USD1064005S1 - Grounding ring of a process kit for semiconductor substrate processing - Google Patents

Grounding ring of a process kit for semiconductor substrate processing Download PDF

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Publication number
USD1064005S1
USD1064005S1 US29/848,745 US202229848745F USD1064005S US D1064005 S1 USD1064005 S1 US D1064005S1 US 202229848745 F US202229848745 F US 202229848745F US D1064005 S USD1064005 S US D1064005S
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United States
Prior art keywords
semiconductor substrate
substrate processing
process kit
grounding ring
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/848,745
Inventor
Abhishek Chowdhury
Nataraj BHASKAR RAO
Edwin C. Suarez
Harisha SATHYANARAYANA
Diego Ramiro PUENTE SOTOMAYOR
Qanit Takmeel
Mohammad Kamruzzaman CHOWDHURY
Arun Chakravarthy Chakravarthy
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Priority to US29/848,745 priority Critical patent/USD1064005S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BHASKAR RAO, NATARAJ, Chowdhury, Abhishek, SATHYANARAYANA, HARISHA, PUENTE SOTOMAYOR, DIEGO RAMIRO, SUAREZ, EDWIN C., CHAKRAVARTHY, ARUN CHAKRAVARTHY, CHOWDHURY, Mohammad Kamruzzaman, TAKMEEL, QANIT
Priority to TW112300427F priority patent/TWD227852S/en
Priority to JP2023002017F priority patent/JP1747764S/en
Application granted granted Critical
Publication of USD1064005S1 publication Critical patent/USD1064005S1/en
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Description

FIG. 1 is a top isometric view of a grounding ring of a process kit for semiconductor substrate processing, according to the novel design.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a left elevation view thereof.
FIG. 6 is a right elevation view thereof.
FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,
FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

Claims (1)

    CLAIM
  1. The ornamental design for a grounding ring of a process kit for semiconductor substrate processing, as shown and described.
US29/848,745 2022-08-04 2022-08-04 Grounding ring of a process kit for semiconductor substrate processing Active USD1064005S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/848,745 USD1064005S1 (en) 2022-08-04 2022-08-04 Grounding ring of a process kit for semiconductor substrate processing
TW112300427F TWD227852S (en) 2022-08-04 2023-02-03 Grounding ring of a process kit for semiconductor substrate processing
JP2023002017F JP1747764S (en) 2022-08-04 2023-02-06 Grounding ring of process kit for semiconductor substrate processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/848,745 USD1064005S1 (en) 2022-08-04 2022-08-04 Grounding ring of a process kit for semiconductor substrate processing

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USD1064005S1 true USD1064005S1 (en) 2025-02-25

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US29/848,745 Active USD1064005S1 (en) 2022-08-04 2022-08-04 Grounding ring of a process kit for semiconductor substrate processing

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US (1) USD1064005S1 (en)
JP (1) JP1747764S (en)
TW (1) TWD227852S (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1069863S1 (en) 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing

