USD946540S1 - Temporary protective film for manufacturing semiconductor devices - Google Patents

Temporary protective film for manufacturing semiconductor devices Download PDF

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Publication number
USD946540S1
USD946540S1 US35/355,127 US35512768F USD946540S US D946540 S1 USD946540 S1 US D946540S1 US 35512768 F US35512768 F US 35512768F US D946540 S USD946540 S US D946540S
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Prior art keywords
semiconductor devices
protective film
manufacturing semiconductor
temporary protective
article
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Active
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US35/355,127
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Inventor
Naoki Tomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to SHOWA DENKO MATERIALS CO., LTD. reassignment SHOWA DENKO MATERIALS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOMORI, NAOKI
Application granted granted Critical
Publication of USD946540S1 publication Critical patent/USD946540S1/en
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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US35/355,127 2020-11-02 2021-04-22 Temporary protective film for manufacturing semiconductor devices Active USD946540S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2020-23696F JP1685752S (enrdf_load_html_response) 2020-11-02 2020-11-02
JP2020-023696D 2020-11-02

Publications (1)

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USD946540S1 true USD946540S1 (en) 2022-03-22

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ID=75966648

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US35/355,127 Active USD946540S1 (en) 2020-11-02 2021-04-22 Temporary protective film for manufacturing semiconductor devices

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JP (1) JP1685752S (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD998577S1 (en) * 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) * 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) * 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2694533A (en) * 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US2699251A (en) * 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US4983932A (en) * 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
US7669631B2 (en) * 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20100080989A1 (en) * 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD847258S1 (en) * 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) * 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2699251A (en) * 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US2694533A (en) * 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US4983932A (en) * 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US7669631B2 (en) * 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
US20100080989A1 (en) * 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD689831S1 (en) * 2010-10-15 2013-09-17 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD690278S1 (en) * 2010-10-15 2013-09-24 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD847258S1 (en) * 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Back-grinding tape with heat resistance is for special heating process after wafer grinding", Nov. 6, 2021 (cited in an office action dated Nov. 9, 2021 in Design U.S. Appl. No. 35/512,766).
"Disposal . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-temperature-water-soluble-plastic-film-for-mold-release.html. *
"Establishing . . . " reference dated Sep. 13, 2018 found by RMS on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html. *
"RD Series . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.mc.showadenko.com/english/products/pm/015.html. *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD998577S1 (en) * 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) * 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

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