USD714745S1 - Semiconductor - Google Patents

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Publication number
USD714745S1
USD714745S1 US29/429,075 US201229429075F USD714745S US D714745 S1 USD714745 S1 US D714745S1 US 201229429075 F US201229429075 F US 201229429075F US D714745 S USD714745 S US D714745S
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United States
Prior art keywords
semiconductor
view
design
dashed
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/429,075
Inventor
Masaki Kanemaru
Takahiro Shima
Tosiakira Andou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2012-3008F external-priority patent/JP1462669S/ja
Priority claimed from JPD2012-3004F external-priority patent/JP1462667S/ja
Priority claimed from JPD2012-3000F external-priority patent/JP1462665S/ja
Priority claimed from JPD2012-3006F external-priority patent/JP1462668S/ja
Priority claimed from JPD2012-3001F external-priority patent/JP1463745S/ja
Priority claimed from JPD2012-3003F external-priority patent/JP1463799S/ja
Priority claimed from JPD2012-3009F external-priority patent/JP1462670S/ja
Priority claimed from JPD2012-3002F external-priority patent/JP1462666S/ja
Priority claimed from JPD2012-3005F external-priority patent/JP1463800S/ja
Priority claimed from JPD2012-3007F external-priority patent/JP1463801S/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Assigned to PANASONIC CORPORATION reassignment PANASONIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDOU, Tosiakira, KANEMARU, MASAKI, SHIMA, TAKAHIRO
Application granted granted Critical
Publication of USD714745S1 publication Critical patent/USD714745S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a semiconductor showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a first side view thereof;
FIG. 4 is a second side view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is an enlarged front view taken along line 7-7 of FIG. 1
The even dashed broken lines shown represent unclaimed subject matter and form no part of the claimed design. The dashed-dot-dashed lines represent the boundary lines of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a semiconductor, as shown and described.
US29/429,075 2012-02-14 2012-08-07 Semiconductor Active USD714745S1 (en)

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
JP2012-003008 2012-01-11
JP2012-003000 2012-01-11
JP2012-003002 2012-01-11
JP2012-003003 2012-02-14
JPD2012-3006F JP1462668S (en) 2012-02-14 2012-02-14
JPD2012-3001F JP1463745S (en) 2012-02-14 2012-02-14
JPD2012-3003F JP1463799S (en) 2012-02-14 2012-02-14
JP2012-003005 2012-02-14
JP2012-003006 2012-02-14
JPD2012-3002F JP1462666S (en) 2012-02-14 2012-02-14
JPD2012-3007F JP1463801S (en) 2012-02-14 2012-02-14
JPD2012-3008F JP1462669S (en) 2012-02-14 2012-02-14
JP2012-003004 2012-02-14
JP2012-003001 2012-02-14
JP2012-003007 2012-02-14
JPD2012-3004F JP1462667S (en) 2012-02-14 2012-02-14
JPD2012-3005F JP1463800S (en) 2012-02-14 2012-02-14
JPD2012-3009F JP1462670S (en) 2012-02-14 2012-02-14
JPD2012-3000F JP1462665S (en) 2012-02-14 2012-02-14
JP2012-003009 2012-05-22

Publications (1)

Publication Number Publication Date
USD714745S1 true USD714745S1 (en) 2014-10-07

Family

ID=51627587

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/429,075 Active USD714745S1 (en) 2012-02-14 2012-08-07 Semiconductor

Country Status (1)

Country Link
US (1) USD714745S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

