USD1054390S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD1054390S1
USD1054390S1 US29/865,043 US202229865043F USD1054390S US D1054390 S1 USD1054390 S1 US D1054390S1 US 202229865043 F US202229865043 F US 202229865043F US D1054390 S USD1054390 S US D1054390S
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semiconductor device
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US29/865,043
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English (en)
Inventor
Tomohiro Yamaji
Kohei Matsuura
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NEC Corp
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NEC Corp
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Assigned to NEC CORPORATON reassignment NEC CORPORATON ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMAJI, TOMOHIRO, Matsuura, Kohei
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US29/865,043 2022-01-05 2022-07-05 Semiconductor device Active USD1054390S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-000078 2022-01-05
JP2022000078F JP1725479S (enrdf_load_stackoverflow) 2022-01-05 2022-01-05

Publications (1)

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USD1054390S1 true USD1054390S1 (en) 2024-12-17

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US (1) USD1054390S1 (enrdf_load_stackoverflow)
JP (1) JP1725479S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1083643S1 (en) * 2021-05-18 2025-07-15 Edge Foundry Co., Ltd Infrared thermal image sensor

Citations (37)

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USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5801434A (en) * 1995-08-30 1998-09-01 Nec Corporation TAB tape and semiconductor device including TAB tape
US6097082A (en) * 1997-11-21 2000-08-01 Nec Corporation Semiconductor device
US6285069B1 (en) * 1998-04-10 2001-09-04 Nec Corporation Semiconductor device having improved parasitic capacitance and mechanical strength
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD532757S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
USD532756S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
USD533847S1 (en) * 2005-11-02 2006-12-19 Supernova Optoelectronics Corp. Electrode layer
USD534133S1 (en) * 2005-04-18 2006-12-26 Murata Manufacturing Co., Ltd. Semiconductor module
USD534134S1 (en) * 2005-11-02 2006-12-26 Supernova Optoelectronics Corp. Electrode layer
USD534506S1 (en) * 2005-11-02 2007-01-02 Supernova Optoelectronics Corp. Electrode layer
USD540273S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD566060S1 (en) * 2005-04-13 2008-04-08 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
US20090057925A1 (en) * 2007-08-28 2009-03-05 Nec Electronics Corporation Semiconductor apparatus
US8012868B1 (en) * 2008-12-15 2011-09-06 Amkor Technology Inc Semiconductor device having EMI shielding and method therefor
US8148816B2 (en) * 2007-01-11 2012-04-03 Nec Corporation Semiconductor device
US8217500B1 (en) * 2010-05-07 2012-07-10 Altera Corporation Semiconductor device package
US8373284B2 (en) * 2007-10-10 2013-02-12 Nec Corporation Semiconductor device
US8796839B1 (en) * 2011-01-07 2014-08-05 Marvell International Ltd. Semiconductor package including a power plane and a ground plane
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
US20230068670A1 (en) * 2021-09-01 2023-03-02 Hojet Technology Co., Ltd. Compound metal lid for semiconductor chip package
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board
USD986840S1 (en) * 2020-05-13 2023-05-23 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
US20230170226A1 (en) * 2021-11-29 2023-06-01 Infineon Technologies Ag Semiconductor package with metal posts from structured leadframe
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5801434A (en) * 1995-08-30 1998-09-01 Nec Corporation TAB tape and semiconductor device including TAB tape
US6097082A (en) * 1997-11-21 2000-08-01 Nec Corporation Semiconductor device
US6285069B1 (en) * 1998-04-10 2001-09-04 Nec Corporation Semiconductor device having improved parasitic capacitance and mechanical strength
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD566060S1 (en) * 2005-04-13 2008-04-08 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD577691S1 (en) * 2005-04-13 2008-09-30 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD534133S1 (en) * 2005-04-18 2006-12-26 Murata Manufacturing Co., Ltd. Semiconductor module
USD540273S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD532756S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
USD533847S1 (en) * 2005-11-02 2006-12-19 Supernova Optoelectronics Corp. Electrode layer
USD534134S1 (en) * 2005-11-02 2006-12-26 Supernova Optoelectronics Corp. Electrode layer
USD534506S1 (en) * 2005-11-02 2007-01-02 Supernova Optoelectronics Corp. Electrode layer
USD532757S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
US8148816B2 (en) * 2007-01-11 2012-04-03 Nec Corporation Semiconductor device
US20090057925A1 (en) * 2007-08-28 2009-03-05 Nec Electronics Corporation Semiconductor apparatus
US8373284B2 (en) * 2007-10-10 2013-02-12 Nec Corporation Semiconductor device
US8012868B1 (en) * 2008-12-15 2011-09-06 Amkor Technology Inc Semiconductor device having EMI shielding and method therefor
US8217500B1 (en) * 2010-05-07 2012-07-10 Altera Corporation Semiconductor device package
US8796839B1 (en) * 2011-01-07 2014-08-05 Marvell International Ltd. Semiconductor package including a power plane and a ground plane
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD986840S1 (en) * 2020-05-13 2023-05-23 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
US20230068670A1 (en) * 2021-09-01 2023-03-02 Hojet Technology Co., Ltd. Compound metal lid for semiconductor chip package
US20230170226A1 (en) * 2021-11-29 2023-06-01 Infineon Technologies Ag Semiconductor package with metal posts from structured leadframe

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/845,090, filed Jul. 5, 2022, Tomohiro Yamaji et al.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1083643S1 (en) * 2021-05-18 2025-07-15 Edge Foundry Co., Ltd Infrared thermal image sensor

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