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US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
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US20120240853A1 (en) * 2011-03-22 2012-09-27 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
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US20130206070A1 (en) 2012-02-10 2013-08-15 Well Thin Technology, Ltd. Deposition ring
USD711331S1 (en) 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
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USD717746S1 (en) 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
US20160322250A1 (en) 2014-05-15 2016-11-03 Infineon Technologies Ag Wafer Releasing
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
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US20190259635A1 (en) 2018-02-17 2019-08-22 Applied Materials, Inc. Process kit for processing reduced sized substrates
US20190259647A1 (en) 2018-02-17 2019-08-22 Applied Materials, Inc. Deposition ring for processing reduced size substrates
US20200090915A1 (en) 2017-06-01 2020-03-19 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
US20200194243A1 (en) 2018-12-17 2020-06-18 Applied Materials, Inc. Process kit having tall deposition ring for pvd chamber
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US20200234928A1 (en) 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
TWD217060S (en) 2020-06-02 2022-02-11 美商應用材料股份有限公司 Enclosure system shelf of a substrate processing system
US20220157572A1 (en) 2020-11-18 2022-05-19 Applied Materials, Inc. Deposition ring for thin substrate handling via edge clamping
US20220165551A1 (en) 2020-11-23 2022-05-26 Advanced Micro-Fabrication Equipment Inc. China Bottom electrode assembly, plasma processing apparatus, and method of replacing focus ring
US20220344134A1 (en) 2018-01-19 2022-10-27 Applied Materials, Inc. Process kit for a substrate support
US20220406573A1 (en) 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber
JP1747664S (en) 2022-08-04 2023-06-29 Deposition ring in process kit for semiconductor substrate processing
JP1747764S (en) * 2022-08-04 2023-06-30 Grounding ring of process kit for semiconductor substrate processing
JP1747763S (en) 2022-08-04 2023-06-30 Deposition ring in process kit for semiconductor substrate processing
US11798823B2 (en) 2019-11-18 2023-10-24 SCREEN Holdings Co., Ltd. Light irradiation type thermal process apparatus using a gas ring
USD1005245S1 (en) 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
US20240044002A1 (en) * 2022-08-04 2024-02-08 Applied Materials, Inc. Substrate Handling System, Method, and Apparatus
USD1034493S1 (en) 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4407654A (en) * 1982-01-21 1983-10-04 The Potters Supply Company Handling and support system for kiln fired ware
US5310339A (en) * 1990-09-26 1994-05-10 Tokyo Electron Limited Heat treatment apparatus having a wafer boat
US6287435B1 (en) 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6231038B1 (en) * 1998-12-01 2001-05-15 Greene Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
US6123804A (en) * 1999-02-22 2000-09-26 Applied Materials, Inc. Sectional clamp ring
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20090050272A1 (en) 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
KR20090064113A (en) 2007-12-15 2009-06-18 주식회사 동부하이텍 Wafer lifting device and wafer dechucking method using the same
US9818585B2 (en) 2009-02-27 2017-11-14 Applied Materials, Inc. In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
US20120042825A1 (en) 2010-08-20 2012-02-23 Applied Materials, Inc. Extended life deposition ring
US20120103257A1 (en) 2010-10-29 2012-05-03 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
US20130055952A1 (en) 2011-03-11 2013-03-07 Applied Materials, Inc. Reflective deposition rings and substrate processing chambers incorporting same
US8980005B2 (en) 2011-03-22 2015-03-17 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
US20120240853A1 (en) * 2011-03-22 2012-09-27 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
US20130206070A1 (en) 2012-02-10 2013-08-15 Well Thin Technology, Ltd. Deposition ring
US20140262763A1 (en) 2013-03-14 2014-09-18 Applied Materials, Inc. Selectively groundable cover ring for substrate process chambers
USD716239S1 (en) 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD711331S1 (en) 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
US20160322250A1 (en) 2014-05-15 2016-11-03 Infineon Technologies Ag Wafer Releasing
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
USD812014S1 (en) 2015-07-30 2018-03-06 Japan Aviation Electronics Industry, Limited Ring for holding the connections of the connectors
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US20220344134A1 (en) 2018-01-19 2022-10-27 Applied Materials, Inc. Process kit for a substrate support
US20190259647A1 (en) 2018-02-17 2019-08-22 Applied Materials, Inc. Deposition ring for processing reduced size substrates
US20190259635A1 (en) 2018-02-17 2019-08-22 Applied Materials, Inc. Process kit for processing reduced sized substrates
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
US20200194243A1 (en) 2018-12-17 2020-06-18 Applied Materials, Inc. Process kit having tall deposition ring for pvd chamber
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1040304S1 (en) 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US20200234928A1 (en) 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct
US11798823B2 (en) 2019-11-18 2023-10-24 SCREEN Holdings Co., Ltd. Light irradiation type thermal process apparatus using a gas ring
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
TWD217060S (en) 2020-06-02 2022-02-11 美商應用材料股份有限公司 Enclosure system shelf of a substrate processing system
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US20220157572A1 (en) 2020-11-18 2022-05-19 Applied Materials, Inc. Deposition ring for thin substrate handling via edge clamping
US20220165551A1 (en) 2020-11-23 2022-05-26 Advanced Micro-Fabrication Equipment Inc. China Bottom electrode assembly, plasma processing apparatus, and method of replacing focus ring
USD1005245S1 (en) 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
US20220406573A1 (en) 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber
JP1747664S (en) 2022-08-04 2023-06-29 Deposition ring in process kit for semiconductor substrate processing
JP1747764S (en) * 2022-08-04 2023-06-30 Grounding ring of process kit for semiconductor substrate processing
JP1747763S (en) 2022-08-04 2023-06-30 Deposition ring in process kit for semiconductor substrate processing
US20240044002A1 (en) * 2022-08-04 2024-02-08 Applied Materials, Inc. Substrate Handling System, Method, and Apparatus
USD1034493S1 (en) 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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Publication number Publication date
TWD227852S (en) 2023-10-01
JP1747764S (en) 2023-06-30

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