USD981970S1 - Substrate mounting plate for substrate processing apparatus - Google Patents
Substrate mounting plate for substrate processing apparatus Download PDFInfo
- Publication number
- USD981970S1 USD981970S1 US29/806,527 US202129806527F USD981970S US D981970 S1 USD981970 S1 US D981970S1 US 202129806527 F US202129806527 F US 202129806527F US D981970 S USD981970 S US D981970S
- Authority
- US
- United States
- Prior art keywords
- substrate
- processing apparatus
- mounting plate
- substrate processing
- substrate mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Description
Claims (1)
- The ornamental design for a substrate mounting plate for substrate processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2021-4536F JP1700776S (en) | 2021-03-04 | 2021-03-04 | |
JP2021-004536D | 2021-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD981970S1 true USD981970S1 (en) | 2023-03-28 |
Family
ID=78766342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/806,527 Active USD981970S1 (en) | 2021-03-04 | 2021-09-03 | Substrate mounting plate for substrate processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD981970S1 (en) |
JP (1) | JP1700776S (en) |
TW (1) | TWD217375S (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1002336S1 (en) * | 2022-02-07 | 2023-10-24 | Christopher L. Moore | Anode mounting plate |
USD1022667S1 (en) * | 2023-12-21 | 2024-04-16 | Guangdong Yupin Industrial Co., Ltd | Cover plate |
USD1041002S1 (en) * | 2020-02-21 | 2024-09-03 | American Sterilizer Company | Mounting plate |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
USD790041S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD869409S1 (en) * | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
-
2021
- 2021-03-04 JP JPD2021-4536F patent/JP1700776S/ja active Active
- 2021-08-20 TW TW110304382F patent/TWD217375S/en unknown
- 2021-09-03 US US29/806,527 patent/USD981970S1/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD790041S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
USD869409S1 (en) * | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1041002S1 (en) * | 2020-02-21 | 2024-09-03 | American Sterilizer Company | Mounting plate |
USD1002336S1 (en) * | 2022-02-07 | 2023-10-24 | Christopher L. Moore | Anode mounting plate |
USD1022667S1 (en) * | 2023-12-21 | 2024-04-16 | Guangdong Yupin Industrial Co., Ltd | Cover plate |
Also Published As
Publication number | Publication date |
---|---|
JP1700776S (en) | 2021-11-29 |
TWD217375S (en) | 2022-02-21 |
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Legal Events
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---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |