JP1565116S - - Google Patents

Info

Publication number
JP1565116S
JP1565116S JPD2016-2843F JP2016002843F JP1565116S JP 1565116 S JP1565116 S JP 1565116S JP 2016002843 F JP2016002843 F JP 2016002843F JP 1565116 S JP1565116 S JP 1565116S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-2843F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-2843F priority Critical patent/JP1565116S/ja
Priority to TW105304350F priority patent/TWD183005S/zh
Priority to US29/572,569 priority patent/USD818961S1/en
Application granted granted Critical
Publication of JP1565116S publication Critical patent/JP1565116S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-2843F 2016-02-10 2016-02-10 Active JP1565116S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2016-2843F JP1565116S (enExample) 2016-02-10 2016-02-10
TW105304350F TWD183005S (zh) 2016-02-10 2016-07-28 半導體製造裝置之隔熱組件外罩
US29/572,569 USD818961S1 (en) 2016-02-10 2016-07-28 Insulation unit cover of semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-2843F JP1565116S (enExample) 2016-02-10 2016-02-10

Publications (1)

Publication Number Publication Date
JP1565116S true JP1565116S (enExample) 2016-12-12

Family

ID=57482774

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-2843F Active JP1565116S (enExample) 2016-02-10 2016-02-10

Country Status (3)

Country Link
US (1) USD818961S1 (enExample)
JP (1) JP1565116S (enExample)
TW (1) TWD183005S (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1110288S1 (en) 2024-03-20 2026-01-27 Kokusai Electric Corporation Heat insulation pedestal of a semiconductor manufacturing apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11631567B2 (en) * 2020-03-12 2023-04-18 Applied Materials, Inc. Ion source with single-slot tubular cathode
JP1706320S (enExample) 2021-06-28 2022-01-31
JP1706321S (enExample) 2021-06-28 2022-01-31
JP1733769S (enExample) * 2022-08-10 2023-01-06
JP1755433S (enExample) 2023-03-13 2023-10-17
JP1778590S (enExample) * 2024-03-08 2024-08-28

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD493873S1 (en) * 2002-05-24 2004-08-03 Tokyo Electron Limited Heating gas supplier for semiconductor manufacturing equipment
USD522456S1 (en) * 2002-11-29 2006-06-06 Honda Giken Kogyo Kabushiki Kaisha Capacitor cell
JP3845370B2 (ja) * 2002-11-29 2006-11-15 本田技研工業株式会社 蓄電素子モジュール
US7440258B2 (en) * 2005-03-14 2008-10-21 Maxwell Technologies, Inc. Thermal interconnects for coupling energy storage devices
JP5031611B2 (ja) * 2008-02-18 2012-09-19 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び天井断熱体
US8098479B1 (en) * 2008-09-19 2012-01-17 Cornell Dubilier Marketing, Inc. Capacitor having zinc coated common edge with welded aluminum terminal
KR101049282B1 (ko) * 2009-03-03 2011-07-13 주식회사 네스캡 전기에너지 저장장치
US8456795B2 (en) * 2009-11-13 2013-06-04 American Radionic Company, Inc. Hard start kit for multiple replacement applications
JP5645718B2 (ja) * 2011-03-07 2014-12-24 東京エレクトロン株式会社 熱処理装置
US8570767B2 (en) * 2011-03-21 2013-10-29 Deere & Company Capacitor assembly
JP6247566B2 (ja) * 2014-02-28 2017-12-13 東洋炭素株式会社 加熱処理容器、加熱処理容器集合体、及び、半導体素子製造装置
JP1541104S (enExample) * 2014-12-12 2016-01-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1110288S1 (en) 2024-03-20 2026-01-27 Kokusai Electric Corporation Heat insulation pedestal of a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
USD818961S1 (en) 2018-05-29
TWD183005S (zh) 2017-05-11

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