USD715747S1 - Cooling jacket - Google Patents

Cooling jacket Download PDF

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Publication number
USD715747S1
USD715747S1 US29/472,008 US201329472008F USD715747S US D715747 S1 USD715747 S1 US D715747S1 US 201329472008 F US201329472008 F US 201329472008F US D715747 S USD715747 S US D715747S
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US
United States
Prior art keywords
cooling jacket
view
showing
jacket
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/472,008
Inventor
Yuji Imoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IMOTO, YUJI
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Publication of USD715747S1 publication Critical patent/USD715747S1/en
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Description

FIG. 1 is a front, top, and left side perspective view of a cooling jacket, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view the left side view being a mirror image thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is reference view showing in use thereof.
The broken line showing of the environment in FIG. 7 is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a cooling jacket, as shown and described.
US29/472,008 2013-09-06 2013-11-07 Cooling jacket Active USD715747S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013020617 2013-09-06
JP2013-020617 2013-09-06

Publications (1)

Publication Number Publication Date
USD715747S1 true USD715747S1 (en) 2014-10-21

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US29/472,008 Active USD715747S1 (en) 2013-09-06 2013-11-07 Cooling jacket

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US (1) USD715747S1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
USD1094318S1 (en) * 2023-05-17 2025-09-23 Canaan Creative Co., Ltd. Cooling container for computing devices

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6397932B1 (en) * 2000-12-11 2002-06-04 Douglas P. Calaman Liquid-cooled heat sink with thermal jacket
US20060219388A1 (en) * 2005-03-31 2006-10-05 Shuichi Terakado Cooling jacket
US20090065178A1 (en) * 2005-04-21 2009-03-12 Nippon Light Metal Company, Ltd. Liquid cooling jacket
US20090129011A1 (en) * 2007-11-20 2009-05-21 Basic Electronics, Inc. Liquid cooled module
USD616378S1 (en) * 2009-06-18 2010-05-25 Foxsemicon Integrated Technology, Inc. Heat dissipation device
US20110188204A1 (en) * 2010-01-29 2011-08-04 Hitachi, Ltd. Semiconductor Power Module, Inverter/Converter Including the same, and Method of Manufacturing a Cooling Jacket for Semiconductor Power Module
USD684544S1 (en) * 2011-05-13 2013-06-18 Fuji Electric Co., Ltd. Cooling jacket for semiconductor device
US8627567B2 (en) * 2009-02-23 2014-01-14 Nippon Light Metal Company, Ltd. Manufacturing method of liquid-cooled jacket
US20140091453A1 (en) * 2012-10-02 2014-04-03 Kabushiki Kaisha Toyota Jidoshokki Cooling device and semiconductor device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6397932B1 (en) * 2000-12-11 2002-06-04 Douglas P. Calaman Liquid-cooled heat sink with thermal jacket
US20060219388A1 (en) * 2005-03-31 2006-10-05 Shuichi Terakado Cooling jacket
US20090065178A1 (en) * 2005-04-21 2009-03-12 Nippon Light Metal Company, Ltd. Liquid cooling jacket
US20090129011A1 (en) * 2007-11-20 2009-05-21 Basic Electronics, Inc. Liquid cooled module
US8627567B2 (en) * 2009-02-23 2014-01-14 Nippon Light Metal Company, Ltd. Manufacturing method of liquid-cooled jacket
US20140165399A1 (en) * 2009-02-23 2014-06-19 Nippon Light Metal Company, Ltd. Manufacturing method of liquid-cooled jacket
USD616378S1 (en) * 2009-06-18 2010-05-25 Foxsemicon Integrated Technology, Inc. Heat dissipation device
US20110188204A1 (en) * 2010-01-29 2011-08-04 Hitachi, Ltd. Semiconductor Power Module, Inverter/Converter Including the same, and Method of Manufacturing a Cooling Jacket for Semiconductor Power Module
USD684544S1 (en) * 2011-05-13 2013-06-18 Fuji Electric Co., Ltd. Cooling jacket for semiconductor device
US20140091453A1 (en) * 2012-10-02 2014-04-03 Kabushiki Kaisha Toyota Jidoshokki Cooling device and semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Shinichiro Adachi et al., "Application Technology for Direct Water Cooling IGBT Modules in Automotive", Fuji Electric Journal 2012, pp. 437, vol. 85, No. 6, English Abstract.
Takahisa Hitachi et al., "Direct Liquid Cooling IGBT Module for Automotive Applications", Fuji Electric Journal 2011, pp. 311, vol. 84, No. 5, English Abstract.

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD786806S1 (en) * 2015-09-26 2017-05-16 Ebullient, Inc. Heat sink module
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
USD886967S1 (en) 2016-04-06 2020-06-09 Showa Denko K.K. Cooler
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
US12363857B2 (en) 2020-09-30 2025-07-15 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
USD1094318S1 (en) * 2023-05-17 2025-09-23 Canaan Creative Co., Ltd. Cooling container for computing devices

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