USD737229S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD737229S1
USD737229S1 US29/481,535 US201429481535F USD737229S US D737229 S1 USD737229 S1 US D737229S1 US 201429481535 F US201429481535 F US 201429481535F US D737229 S USD737229 S US D737229S
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United States
Prior art keywords
semiconductor device
view
showing
indicia
ornamental design
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US29/481,535
Inventor
Takeyoshi Masuda
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Priority to US29/481,535 priority Critical patent/USD737229S1/en
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MASUDA, TAKEYOSHI
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FIG. 1 is a front view of a semiconductor device showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is an enlarged perspective view showing the area defined by indicia 7A and 7B of FIG. 1 thereof; and,
FIG. 8 is an enlarged perspective view showing the area defined by indicia 7A and 8C of FIG. 1 thereof.
The broken line showing is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/481,535 2010-12-28 2014-02-06 Semiconductor device Active USD737229S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/481,535 USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPD.2010-031447 2010-12-28
JP2010031448 2010-12-28
JPD.2010-031448 2010-12-28
JPD.2010-031446 2010-12-28
JP2010031447 2010-12-28
JP2010031446 2010-12-28
US29/389,545 USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,535 USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/389,545 Division USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device

Publications (1)

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USD737229S1 true USD737229S1 (en) 2015-08-25

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US29/389,545 Active USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,536 Active USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device
US29/481,535 Active USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

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US29/389,545 Active USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,536 Active USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD793372S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD793371S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
TWD161478S (en) * 2013-08-06 2014-07-01 璨圓光電股份有限公司 Semiconductor light emitting device parts
TWD164808S (en) * 2013-08-06 2014-12-11 璨圓光電股份有限公司 Semiconductor light emitting device parts
TWD161479S (en) * 2013-08-06 2014-07-01 璨圓光電股份有限公司 Semiconductor light emitting device part
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
JP1696315S (en) * 2021-03-23 2021-10-04 Power semiconductor device

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US6184478B1 (en) * 1998-09-30 2001-02-06 Adtec Corporation Printed wiring device with base layer having a grid pattern
US6388292B1 (en) * 1997-09-16 2002-05-14 Winbond Electronics Corporation Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
US20030136984A1 (en) * 2002-01-21 2003-07-24 Semiconductor Technology Academic Research Center Semiconductor device
US6713823B1 (en) * 2002-03-08 2004-03-30 Volterra Semiconductor Corporation Conductive routings in integrated circuits
US6897561B2 (en) * 2003-06-06 2005-05-24 Semiconductor Components Industries, Llc Semiconductor power device having a diamond shaped metal interconnect scheme
US6903460B2 (en) * 2002-10-30 2005-06-07 Denso Corporation Semiconductor equipment
US20050274977A1 (en) * 2004-06-15 2005-12-15 Kabushiki Kaisha Toshiba Nitride semiconductor device
US20060267030A1 (en) 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
US7166898B2 (en) * 2002-12-20 2007-01-23 Picor Corporation Flip chip FET device
USD574339S1 (en) 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US7663063B2 (en) * 2006-12-22 2010-02-16 Hon Hai Precision Industry Co., Ltd. Circuit board with improved ground plane
US20100132981A1 (en) 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100163282A1 (en) 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US20100175912A1 (en) 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7981709B2 (en) 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20110186858A1 (en) * 2009-08-04 2011-08-04 John Roberts Gallium Nitride Power Devices Using Island Topography
US20110203834A1 (en) * 2010-02-25 2011-08-25 Hitachi, Ltd. Printed circuit board
US20120118614A1 (en) 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20120186855A1 (en) 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board
US8487377B2 (en) * 2010-09-13 2013-07-16 Green Solution Technology Co., Ltd. MOSFET layout and structure with common source
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US8791508B2 (en) * 2010-04-13 2014-07-29 Gan Systems Inc. High density gallium nitride devices using island topology
US8941012B2 (en) * 2013-02-20 2015-01-27 Novatek Microelectronics Corp. Flexible circuit board and ground line structure

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5447876A (en) * 1993-11-19 1995-09-05 Micrel, Inc. Method of making a diamond shaped gate mesh for cellular MOS transistor array
US5852315A (en) * 1995-04-06 1998-12-22 Ind Tech Res Inst N-sided polygonal cell layout for multiple cell transistor
US6388292B1 (en) * 1997-09-16 2002-05-14 Winbond Electronics Corporation Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
US6184478B1 (en) * 1998-09-30 2001-02-06 Adtec Corporation Printed wiring device with base layer having a grid pattern
US20030136984A1 (en) * 2002-01-21 2003-07-24 Semiconductor Technology Academic Research Center Semiconductor device
US6713823B1 (en) * 2002-03-08 2004-03-30 Volterra Semiconductor Corporation Conductive routings in integrated circuits
US20060267030A1 (en) 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
US6903460B2 (en) * 2002-10-30 2005-06-07 Denso Corporation Semiconductor equipment
US7166898B2 (en) * 2002-12-20 2007-01-23 Picor Corporation Flip chip FET device
US6897561B2 (en) * 2003-06-06 2005-05-24 Semiconductor Components Industries, Llc Semiconductor power device having a diamond shaped metal interconnect scheme
US20050274977A1 (en) * 2004-06-15 2005-12-15 Kabushiki Kaisha Toshiba Nitride semiconductor device
USD574339S1 (en) 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US20100163282A1 (en) 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US7663063B2 (en) * 2006-12-22 2010-02-16 Hon Hai Precision Industry Co., Ltd. Circuit board with improved ground plane
US7981709B2 (en) 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US8203151B2 (en) 2007-04-05 2012-06-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20100132981A1 (en) 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100175912A1 (en) 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US20110186858A1 (en) * 2009-08-04 2011-08-04 John Roberts Gallium Nitride Power Devices Using Island Topography
US20120118614A1 (en) 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20110203834A1 (en) * 2010-02-25 2011-08-25 Hitachi, Ltd. Printed circuit board
US8791508B2 (en) * 2010-04-13 2014-07-29 Gan Systems Inc. High density gallium nitride devices using island topology
US8487377B2 (en) * 2010-09-13 2013-07-16 Green Solution Technology Co., Ltd. MOSFET layout and structure with common source
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US20120186855A1 (en) 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
US8941012B2 (en) * 2013-02-20 2015-01-27 Novatek Microelectronics Corp. Flexible circuit board and ground line structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD793372S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD793371S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element

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USD737230S1 (en) 2015-08-25
USD701843S1 (en) 2014-04-01

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