1)

Publication Number Publication Date
WO1983001219A1 true WO1983001219A1 (en) 1983-04-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1981/000277 WO1983001219A1 (en) 1981-10-12 1981-10-12 Rotary table system with electrical and chemical processes for planing, lapping, polishing, grinding, fine grinding and plane grinding machines

Country Status (1)

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WO (1) WO1983001219A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB981499A (en) * 1962-04-25 1965-01-27 Wotan Werke Gmbh Clamping table for a machine tool
JPS5319213B2 (en) * 1972-10-20 1978-06-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB981499A (en) * 1962-04-25 1965-01-27 Wotan Werke Gmbh Clamping table for a machine tool
JPS5319213B2 (en) * 1972-10-20 1978-06-20

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