WO1981000071A1 - Procede de brasage doux sans residu provenant du flux - Google Patents

Procede de brasage doux sans residu provenant du flux Download PDF

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Publication number
WO1981000071A1
WO1981000071A1 PCT/JP1980/000145 JP8000145W WO8100071A1 WO 1981000071 A1 WO1981000071 A1 WO 1981000071A1 JP 8000145 W JP8000145 W JP 8000145W WO 8100071 A1 WO8100071 A1 WO 8100071A1
Authority
WO
WIPO (PCT)
Prior art keywords
brazing
soft
flux
residue
solvent
Prior art date
Application number
PCT/JP1980/000145
Other languages
English (en)
Japanese (ja)
Inventor
I Kawakatsu
Original Assignee
I Kawakatsu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by I Kawakatsu filed Critical I Kawakatsu
Publication of WO1981000071A1 publication Critical patent/WO1981000071A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/386—Selection of media, e.g. special atmospheres for surrounding the working area for condensation soldering

Definitions

  • the bonding material (hereinafter referred to as “base material”) is first subjected to pretreatment such as pickling and degreasing, and then to an inorganic flux such as an inorganic halide or an inorganic acid, or rosin.
  • an inorganic flux such as an inorganic halide or an inorganic acid, or rosin.
  • Activated rosin to which an organic halogen activator is added is used as a flux, and then soft solder is heated and melted at the joints to perform soft brazing.
  • the process of soft brazing by the flux inevitably results in the residue generated by the thermal reaction of the flux being deposited on the base material. This residue generally induces significant corrosion after brazing, and is a major obstacle to the reliability of the softened part, such as hygroscopicity, poor insulation, and mold.
  • the present invention no residue due to the reaction of any flux or the like remains on the surface of the base material after soft brazing, and therefore, no post-treatment of residue removal is required. There is no danger of other obstacles.
  • the surface of the base metal and the surface of the soft solder do not oxidize or contaminate at all, and maintain their original gloss.
  • a soft solder is placed on the joint of the assembly part composed of the base material, and heated in a vapor of a solvent generated from a solvent that is easily vaporized. Melting and inflow of soft solder to perform soft brazing.
  • the solvent of the present invention refers to a liquid organic compound having a boiling point of 30 ° C.
  • the joining mechanism at this time is as follows: (1) The oxidizing atmosphere is replaced with solvent vapor, and the atmosphere is made non-oxidizing. (2) The solvent vapor in the gaseous phase has a certain degree of activity, that is, it reduces the oxidized layer on the base metal surface and the soft solder surface by a reducing action and at the same time lowers the surface tension of the soft solder droplets. It is thought to cause wetting.
  • Base material is pure copper (Cu), brass (BS), tin plate (tin-plated iron plate), pure nickel (i), tin (Sn) 50 ⁇ -I & (Pb) 50% as soft solder, tin (Sn ) 60?
  • Cu pure copper
  • BS brass
  • tin plate tin-plated iron plate
  • Kisire Kisire
  • Vv'IP Soft brazing was carried out using nine kinds of diethyl hexanol and a mixture of methyl alcohol and trichlene.
  • the solvent is heated to a temperature several degrees to about 10 degrees higher than its boiling point in a container, and the sample to be soft-brazed in the generated steam from a small nozzle. insert.
  • the brazing temperature was heated on a small electric heater equipped with a sample, and the brazing temperature was measured with a thermocouple.
  • the shape of the sample to be brazed is a square plate with a thickness of 0.320 inch x 20 mm, and the soft brazing material is a disk-shaped material of 0.1 .gr3 ⁇ 0.
  • Example 1 Example 1
  • a 60% Sn—Pb 40 ⁇ soft solder was brazed on a pure copper plate.
  • the solvent was benzene with a boiling point of 80.1 ° C and an ignition point of 550 ° C.
  • the brazing temperature was 200 ° C and the spread area was 12.5 o! / Gr.
  • Example 1 On a pure copper plate, soft solder of 60% Sn-40% Pb was brazed. Solvent is methylhexanol, boiling point 180. Using C, a spreading area of 6.17 ⁇ gr was obtained at a brazing temperature of 260.
  • Example 1 1.
  • soft brazing was performed using Sn 60% —; Pb 40% soft solder.
  • the solvent used is 95% methyl alcohol and 5% sodium chloride, and the brazing temperature is 200.
  • the spread area was 10.3 c ⁇ Zgr.
  • the bonding strength of the soft brazing in the present invention has the same strength as ordinary soft brazing. As described above, the soft brazing method of the present invention was possible even when the base material, the soft brazing material, and the solvent were changed.
  • the present invention does not produce any corrosive products or residues due to the reaction of flux or the like, and therefore has the characteristics that no post-treatment is required, the appearance is kept clean after brazing, and no deterioration occurs. At the same time, it is capable of performing pollution-free operations.
  • soft brazing is an important process that is indispensable for production as an industrial product that is widely applied to a wide variety of applications such as heat exchangers, piping, and electrical connection of electrical and electronic components.
  • the work is performed using a flux.However, as described above, it is difficult to remove the residue after brazing, and at the same time, this causes corrosion. That is the biggest drawback.
  • the present invention is a very effective method in the field of joining by means of soft brazing, including heat exchangers and electric and electronic components.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un procede de brasage doux d'un article consiste a placer un metal d'apport de brasage sur l'article et a braser l'article a l'aide d'un dispositif de chauffage approprie dans une vapeur de solvant vaporisable. Aucun produit residuel ou autre ne reste sur la surface de l'article. L'article brase possede un brillant attrayant car il se trouve dans un etat non-oxyde, sans risque de corrosion ni de deterioration.
PCT/JP1980/000145 1979-06-27 1980-06-25 Procede de brasage doux sans residu provenant du flux WO1981000071A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8012579A JPS564397A (en) 1979-06-27 1979-06-27 Soft brazing method of not producing any residue by flux
JP79/80125 1979-06-27

Publications (1)

Publication Number Publication Date
WO1981000071A1 true WO1981000071A1 (fr) 1981-01-22

Family

ID=13709484

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1980/000145 WO1981000071A1 (fr) 1979-06-27 1980-06-25 Procede de brasage doux sans residu provenant du flux

Country Status (2)

Country Link
JP (1) JPS564397A (fr)
WO (1) WO1981000071A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0292454A (ja) * 1988-09-30 1990-04-03 Kanto Yakin Kogyo Kk 雰囲気熱処理方法
AU625442B2 (en) * 1988-11-28 1992-07-09 Furukawa Aluminum Co., Ltd. Gaseous phase brazing method of al or al alloy
JPH0751274B2 (ja) * 1990-09-07 1995-06-05 昭和アルミニウム株式会社 アルミニウム材のろう付方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707762A (en) * 1970-10-29 1973-01-02 North American Rockwell Methods of using fluxes in joining metal surfaces
SU259619A1 (ru) * 1965-12-07 1977-02-25 Способ диффузионной сварки
US4119262A (en) * 1977-07-05 1978-10-10 Ford Motor Company Method of joining metal, particularly aluminum or aluminum alloys, using bromine fluxing agent

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU259619A1 (ru) * 1965-12-07 1977-02-25 Способ диффузионной сварки
US3707762A (en) * 1970-10-29 1973-01-02 North American Rockwell Methods of using fluxes in joining metal surfaces
US4119262A (en) * 1977-07-05 1978-10-10 Ford Motor Company Method of joining metal, particularly aluminum or aluminum alloys, using bromine fluxing agent

Also Published As

Publication number Publication date
JPS564397A (en) 1981-01-17

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