USD1108381S1 - Filler block for substrate processing apparatus - Google Patents

Filler block for substrate processing apparatus

Info

Publication number
USD1108381S1
USD1108381S1 US29/961,389 US202429961389F USD1108381S US D1108381 S1 USD1108381 S1 US D1108381S1 US 202429961389 F US202429961389 F US 202429961389F US D1108381 S USD1108381 S US D1108381S
Authority
US
United States
Prior art keywords
processing apparatus
substrate processing
filler block
filler
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/961,389
Other languages
English (en)
Inventor
Yusaku OKAJIMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Application granted granted Critical
Publication of USD1108381S1 publication Critical patent/USD1108381S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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US29/961,389 2024-03-08 2024-09-05 Filler block for substrate processing apparatus Active USD1108381S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-004871D 2024-03-08
JP2024004871F JP1778590S (enExample) 2024-03-08 2024-03-08

Publications (1)

Publication Number Publication Date
USD1108381S1 true USD1108381S1 (en) 2026-01-06

Family

ID=92499660

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/961,389 Active USD1108381S1 (en) 2024-03-08 2024-09-05 Filler block for substrate processing apparatus

Country Status (2)

Country Link
US (1) USD1108381S1 (enExample)
JP (1) JP1778590S (enExample)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20130244440A1 (en) * 2012-03-15 2013-09-19 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching
US9005459B2 (en) * 2011-03-18 2015-04-14 Tokyo Electron Limited Film deposition method and film deposition apparatus
US20180005851A1 (en) * 2016-07-01 2018-01-04 Lam Research Corporation Chamber filler kit for dielectric etch chamber
USD818961S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus
US11646184B2 (en) * 2019-11-29 2023-05-09 Asm Ip Holding B.V. Substrate processing apparatus
USD1003243S1 (en) * 2021-06-28 2023-10-31 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
USD1003834S1 (en) * 2021-06-28 2023-11-07 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
US12020934B2 (en) * 2020-07-08 2024-06-25 Asm Ip Holding B.V. Substrate processing method
US12374543B2 (en) * 2020-09-28 2025-07-29 Tokyo Electron Limited Recess filling method and substrate processing apparatus

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US9005459B2 (en) * 2011-03-18 2015-04-14 Tokyo Electron Limited Film deposition method and film deposition apparatus
US20130244440A1 (en) * 2012-03-15 2013-09-19 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching
USD818961S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus
US20180005851A1 (en) * 2016-07-01 2018-01-04 Lam Research Corporation Chamber filler kit for dielectric etch chamber
US11646184B2 (en) * 2019-11-29 2023-05-09 Asm Ip Holding B.V. Substrate processing apparatus
US12020934B2 (en) * 2020-07-08 2024-06-25 Asm Ip Holding B.V. Substrate processing method
US12374543B2 (en) * 2020-09-28 2025-07-29 Tokyo Electron Limited Recess filling method and substrate processing apparatus
USD1003243S1 (en) * 2021-06-28 2023-10-31 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus
USD1003834S1 (en) * 2021-06-28 2023-11-07 Kokusai Electric Corporation Heat insulator cover of semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP1778590S (enExample) 2024-08-28

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