USD845568S1 - Pad holder for polishing apparatus - Google Patents

Pad holder for polishing apparatus Download PDF

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Publication number
USD845568S1
USD845568S1 US29/545,532 US201529545532F USD845568S US D845568 S1 USD845568 S1 US D845568S1 US 201529545532 F US201529545532 F US 201529545532F US D845568 S USD845568 S US D845568S
Authority
US
United States
Prior art keywords
polishing apparatus
pad holder
holder
pad
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/545,532
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English (en)
Inventor
Yu Ishii
Kenya Ito
Hirohiko Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHII, YU, UEDA, HIROHIKO, ITO, KENYA
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Publication of USD845568S1 publication Critical patent/USD845568S1/en
Active legal-status Critical Current
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US29/545,532 2015-05-14 2015-11-13 Pad holder for polishing apparatus Active USD845568S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2015-10517F JP1544543S (cs) 2015-05-14 2015-05-14
JP2015-010517 2015-05-14

Publications (1)

Publication Number Publication Date
USD845568S1 true USD845568S1 (en) 2019-04-09

Family

ID=55411950

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/545,532 Active USD845568S1 (en) 2015-05-14 2015-11-13 Pad holder for polishing apparatus

Country Status (2)

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US (1) USD845568S1 (cs)
JP (1) JP1544543S (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD917813S1 (en) * 2019-07-19 2021-04-27 Lg Electronics Inc. Watertube for drum type washing machine gaskets
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809385A (en) * 1987-12-14 1989-03-07 Bogue Larry D Floor polishing apparatus
USD583603S1 (en) * 2007-11-20 2008-12-30 Turnils Ab Core for slat material for venetian blinds
US8506363B2 (en) * 2008-12-25 2013-08-13 Ebara Corporation Substrate holder and substrate holding method
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD789478S1 (en) * 2015-10-13 2017-06-13 Mcp Ip, Llc Archery bow rotatable member
US9708724B2 (en) * 2014-02-25 2017-07-18 Ebara Corporation Anode unit and plating apparatus having such anode unit
USD794089S1 (en) * 2015-06-05 2017-08-08 Mtd Products Inc Wheel
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
US20170245721A1 (en) * 2017-05-14 2017-08-31 Gary Rudolph System, apparatus and method for delivering fluid to and from the bottom center of a floor-operation pad on a rotary-motion flooring machine during operation
USD799037S1 (en) * 2015-10-27 2017-10-03 OrthoGrid Systems, Inc Grid positioning device
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
US9842783B2 (en) * 2011-10-26 2017-12-12 Ebara Corporation Polishing method and polishing apparatus
US9919403B2 (en) * 2013-07-01 2018-03-20 Ebara Corporation Polishing apparatus, polishing pad positioning method, and polishing pad

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809385A (en) * 1987-12-14 1989-03-07 Bogue Larry D Floor polishing apparatus
USD583603S1 (en) * 2007-11-20 2008-12-30 Turnils Ab Core for slat material for venetian blinds
US8506363B2 (en) * 2008-12-25 2013-08-13 Ebara Corporation Substrate holder and substrate holding method
US9842783B2 (en) * 2011-10-26 2017-12-12 Ebara Corporation Polishing method and polishing apparatus
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
US9919403B2 (en) * 2013-07-01 2018-03-20 Ebara Corporation Polishing apparatus, polishing pad positioning method, and polishing pad
US9708724B2 (en) * 2014-02-25 2017-07-18 Ebara Corporation Anode unit and plating apparatus having such anode unit
USD794089S1 (en) * 2015-06-05 2017-08-08 Mtd Products Inc Wheel
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD789478S1 (en) * 2015-10-13 2017-06-13 Mcp Ip, Llc Archery bow rotatable member
USD799037S1 (en) * 2015-10-27 2017-10-03 OrthoGrid Systems, Inc Grid positioning device
US20170245721A1 (en) * 2017-05-14 2017-08-31 Gary Rudolph System, apparatus and method for delivering fluid to and from the bottom center of a floor-operation pad on a rotary-motion flooring machine during operation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD917813S1 (en) * 2019-07-19 2021-04-27 Lg Electronics Inc. Watertube for drum type washing machine gaskets
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Also Published As

Publication number Publication date
JP1544543S (cs) 2019-02-18

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