JP1778590S - - Google Patents

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Publication number
JP1778590S
JP1778590S JP2024004871F JP2024004871F JP1778590S JP 1778590 S JP1778590 S JP 1778590S JP 2024004871 F JP2024004871 F JP 2024004871F JP 2024004871 F JP2024004871 F JP 2024004871F JP 1778590 S JP1778590 S JP 1778590S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024004871F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2024004871F priority Critical patent/JP1778590S/ja
Application granted granted Critical
Publication of JP1778590S publication Critical patent/JP1778590S/ja
Priority to US29/961,389 priority patent/USD1108381S1/en
Priority to TW113304575F priority patent/TWD243492S/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024004871F 2024-03-08 2024-03-08 Active JP1778590S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2024004871F JP1778590S (enExample) 2024-03-08 2024-03-08
US29/961,389 USD1108381S1 (en) 2024-03-08 2024-09-05 Filler block for substrate processing apparatus
TW113304575F TWD243492S (zh) 2024-03-08 2024-09-05 基板處理裝置用充填塊

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024004871F JP1778590S (enExample) 2024-03-08 2024-03-08

Publications (1)

Publication Number Publication Date
JP1778590S true JP1778590S (enExample) 2024-08-28

Family

ID=92499660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024004871F Active JP1778590S (enExample) 2024-03-08 2024-03-08

Country Status (3)

Country Link
US (1) USD1108381S1 (enExample)
JP (1) JP1778590S (enExample)
TW (1) TWD243492S (enExample)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
JP5661523B2 (ja) * 2011-03-18 2015-01-28 東京エレクトロン株式会社 成膜方法及び成膜装置
US9679751B2 (en) * 2012-03-15 2017-06-13 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching
JP6487747B2 (ja) 2015-03-26 2019-03-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置と処理ガス供給ノズル
JP1565116S (enExample) * 2016-02-10 2016-12-12
US20180005851A1 (en) * 2016-07-01 2018-01-04 Lam Research Corporation Chamber filler kit for dielectric etch chamber
CN120432376A (zh) * 2019-11-29 2025-08-05 Asm Ip私人控股有限公司 基板处理设备
TW202202649A (zh) * 2020-07-08 2022-01-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理方法
JP2022054653A (ja) * 2020-09-28 2022-04-07 東京エレクトロン株式会社 凹部埋め込み方法及び基板処理装置
JP1706321S (enExample) * 2021-06-28 2022-01-31
JP1706320S (enExample) * 2021-06-28 2022-01-31

Also Published As

Publication number Publication date
USD1108381S1 (en) 2026-01-06
TWD243492S (zh) 2026-03-21

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