USD1079661S1 - Susceptor of semiconductor manufacturing apparatus - Google Patents

Susceptor of semiconductor manufacturing apparatus Download PDF

Info

Publication number
USD1079661S1
USD1079661S1 US29/927,474 US202429927474F USD1079661S US D1079661 S1 USD1079661 S1 US D1079661S1 US 202429927474 F US202429927474 F US 202429927474F US D1079661 S USD1079661 S US D1079661S
Authority
US
United States
Prior art keywords
susceptor
manufacturing apparatus
semiconductor manufacturing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/927,474
Other languages
English (en)
Inventor
Daiki Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TANIGUCHI, Daiki
Application granted granted Critical
Publication of USD1079661S1 publication Critical patent/USD1079661S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

US29/927,474 2023-08-31 2024-02-05 Susceptor of semiconductor manufacturing apparatus Active USD1079661S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-017720D 2023-08-31
JP2023017720F JP1760971S (enrdf_load_stackoverflow) 2023-08-31 2023-08-31

Publications (1)

Publication Number Publication Date
USD1079661S1 true USD1079661S1 (en) 2025-06-17

Family

ID=89452006

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/927,474 Active USD1079661S1 (en) 2023-08-31 2024-02-05 Susceptor of semiconductor manufacturing apparatus

Country Status (2)

Country Link
US (1) USD1079661S1 (enrdf_load_stackoverflow)
JP (1) JP1760971S (enrdf_load_stackoverflow)

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169684A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig
USD515675S1 (en) * 2001-12-27 2006-02-21 Flow International Corporation Element for a superpressure static fluid seal
US20090081887A1 (en) * 2007-09-26 2009-03-26 Tokyo Electron Limited Heat treatment method and heat treatment apparatus
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD638522S1 (en) * 2010-07-20 2011-05-24 Wārtsilā Japan Ltd. Seal ring for stern tube
US20140090554A1 (en) * 2012-09-28 2014-04-03 Air Products And Chemicals, Inc. Wear-Compensating Sealing Ring Assembly
JP2014063820A (ja) 2012-09-20 2014-04-10 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
US20140262193A1 (en) * 2013-03-13 2014-09-18 Techest Co., Ltd. Edge ring cooling module for semi-conductor manufacture chuck
USD728757S1 (en) * 2013-01-04 2015-05-05 Michael Graham Gasket
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD864361S1 (en) * 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD871561S1 (en) * 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD871608S1 (en) * 2017-07-31 2019-12-31 Hitachi High-Technologies Corporation Gas ring for a plasma processing apparatus
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD895075S1 (en) * 2018-02-08 2020-09-01 Valqua, Ltd. Seal member for semiconductor production apparatus
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933619S1 (en) * 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD974910S1 (en) * 2020-02-04 2023-01-10 Wilson Sporting Goods Co. Tennis ball container overcap
JP1740585S (ja) 2022-10-26 2023-03-31 リングスペーサー
US12087598B2 (en) * 2015-09-30 2024-09-10 Kokusai Electric Corporation Substrate processing apparatus
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169684A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig
USD515675S1 (en) * 2001-12-27 2006-02-21 Flow International Corporation Element for a superpressure static fluid seal
US20090081887A1 (en) * 2007-09-26 2009-03-26 Tokyo Electron Limited Heat treatment method and heat treatment apparatus
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD638522S1 (en) * 2010-07-20 2011-05-24 Wārtsilā Japan Ltd. Seal ring for stern tube
JP2014063820A (ja) 2012-09-20 2014-04-10 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
US20140090554A1 (en) * 2012-09-28 2014-04-03 Air Products And Chemicals, Inc. Wear-Compensating Sealing Ring Assembly
USD728757S1 (en) * 2013-01-04 2015-05-05 Michael Graham Gasket
US20140262193A1 (en) * 2013-03-13 2014-09-18 Techest Co., Ltd. Edge ring cooling module for semi-conductor manufacture chuck
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
US12087598B2 (en) * 2015-09-30 2024-09-10 Kokusai Electric Corporation Substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD864361S1 (en) * 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD871608S1 (en) * 2017-07-31 2019-12-31 Hitachi High-Technologies Corporation Gas ring for a plasma processing apparatus
USD871561S1 (en) * 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD895075S1 (en) * 2018-02-08 2020-09-01 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) * 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD974910S1 (en) * 2020-02-04 2023-01-10 Wilson Sporting Goods Co. Tennis ball container overcap
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
JP1740585S (ja) 2022-10-26 2023-03-31 リングスペーサー

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Heat Resistant Plastic Wafer Hoop Ring for Expand Wafer, posting date unavailable [online], [retrieved Mar. 24, 2025]. Retrieved from internet, https://www.jedecictrays.com/quality-13789604-heat-resistant-plastic-wafer-hoop-ring-for-expand-wafer (Year: 2025). *
Silicon Ring, posting date unavailable [online], [retrieved Mar. 24, 2025]. Retrieved from internet, https://www.dstcsemi.com/products/silicon-ring/ (Year: 2025). *

Also Published As

Publication number Publication date
JP1760971S (enrdf_load_stackoverflow) 2024-01-10

Similar Documents

Publication Publication Date Title
USD1003401S1 (en) Faucet set
USD1011484S1 (en) Faucet set
USD1052547S1 (en) Semiconductor wafer and susceptor heating
USD1016232S1 (en) Faucet
USD1005974S1 (en) Gas distributor for semiconductor manufacturing apparatus
USD1003400S1 (en) Faucet set
USD1019581S1 (en) Inner tube of reaction tube for semiconductor manufacturing equipment
USD1034873S1 (en) Slide
USD1016226S1 (en) Faucet
USD1032226S1 (en) Bedstead
USD1031192S1 (en) Portable vacuum
USD1034914S1 (en) Faucet
USD1016231S1 (en) Faucet
USD974068S1 (en) Bench
USD967334S1 (en) Showerhead
USD1019976S1 (en) Male chastity apparatus set
USD1057096S1 (en) Faucet
USD1075414S1 (en) Bottle
USD1027125S1 (en) Faucet
USD1003834S1 (en) Heat insulator cover of semiconductor manufacturing apparatus
USD1043784S1 (en) Magnifier
USD1027131S1 (en) Faucet
USD1015040S1 (en) Siderail
USD1039331S1 (en) Vacuum bottle
USD982537S1 (en) Separator of substrate processing apparatus

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY