USD993201S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD993201S1 USD993201S1 US29/806,373 US202129806373F USD993201S US D993201 S1 USD993201 S1 US D993201S1 US 202129806373 F US202129806373 F US 202129806373F US D993201 S USD993201 S US D993201S
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- US
- United States
- Prior art keywords
- semiconductor module
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- semiconductor
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-004834D | 2021-03-09 | ||
| JPD2021-4834F JP1695980S (cs) | 2021-03-09 | 2021-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD993201S1 true USD993201S1 (en) | 2023-07-25 |
Family
ID=77847548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/806,373 Active USD993201S1 (en) | 2021-03-09 | 2021-09-02 | Semiconductor module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD993201S1 (cs) |
| JP (1) | JP1695980S (cs) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
| USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
| USD1082726S1 (en) * | 2020-12-02 | 2025-07-08 | Murata Manufacturing Co., Ltd. | Common mode choke coil |
| USD1082727S1 (en) * | 2020-12-02 | 2025-07-08 | Murata Manufacturing Co., Ltd. | Common mode choke coil |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1577511S (cs) | 2016-11-15 | 2017-05-29 | ||
| JP1580899S (cs) | 2016-11-15 | 2017-07-10 | ||
| US10068871B2 (en) * | 2016-04-12 | 2018-09-04 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US20190333885A1 (en) * | 2016-05-02 | 2019-10-31 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| US20200365497A1 (en) * | 2019-05-13 | 2020-11-19 | Rohm Co., Ltd. | Semiconductor device |
| US10930615B2 (en) * | 2018-05-10 | 2021-02-23 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
| US10985030B2 (en) * | 2018-11-19 | 2021-04-20 | Rohm Co., Ltd | Method for manufacturing semiconductor device |
| US11257777B2 (en) * | 2018-11-07 | 2022-02-22 | Rohm Co., Ltd. | Semiconductor device |
| US11373935B2 (en) * | 2016-02-15 | 2022-06-28 | Rohm Co., Ltd. | Semiconductor package with plurality of leads and sealing resin |
| US11417623B2 (en) * | 2019-03-29 | 2022-08-16 | Rohm Co., Ltd. | Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer |
| US11538936B2 (en) * | 2020-03-04 | 2022-12-27 | Rohm Co., Ltd. | Semiconductor device |
-
2021
- 2021-03-09 JP JPD2021-4834F patent/JP1695980S/ja active Active
- 2021-09-02 US US29/806,373 patent/USD993201S1/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11373935B2 (en) * | 2016-02-15 | 2022-06-28 | Rohm Co., Ltd. | Semiconductor package with plurality of leads and sealing resin |
| US10068871B2 (en) * | 2016-04-12 | 2018-09-04 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US20190333885A1 (en) * | 2016-05-02 | 2019-10-31 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP1580899S (cs) | 2016-11-15 | 2017-07-10 | ||
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| JP1577511S (cs) | 2016-11-15 | 2017-05-29 | ||
| US10930615B2 (en) * | 2018-05-10 | 2021-02-23 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
| US11257777B2 (en) * | 2018-11-07 | 2022-02-22 | Rohm Co., Ltd. | Semiconductor device |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| US10985030B2 (en) * | 2018-11-19 | 2021-04-20 | Rohm Co., Ltd | Method for manufacturing semiconductor device |
| US11417623B2 (en) * | 2019-03-29 | 2022-08-16 | Rohm Co., Ltd. | Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer |
| US20200365497A1 (en) * | 2019-05-13 | 2020-11-19 | Rohm Co., Ltd. | Semiconductor device |
| US11538936B2 (en) * | 2020-03-04 | 2022-12-27 | Rohm Co., Ltd. | Semiconductor device |
Non-Patent Citations (1)
| Title |
|---|
| Rohm semiconductor UT6MA3, dated Sep. 18, 2015, [online], [site visited Mar. 23, 2023]. Available from Internet, URL: https://fscdn.rohm.com/en/products/databook/datasheet/discrete/transistor/mosfet/ut6ma3tcr-e.pdf (Year: 2015). * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1082726S1 (en) * | 2020-12-02 | 2025-07-08 | Murata Manufacturing Co., Ltd. | Common mode choke coil |
| USD1082727S1 (en) * | 2020-12-02 | 2025-07-08 | Murata Manufacturing Co., Ltd. | Common mode choke coil |
| USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
| USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1695980S (cs) | 2021-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |