JP1706320S - - Google Patents

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Publication number
JP1706320S
JP1706320S JP2021014030F JP2021014030F JP1706320S JP 1706320 S JP1706320 S JP 1706320S JP 2021014030 F JP2021014030 F JP 2021014030F JP 2021014030 F JP2021014030 F JP 2021014030F JP 1706320 S JP1706320 S JP 1706320S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021014030F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2021014030F priority Critical patent/JP1706320S/ja
Priority to TW110306502F priority patent/TWD225633S/zh
Priority to US29/820,708 priority patent/USD1003834S1/en
Application granted granted Critical
Publication of JP1706320S publication Critical patent/JP1706320S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021014030F 2021-06-28 2021-06-28 Active JP1706320S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021014030F JP1706320S (enExample) 2021-06-28 2021-06-28
TW110306502F TWD225633S (zh) 2021-06-28 2021-11-30 半導體製造裝置用隔熱組件外罩
US29/820,708 USD1003834S1 (en) 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021014030F JP1706320S (enExample) 2021-06-28 2021-06-28

Publications (1)

Publication Number Publication Date
JP1706320S true JP1706320S (enExample) 2022-01-31

Family

ID=80218922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021014030F Active JP1706320S (enExample) 2021-06-28 2021-06-28

Country Status (3)

Country Link
US (1) USD1003834S1 (enExample)
JP (1) JP1706320S (enExample)
TW (1) TWD225633S (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1733769S (enExample) * 2022-08-10 2023-01-06
JP1755433S (enExample) * 2023-03-13 2023-10-17
JP1760960S (enExample) * 2023-06-12 2024-01-10
JP1774869S (enExample) 2024-01-18 2024-07-05
JP1778590S (enExample) * 2024-03-08 2024-08-28
USD1110288S1 (en) * 2024-03-20 2026-01-27 Kokusai Electric Corporation Heat insulation pedestal of a semiconductor manufacturing apparatus
JP1790715S (enExample) 2024-08-28 2025-02-06

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD413659S (en) * 1996-09-09 1999-09-07 Swartz Mitchell R Immersion apparatus to heat a solution
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD407696S (en) * 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD615936S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
JP5645718B2 (ja) * 2011-03-07 2014-12-24 東京エレクトロン株式会社 熱処理装置
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD694711S1 (en) * 2012-03-23 2013-12-03 Mitsubishi Electric Corporation Insulator for vacuum circuit breaker
JP1564810S (enExample) * 2016-02-10 2016-12-05
JP1565116S (enExample) 2016-02-10 2016-12-12
TWD210787S (zh) 2020-05-28 2021-04-01 曾仁安 插銷

Also Published As

Publication number Publication date
TWD225633S (zh) 2023-06-01
USD1003834S1 (en) 2023-11-07

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