USD1110973S1 - Gas injector for a semiconductor manufacturing apparatus - Google Patents

Gas injector for a semiconductor manufacturing apparatus

Info

Publication number
USD1110973S1
USD1110973S1 US29/880,373 US202329880373F USD1110973S US D1110973 S1 USD1110973 S1 US D1110973S1 US 202329880373 F US202329880373 F US 202329880373F US D1110973 S USD1110973 S US D1110973S
Authority
US
United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
gas injector
view
injector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/880,373
Other languages
English (en)
Inventor
Hideyuki NISHIMOTO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
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Publication of USD1110973S1 publication Critical patent/USD1110973S1/en
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US29/880,373 2023-01-25 2023-07-21 Gas injector for a semiconductor manufacturing apparatus Active USD1110973S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-001109D 2023-01-25
JP2023001109F JP1746467S (https=) 2023-01-25 2023-01-25

Publications (1)

Publication Number Publication Date
USD1110973S1 true USD1110973S1 (en) 2026-02-03

Family

ID=86721108

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/880,373 Active USD1110973S1 (en) 2023-01-25 2023-07-21 Gas injector for a semiconductor manufacturing apparatus

Country Status (3)

Country Link
US (1) USD1110973S1 (https=)
JP (1) JP1746467S (https=)
TW (1) TWD236040S (https=)

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880163A (en) * 1987-01-27 1989-11-14 Asahi Glass Company, Ltd. Gas feeding nozzle for a chemical vapor deposition apparatus
US20070131168A1 (en) * 2005-10-31 2007-06-14 Hisashi Gomi Gas Supplying unit and substrate processing apparatus
US20090205631A1 (en) * 2008-02-20 2009-08-20 Kao Hsung Tsung Gas burner head
USD645118S1 (en) * 2010-05-25 2011-09-13 Caldwell Tanks, Inc. Nozzle tubing having offset nozzles
US20140239091A1 (en) * 2013-02-23 2014-08-28 Hermes-Epitek Corporation Gas Injector and Cover Plate Assembly for Semiconductor Equipment
US20150240359A1 (en) * 2014-02-25 2015-08-27 Asm Ip Holding B.V. Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US20180087156A1 (en) * 2016-09-27 2018-03-29 Tokyo Electron Limited Gas Introduction Mechanism and Processing Apparatus
US10651016B2 (en) * 2017-03-15 2020-05-12 Hermes-Epitek Corporation Detachable gas injector used for semiconductor equipment
USD886947S1 (en) * 2019-03-17 2020-06-09 Runjian Mo Handheld shower
USD886948S1 (en) * 2019-03-17 2020-06-09 Runjian Mo Handheld shower
USD888196S1 (en) 2018-07-05 2020-06-23 Kokusai Electric Corporation Gas nozzle for substrate processing apparatus
USD901564S1 (en) * 2019-01-28 2020-11-10 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD924953S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Gas inlet attachment for substrate processing apparatus
USD964443S1 (en) * 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD965740S1 (en) * 2020-07-27 2022-10-04 Kokusai Electric Corporation Gas supply nozzle for substrate processing apparatus
US20230055506A1 (en) * 2021-08-20 2023-02-23 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and gas injector
USD991416S1 (en) * 2022-06-25 2023-07-04 Jiangsu Mingqian Intellectual Property Co., Ltd. Threaded connection pipe
USD1020668S1 (en) * 2021-06-16 2024-04-02 Kokusai Electric Corporation Gas injector for substrate processing apparatus
USD1030956S1 (en) * 2023-01-31 2024-06-11 Sidel Participations Nozzle for use with a blow molder
USD1042731S1 (en) * 2022-05-30 2024-09-17 Kokusai Electric Corporation Gas nozzle for semiconductor manufacturing equipment
USD1083029S1 (en) * 2023-07-14 2025-07-08 Lg Electronics Inc. Nozzle for water purifier

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880163A (en) * 1987-01-27 1989-11-14 Asahi Glass Company, Ltd. Gas feeding nozzle for a chemical vapor deposition apparatus
US20070131168A1 (en) * 2005-10-31 2007-06-14 Hisashi Gomi Gas Supplying unit and substrate processing apparatus
US20090205631A1 (en) * 2008-02-20 2009-08-20 Kao Hsung Tsung Gas burner head
USD645118S1 (en) * 2010-05-25 2011-09-13 Caldwell Tanks, Inc. Nozzle tubing having offset nozzles
US20140239091A1 (en) * 2013-02-23 2014-08-28 Hermes-Epitek Corporation Gas Injector and Cover Plate Assembly for Semiconductor Equipment
US20150240359A1 (en) * 2014-02-25 2015-08-27 Asm Ip Holding B.V. Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US20180087156A1 (en) * 2016-09-27 2018-03-29 Tokyo Electron Limited Gas Introduction Mechanism and Processing Apparatus
US10651016B2 (en) * 2017-03-15 2020-05-12 Hermes-Epitek Corporation Detachable gas injector used for semiconductor equipment
USD888196S1 (en) 2018-07-05 2020-06-23 Kokusai Electric Corporation Gas nozzle for substrate processing apparatus
USD924953S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Gas inlet attachment for substrate processing apparatus
USD901564S1 (en) * 2019-01-28 2020-11-10 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD886948S1 (en) * 2019-03-17 2020-06-09 Runjian Mo Handheld shower
USD886947S1 (en) * 2019-03-17 2020-06-09 Runjian Mo Handheld shower
USD965740S1 (en) * 2020-07-27 2022-10-04 Kokusai Electric Corporation Gas supply nozzle for substrate processing apparatus
USD964443S1 (en) * 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD1020668S1 (en) * 2021-06-16 2024-04-02 Kokusai Electric Corporation Gas injector for substrate processing apparatus
US20230055506A1 (en) * 2021-08-20 2023-02-23 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and gas injector
USD1042731S1 (en) * 2022-05-30 2024-09-17 Kokusai Electric Corporation Gas nozzle for semiconductor manufacturing equipment
USD991416S1 (en) * 2022-06-25 2023-07-04 Jiangsu Mingqian Intellectual Property Co., Ltd. Threaded connection pipe
USD1030956S1 (en) * 2023-01-31 2024-06-11 Sidel Participations Nozzle for use with a blow molder
USD1083029S1 (en) * 2023-07-14 2025-07-08 Lg Electronics Inc. Nozzle for water purifier

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
HTI—High Temperature Injector, https://www.riber.com/product/hti-high-temperature-injector/, 2025. (Year: 2025). *
Low Temperature Gas Source,https://www.veeco.com/products/low-temperature-gas-source-2/,2025. (Year: 2025). *
HTI—High Temperature Injector, https://www.riber.com/product/hti-high-temperature-injector/, 2025. (Year: 2025). *
Low Temperature Gas Source,https://www.veeco.com/products/low-temperature-gas-source-2/,2025. (Year: 2025). *

Also Published As

Publication number Publication date
TWD236040S (zh) 2025-01-21
JP1746467S (https=) 2023-06-16

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