USD508682S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD508682S1
USD508682S1 US29/206,162 US20616204F USD508682S US D508682 S1 USD508682 S1 US D508682S1 US 20616204 F US20616204 F US 20616204F US D508682 S USD508682 S US D508682S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
mirror image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/206,162
Inventor
Tatsuya Yamada
Kazuhiko Kurahashi
Toshihisa Inoue
Taizo Tomioka
Kazuo Shimokawa
Yoshiki Endo
Masahiro Urase
Osamu Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ENDO, YOSHIKI, INOUE, TOSHIHISA, KURAHASHI, KAZUHIKO, Shimokawa, Kazuo, Tomioka, Taizo, URASE, MASAHIRO, USUDA, OSAMU, YAMADA, TATSUYA
Application granted granted Critical
Publication of USD508682S1 publication Critical patent/USD508682S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a top plan view thereof; the opposite side being a mirror image thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side elevational view thereof; the opposite side being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/206,162 2004-02-23 2004-05-27 Semiconductor device Expired - Lifetime USD508682S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004005063 2004-02-23
JP2004-005063 2004-02-23

Publications (1)

Publication Number Publication Date
USD508682S1 true USD508682S1 (en) 2005-08-23

Family

ID=34835791

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/206,162 Expired - Lifetime USD508682S1 (en) 2004-02-23 2004-05-27 Semiconductor device

Country Status (1)

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US (1) USD508682S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD524260S1 (en) * 2004-08-20 2006-07-04 Citizen Electronics Co., Ltd. Light emitting diode
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6383835B1 (en) * 1995-09-01 2002-05-07 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
US6383835B1 (en) * 1995-09-01 2002-05-07 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Dempa Shimbun, An Infineon Technologies Tuner IC (TUA6120), Jul. 2002.
Kinseki, KSS Products Catalog, SAW Filter (LSFB30-190-004M0), p. 71. Mar. 2000.

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD524260S1 (en) * 2004-08-20 2006-07-04 Citizen Electronics Co., Ltd. Light emitting diode
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package

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