USD859331S1 - Vacuum contact pad - Google Patents
Vacuum contact pad Download PDFInfo
- Publication number
- USD859331S1 USD859331S1 US29/611,219 US201729611219F USD859331S US D859331 S1 USD859331 S1 US D859331S1 US 201729611219 F US201729611219 F US 201729611219F US D859331 S USD859331 S US D859331S
- Authority
- US
- United States
- Prior art keywords
- contact pad
- vacuum contact
- vacuum
- view
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken line showing of the environment forms no part of the claimed design.
Claims (1)
- The ornamental design for a vacuum contact pad, as shown and described.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-6855F JP1587815S (en) | 2017-03-31 | 2017-03-31 | |
| JP2017006854 | 2017-03-31 | ||
| JP2017-006854 | 2017-03-31 | ||
| JP2017-006855 | 2017-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD859331S1 true USD859331S1 (en) | 2019-09-10 |
Family
ID=67809934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/611,219 Active USD859331S1 (en) | 2017-03-31 | 2017-07-19 | Vacuum contact pad |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD859331S1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD913977S1 (en) * | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD980177S1 (en) * | 2020-09-24 | 2023-03-07 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
| USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
| USD1049528S1 (en) * | 2023-03-29 | 2024-10-29 | Irobot Corporation | Cleaning pad for use in a mobile cleaning robot |
| USD1051530S1 (en) * | 2023-03-29 | 2024-11-12 | Irobot Corporation | Drip tray for use with a mobile cleaning robot |
| USD1072399S1 (en) | 2023-03-15 | 2025-04-22 | Irobot Corporation | Cleaning pad |
| USD1091033S1 (en) | 2023-03-09 | 2025-08-26 | Irobot Corporation | Drip tray for use with a mobile cleaning robot |
| USD1100395S1 (en) * | 2024-08-08 | 2025-10-28 | Beijing Roborock Technology Co., Ltd. | Side mop for cleaning robot |
Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5374829A (en) * | 1990-05-07 | 1994-12-20 | Canon Kabushiki Kaisha | Vacuum chuck |
| US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
| US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
| US6257564B1 (en) * | 1998-05-15 | 2001-07-10 | Applied Materials, Inc | Vacuum chuck having vacuum-nipples wafer support |
| US6729947B1 (en) * | 2002-11-04 | 2004-05-04 | Texas Instruments Incorporated | Semiconductor wafer handler |
| US20040179323A1 (en) * | 2003-03-11 | 2004-09-16 | Alon Litman | Electrostatic chuck for wafer metrology and inspection equipment |
| US20050035514A1 (en) * | 2003-08-11 | 2005-02-17 | Supercritical Systems, Inc. | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| US20070063453A1 (en) * | 2004-03-25 | 2007-03-22 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
| US20080051018A1 (en) * | 2004-03-16 | 2008-02-28 | Texas Instruments Incorporated | Semiconductor Wafer Handler |
| US20090179365A1 (en) * | 2008-01-15 | 2009-07-16 | Lerner Alexander N | High temperature vacuum chuck assembly |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| US20100117279A1 (en) * | 2006-11-27 | 2010-05-13 | Camtek Ltd. | Supporting system and a method for supporting an object |
| USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
| USD650344S1 (en) * | 2008-10-20 | 2011-12-13 | Ebara Corporation | Vacuum contact pad |
| USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD790489S1 (en) * | 2015-07-08 | 2017-06-27 | Ebara Corporation | Vacuum contact pad |
| USD825504S1 (en) * | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD837755S1 (en) * | 2015-04-16 | 2019-01-08 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
-
2017
- 2017-07-19 US US29/611,219 patent/USD859331S1/en active Active
Patent Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5374829A (en) * | 1990-05-07 | 1994-12-20 | Canon Kabushiki Kaisha | Vacuum chuck |
| US6257564B1 (en) * | 1998-05-15 | 2001-07-10 | Applied Materials, Inc | Vacuum chuck having vacuum-nipples wafer support |
| US6164633A (en) * | 1999-05-18 | 2000-12-26 | International Business Machines Corporation | Multiple size wafer vacuum chuck |
| US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
| US6729947B1 (en) * | 2002-11-04 | 2004-05-04 | Texas Instruments Incorporated | Semiconductor wafer handler |
| US20040179323A1 (en) * | 2003-03-11 | 2004-09-16 | Alon Litman | Electrostatic chuck for wafer metrology and inspection equipment |
| US20050035514A1 (en) * | 2003-08-11 | 2005-02-17 | Supercritical Systems, Inc. | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| US20080051018A1 (en) * | 2004-03-16 | 2008-02-28 | Texas Instruments Incorporated | Semiconductor Wafer Handler |
| US20070063453A1 (en) * | 2004-03-25 | 2007-03-22 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
| US20100117279A1 (en) * | 2006-11-27 | 2010-05-13 | Camtek Ltd. | Supporting system and a method for supporting an object |
| US20090179365A1 (en) * | 2008-01-15 | 2009-07-16 | Lerner Alexander N | High temperature vacuum chuck assembly |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
| USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
| USD650344S1 (en) * | 2008-10-20 | 2011-12-13 | Ebara Corporation | Vacuum contact pad |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| USD837755S1 (en) * | 2015-04-16 | 2019-01-08 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD825504S1 (en) * | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD790489S1 (en) * | 2015-07-08 | 2017-06-27 | Ebara Corporation | Vacuum contact pad |
| USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD913977S1 (en) * | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
| USD980177S1 (en) * | 2020-09-24 | 2023-03-07 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
| USD1091033S1 (en) | 2023-03-09 | 2025-08-26 | Irobot Corporation | Drip tray for use with a mobile cleaning robot |
| USD1072399S1 (en) | 2023-03-15 | 2025-04-22 | Irobot Corporation | Cleaning pad |
| USD1049528S1 (en) * | 2023-03-29 | 2024-10-29 | Irobot Corporation | Cleaning pad for use in a mobile cleaning robot |
| USD1051530S1 (en) * | 2023-03-29 | 2024-11-12 | Irobot Corporation | Drip tray for use with a mobile cleaning robot |
| USD1100395S1 (en) * | 2024-08-08 | 2025-10-28 | Beijing Roborock Technology Co., Ltd. | Side mop for cleaning robot |
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