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US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
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USD439566S1 (en) * 1999-02-19 2001-03-27 Inet Technologies, Inc. Circuit card cage
USD440209S1 (en) * 1999-07-28 2001-04-10 Keonil Kang Board of wireless frequency for amplification of transmitting and receiving electric wave
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD502151S1 (en) * 2003-09-02 2005-02-22 International Rectifier Corporation Semiconductor package
USD504405S1 (en) * 2003-07-09 2005-04-26 Sanyo Electric Co., Ltd. Semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
US7348856B2 (en) 2003-08-08 2008-03-25 Renesas Technology Corp. Semiconductor device
US7408430B2 (en) 2004-06-30 2008-08-05 Murata Manufacturing Co., Ltd. High-frequency circuit device and transmitting and receiving apparatus
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD599307S1 (en) 2008-05-20 2009-09-01 Deka Products Limited Partnership RFID antenna circuit board
USD605613S1 (en) 2008-05-15 2009-12-08 Adc Gmbh Printed circuit board for electrical connector
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US7843273B2 (en) 2008-11-06 2010-11-30 Raytheon Company Millimeter wave monolithic integrated circuits and methods of forming such integrated circuits
US7859482B1 (en) 2006-09-27 2010-12-28 Rockwell Collins, Inc. Frequency selective surface waveguide switch
US7880567B2 (en) 2007-10-10 2011-02-01 Samsung Electronics Co., Ltd. Overlay electromagnetic bandgap (EBG) structure and method of manufacturing the same
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8049563B2 (en) 2000-10-10 2011-11-01 California Institute Of Technology Distributed circular geometry power amplifier architecture
US8054155B2 (en) 2009-08-07 2011-11-08 Imec Two layer transformer
US8064870B2 (en) 2008-09-30 2011-11-22 National Taiwan University Miniaturized dual-balanced mixer circuit based on a trifilar layout architecture
US8098208B2 (en) 2006-05-30 2012-01-17 Polyic Gmbh & Co. Kg Antenna configuration and use thereof
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
US8164528B2 (en) 2008-03-26 2012-04-24 Dockon Ag Self-contained counterpoise compound loop antenna
US8183970B2 (en) 2004-08-31 2012-05-22 Theta Microelectronics, Inc. Integrated high frequency BALUN and inductors
US8217492B2 (en) 2008-02-28 2012-07-10 Broadcom Corporation Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
USD439566S1 (en) * 1999-02-19 2001-03-27 Inet Technologies, Inc. Circuit card cage
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD440209S1 (en) * 1999-07-28 2001-04-10 Keonil Kang Board of wireless frequency for amplification of transmitting and receiving electric wave
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
US8049563B2 (en) 2000-10-10 2011-11-01 California Institute Of Technology Distributed circular geometry power amplifier architecture
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD504405S1 (en) * 2003-07-09 2005-04-26 Sanyo Electric Co., Ltd. Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
US7348856B2 (en) 2003-08-08 2008-03-25 Renesas Technology Corp. Semiconductor device
USD502151S1 (en) * 2003-09-02 2005-02-22 International Rectifier Corporation Semiconductor package
US7408430B2 (en) 2004-06-30 2008-08-05 Murata Manufacturing Co., Ltd. High-frequency circuit device and transmitting and receiving apparatus
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
US8183970B2 (en) 2004-08-31 2012-05-22 Theta Microelectronics, Inc. Integrated high frequency BALUN and inductors
US8098208B2 (en) 2006-05-30 2012-01-17 Polyic Gmbh & Co. Kg Antenna configuration and use thereof
US7859482B1 (en) 2006-09-27 2010-12-28 Rockwell Collins, Inc. Frequency selective surface waveguide switch
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US7880567B2 (en) 2007-10-10 2011-02-01 Samsung Electronics Co., Ltd. Overlay electromagnetic bandgap (EBG) structure and method of manufacturing the same
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
US8217492B2 (en) 2008-02-28 2012-07-10 Broadcom Corporation Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
US8164528B2 (en) 2008-03-26 2012-04-24 Dockon Ag Self-contained counterpoise compound loop antenna
USD605613S1 (en) 2008-05-15 2009-12-08 Adc Gmbh Printed circuit board for electrical connector
USD599307S1 (en) 2008-05-20 2009-09-01 Deka Products Limited Partnership RFID antenna circuit board
US8064870B2 (en) 2008-09-30 2011-11-22 National Taiwan University Miniaturized dual-balanced mixer circuit based on a trifilar layout architecture
US7843273B2 (en) 2008-11-06 2010-11-30 Raytheon Company Millimeter wave monolithic integrated circuits and methods of forming such integrated circuits
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US8054155B2 (en) 2009-08-07 2011-11-08 Imec Two layer transformer
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

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