USD692843S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD692843S1
USD692843S1 US29/431,909 US201229431909F USD692843S US D692843 S1 USD692843 S1 US D692843S1 US 201229431909 F US201229431909 F US 201229431909F US D692843 S USD692843 S US D692843S
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semiconductor device
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ornamental design
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indicia
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US29/431,909
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English (en)
Inventor
Takeyoshi Masuda
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MASUDA, TAKEYOSHI
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US29/431,909 2012-05-02 2012-09-12 Semiconductor device Active USD692843S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-010399 2012-01-20
JPD2012-10399F JP1463922S (enExample) 2012-05-02 2012-05-02

Publications (1)

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USD692843S1 true USD692843S1 (en) 2013-11-05

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US29/431,909 Active USD692843S1 (en) 2012-05-02 2012-09-12 Semiconductor device

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US (1) USD692843S1 (enExample)
JP (1) JP1463922S (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD737229S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD793371S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD793372S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module
USD1102398S1 (en) * 2023-03-30 2025-11-18 Ebara Corporation Seal for chemical mechanical polishing device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060267030A1 (en) * 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
USD574339S1 (en) * 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) * 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US20100132981A1 (en) * 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100163282A1 (en) * 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US20100175912A1 (en) * 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) * 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7981709B2 (en) * 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20120118614A1 (en) * 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20120186855A1 (en) * 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) * 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060267030A1 (en) * 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
USD574339S1 (en) * 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) * 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US20100163282A1 (en) * 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US7981709B2 (en) * 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US8203151B2 (en) * 2007-04-05 2012-06-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20100132981A1 (en) * 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100175912A1 (en) * 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) * 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US20120118614A1 (en) * 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20120186855A1 (en) * 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) * 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD737229S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD737230S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD793371S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD793372S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module
USD1102398S1 (en) * 2023-03-30 2025-11-18 Ebara Corporation Seal for chemical mechanical polishing device

Also Published As

Publication number Publication date
JP1463922S (enExample) 2016-02-29

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