USD981970S1 - Substrate mounting plate for substrate processing apparatus - Google Patents

Substrate mounting plate for substrate processing apparatus Download PDF

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Publication number
USD981970S1
USD981970S1 US29/806,527 US202129806527F USD981970S US D981970 S1 USD981970 S1 US D981970S1 US 202129806527 F US202129806527 F US 202129806527F US D981970 S USD981970 S US D981970S
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US
United States
Prior art keywords
substrate
processing apparatus
mounting plate
substrate processing
substrate mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/806,527
Inventor
Tetsuaki Inada
Takeshi Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
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Kokusai Electric Corp
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Filing date
Publication date
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INADA, TETSUAKI, YASUI, TAKESHI
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Description

FIG. 1 is a front, top and right side perspective view of a substrate mounting plate for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view.
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is a view take along line 8-8 in FIG. 2 .

Claims (1)

    CLAIM
  1. The ornamental design for a substrate mounting plate for substrate processing apparatus, as shown and described.
US29/806,527 2021-03-04 2021-09-03 Substrate mounting plate for substrate processing apparatus Active USD981970S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021004536F JP1700776S (en) 2021-03-04 2021-03-04 Substrate placement plate for substrate processing apparatus
JP2021-004536D 2021-03-04

Publications (1)

Publication Number Publication Date
USD981970S1 true USD981970S1 (en) 2023-03-28

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ID=78766342

Family Applications (1)

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US29/806,527 Active USD981970S1 (en) 2021-03-04 2021-09-03 Substrate mounting plate for substrate processing apparatus

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US (1) USD981970S1 (en)
JP (1) JP1700776S (en)
TW (1) TWD217375S (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1002336S1 (en) * 2022-02-07 2023-10-24 Christopher L. Moore Anode mounting plate
USD1022667S1 (en) * 2023-12-21 2024-04-16 Guangdong Yupin Industrial Co., Ltd Cover plate
USD1041002S1 (en) * 2020-02-21 2024-09-03 American Sterilizer Company Mounting plate
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
TWD237530S (en) 2023-07-07 2025-04-11 美商塔沙Ｓｍｄ公司 (美國) Sputtering target
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1086086S1 (en) * 2021-10-01 2025-07-29 Kokusai Electric Corporation Separator of substrate processing apparatus
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1088815S1 (en) * 2019-12-20 2025-08-19 Sphero, Inc. Mounting plate
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD583394S1 (en) * 2006-12-15 2008-12-23 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20100108500A1 (en) * 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD583394S1 (en) * 2006-12-15 2008-12-23 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20100108500A1 (en) * 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1088815S1 (en) * 2019-12-20 2025-08-19 Sphero, Inc. Mounting plate
USD1041002S1 (en) * 2020-02-21 2024-09-03 American Sterilizer Company Mounting plate
USD1086086S1 (en) * 2021-10-01 2025-07-29 Kokusai Electric Corporation Separator of substrate processing apparatus
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1002336S1 (en) * 2022-02-07 2023-10-24 Christopher L. Moore Anode mounting plate
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1073758S1 (en) * 2022-10-13 2025-05-06 Lam Research Corporation Baffle for substrate processing system
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
TWD237530S (en) 2023-07-07 2025-04-11 美商塔沙Ｓｍｄ公司 (美國) Sputtering target
TWD241950S (en) 2023-07-07 2025-12-11 美商塔沙Ｓｍｄ公司 (美國) Sputtering target
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications
USD1022667S1 (en) * 2023-12-21 2024-04-16 Guangdong Yupin Industrial Co., Ltd Cover plate

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Publication number Publication date
TWD217375S (en) 2022-02-21
JP1700776S (en) 2021-11-29

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