USD559063S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD559063S1
USD559063S1 US29/213,405 US21340504F USD559063S US D559063 S1 USD559063 S1 US D559063S1 US 21340504 F US21340504 F US 21340504F US D559063 S USD559063 S US D559063S
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United States
Prior art keywords
polishing pad
view
sectional
cross
taken
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/213,405
Inventor
Takahiro Okamoto
Hiroshi Shiho
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JSR Corp
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JSR Corp
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Assigned to JSR CORPORATION reassignment JSR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAMOTO, TAKAHIRO, SHIHO, HIROSHI
Priority to US29/296,712 priority Critical patent/USD581237S1/en
Application granted granted Critical
Publication of USD559063S1 publication Critical patent/USD559063S1/en
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FIG. 1 is a top plan view of the polishing pad;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevational view thereof, the left side elevational view, the right side elevational view, and the rear elevational view being a mirror image of the front view shown;
FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;
FIG. 5 is a greatly enlarged, partial view thereof taken at coordinates 55 in FIG. 1;
FIG. 6 is a cross-sectional view thereof taken along line 66 in FIG. 5;
FIG. 7 is a further enlargement of the cross-sectional view of part 7 shown in FIG. 6;
FIG. 8 is a greatly enlarged, partial view taken at coordinates 85 in FIG. 1;
FIG. 9 is a cross-sectional view taken along line 99 in FIG. 8;
FIG. 10 is a further enlargement of the cross-sectional view of part 10 of FIG. 9;
FIG. 11 is a further enlargement of the cross-sectional view of part 11 in FIG. 10; and,
FIG. 12 is a further enlargement of the cross-sectional view of part 12 in FIG. 11.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad, as shown and described.
US29/213,405 2004-03-17 2004-09-17 Polishing pad Expired - Lifetime USD559063S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/296,712 USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004008159 2004-03-17
JP2004008160 2004-03-17
JP2004-008159 2004-03-17
JP2004-008160 2004-03-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/296,712 Division USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

Publications (1)

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USD559063S1 true USD559063S1 (en) 2008-01-08

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US29/213,405 Expired - Lifetime USD559063S1 (en) 2004-03-17 2004-09-17 Polishing pad
US29/296,712 Expired - Lifetime USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

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US29/296,712 Expired - Lifetime USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD571383S1 (en) * 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD584591S1 (en) * 2004-10-26 2009-01-13 Jsr Corporation Polishing pad
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
USD738177S1 (en) * 2012-10-31 2015-09-08 Kwh Mirka Ltd Backing pad
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

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US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
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US6375550B1 (en) * 2000-06-05 2002-04-23 Lsi Logic Corporation Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer
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US6443810B1 (en) * 2000-04-11 2002-09-03 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing platen equipped with guard ring for chemical mechanical polishing
US20020173231A1 (en) 2001-04-25 2002-11-21 Jsr Corporation Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
US6544111B1 (en) * 1998-01-30 2003-04-08 Ebara Corporation Polishing apparatus and polishing table therefor
US6544373B2 (en) * 2001-07-26 2003-04-08 United Microelectronics Corp. Polishing pad for a chemical mechanical polishing process
US20030068964A1 (en) * 2001-10-05 2003-04-10 Governor Of Akita Prefecture Polishing apparatus
US6561890B2 (en) * 1999-12-28 2003-05-13 Ace Inc. Polishing pad
US20030194962A1 (en) * 2000-10-31 2003-10-16 Weber Robert J. Buffing tools and methods of making
US20030199234A1 (en) * 2000-06-29 2003-10-23 Shyng-Tsong Chen Grooved polishing pads and methods of use
US20030207651A1 (en) * 2002-05-06 2003-11-06 Seung-Kon Kim Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
US6702651B2 (en) * 2000-01-18 2004-03-09 Applied Materials Inc. Method and apparatus for conditioning a polishing pad
US20040053570A1 (en) * 2002-09-13 2004-03-18 Markus Naujok Novel finishing pad design for multidirectional use
US20040058630A1 (en) * 2001-08-16 2004-03-25 Inha Park Chemical mechanical polishing pad having holes and or grooves
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US20040127145A1 (en) * 2001-07-03 2004-07-01 Shogo Takahashi Perforated-transparent polishing pad
US20050113011A1 (en) * 2003-11-04 2005-05-26 Jsr Corporation Chemical mechanical polishing pad
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US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
USD510850S1 (en) * 2002-12-20 2005-10-25 Production Chemical Mfg. Inc. Polishing pad
US6960123B2 (en) * 2004-03-01 2005-11-01 Oki Electric Industry Co., Ltd. Cleaning sheet for probe needles
US20050245171A1 (en) * 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US20060063471A1 (en) * 2004-09-22 2006-03-23 Muldowney Gregory P CMP pad having a streamlined windowpane
US7029747B2 (en) * 2002-09-17 2006-04-18 Korea Polyol Co., Ltd. Integral polishing pad and manufacturing method thereof
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20060194530A1 (en) * 2005-02-25 2006-08-31 Thomson Clifford O Polishing pad for use in polishing work pieces
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
US7112119B1 (en) * 2005-08-26 2006-09-26 Applied Materials, Inc. Sealed polishing pad methods

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US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
CN100356515C (en) * 2002-04-03 2007-12-19 东邦工程株式会社 Polishing pad and semiconductor substrate manufacturing method using the polishing pad
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US7235154B2 (en) * 2004-01-08 2007-06-26 Strasbaugh Devices and methods for optical endpoint detection during semiconductor wafer polishing
USD559064S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7354334B1 (en) * 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD559065S1 (en) * 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
USD560457S1 (en) * 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
TW200709892A (en) * 2005-08-18 2007-03-16 Rohm & Haas Elect Mat Transparent polishing pad
USD541317S1 (en) * 2006-02-01 2007-04-24 3M Innovative Properties Company Abrasive article with holes
USD533200S1 (en) * 2006-02-01 2006-12-05 3M Innovative Properties Company Abrasive article with holes
US20070212979A1 (en) * 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
JP2007268658A (en) * 2006-03-31 2007-10-18 Tmp Co Ltd Polishing sheet and polishing method

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Publication number Priority date Publication date Assignee Title
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US494471A (en) * 1893-03-28 Grinding or polishing wheel and the art of manufacturing same
US1092588A (en) * 1914-01-05 1914-04-07 Albert Monkiawicz Grinding-wheel.
US1569403A (en) * 1922-06-03 1926-01-12 Standard Appliance And Souveni Fiber-needle sharpener for talking-machine records
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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD584591S1 (en) * 2004-10-26 2009-01-13 Jsr Corporation Polishing pad
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD592029S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD600989S1 (en) * 2004-10-26 2009-09-29 Jsr Corporation Polishing pad
USD571383S1 (en) * 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD738177S1 (en) * 2012-10-31 2015-09-08 Kwh Mirka Ltd Backing pad
USD740637S1 (en) * 2012-10-31 2015-10-13 Kwh Mirka Ltd Backing pad
USD873108S1 (en) * 2014-06-06 2020-01-21 Husqvarna Ab Polishing pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
USD837015S1 (en) * 2014-06-06 2019-01-01 Husqvarna Construction Products North America, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US11084140B2 (en) 2015-09-24 2021-08-10 Husqvarna Ab Method of using polishing or grinding pad assembly
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
USD933440S1 (en) * 2016-09-23 2021-10-19 Husqvarna Ab Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

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