USD1049065S1 - Semiconductor package - Google Patents

Semiconductor package Download PDF

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Publication number
USD1049065S1
USD1049065S1 US29/798,851 US202129798851F USD1049065S US D1049065 S1 USD1049065 S1 US D1049065S1 US 202129798851 F US202129798851 F US 202129798851F US D1049065 S USD1049065 S US D1049065S
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US
United States
Prior art keywords
semiconductor package
view
ornamental design
semiconductor
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/798,851
Inventor
Yun hwa CHOI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JMJ Korea Co Ltd
Original Assignee
JMJ Korea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JMJ Korea Co Ltd filed Critical JMJ Korea Co Ltd
Priority to US29/798,851 priority Critical patent/USD1049065S1/en
Assigned to JMJ KOREA CO., LTD. reassignment JMJ KOREA CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOI, YUN HWA
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Publication of USD1049065S1 publication Critical patent/USD1049065S1/en
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Description

FIG. 1 is a front view of a semiconductor package showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
The broken lines illustrate portions of the article and environmental subject matter that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor package as shown and described.
US29/798,851 2021-07-12 2021-07-12 Semiconductor package Active USD1049065S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/798,851 USD1049065S1 (en) 2021-07-12 2021-07-12 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/798,851 USD1049065S1 (en) 2021-07-12 2021-07-12 Semiconductor package

Publications (1)

Publication Number Publication Date
USD1049065S1 true USD1049065S1 (en) 2024-10-29

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ID=93212980

Family Applications (1)

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US29/798,851 Active USD1049065S1 (en) 2021-07-12 2021-07-12 Semiconductor package

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US (1) USD1049065S1 (en)

Citations (32)

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USD269084S (en) * 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
US5861721A (en) * 1996-11-25 1999-01-19 Beacon Light Products, Inc. Smooth switching module
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
USD483011S1 (en) * 2001-11-29 2003-12-02 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD487723S1 (en) * 2001-11-29 2004-03-23 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD488125S1 (en) * 2001-11-29 2004-04-06 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD488773S1 (en) * 2001-11-29 2004-04-20 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD489038S1 (en) * 2001-11-29 2004-04-27 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
US20060255362A1 (en) * 2005-04-22 2006-11-16 Ralf Otremba Semiconductor Component in a Standard Housing and Method for the Production Thereof
US20070012947A1 (en) * 2002-07-15 2007-01-18 International Rectifier Corporation Direct FET device for high frequency application
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
US20090057854A1 (en) * 2007-08-28 2009-03-05 Gomez Jocel P Self locking and aligning clip structure for semiconductor die package
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
US20170271229A1 (en) * 2016-03-21 2017-09-21 Infineon Technologies Ag Spatially selective roughening of encapsulant to promote adhesion with functional structure
US20180012826A1 (en) * 2016-07-08 2018-01-11 Rohm Co., Ltd. Method of manufacturing semiconductor device and semiconductor device
USD823256S1 (en) * 2017-02-15 2018-07-17 Izzy Industries Inc. Grounding strap head
US20200066620A1 (en) * 2017-04-24 2020-02-27 Rohm Co., Ltd. Semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
US20230245954A1 (en) * 2020-07-13 2023-08-03 Rohm Co., Ltd. Semiconductor device, and production method for semiconductor device
US20230299036A1 (en) * 2020-08-05 2023-09-21 Rohm Co., Ltd. Semiconductor device
US20230343739A1 (en) * 2022-04-21 2023-10-26 Semiconductor Components Industries, Llc Semiconductor device including bonding covers
US20230402348A1 (en) * 2021-01-04 2023-12-14 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US20240014104A1 (en) * 2022-07-06 2024-01-11 Infineon Technologies Austria Ag Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD267942S (en) * 1980-11-21 1983-02-15 Aavid Engineering, Inc. Heat-sink for electronic semiconductor devices
USD269084S (en) * 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
US5861721A (en) * 1996-11-25 1999-01-19 Beacon Light Products, Inc. Smooth switching module
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
USD488773S1 (en) * 2001-11-29 2004-04-20 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD487723S1 (en) * 2001-11-29 2004-03-23 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD488125S1 (en) * 2001-11-29 2004-04-06 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD483011S1 (en) * 2001-11-29 2003-12-02 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD489038S1 (en) * 2001-11-29 2004-04-27 Kabushiki Kaisha Toshiba Photoelectric conversion device
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
US20070012947A1 (en) * 2002-07-15 2007-01-18 International Rectifier Corporation Direct FET device for high frequency application
US20060255362A1 (en) * 2005-04-22 2006-11-16 Ralf Otremba Semiconductor Component in a Standard Housing and Method for the Production Thereof
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
US20090057854A1 (en) * 2007-08-28 2009-03-05 Gomez Jocel P Self locking and aligning clip structure for semiconductor die package
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
US20170271229A1 (en) * 2016-03-21 2017-09-21 Infineon Technologies Ag Spatially selective roughening of encapsulant to promote adhesion with functional structure
US20180012826A1 (en) * 2016-07-08 2018-01-11 Rohm Co., Ltd. Method of manufacturing semiconductor device and semiconductor device
USD823256S1 (en) * 2017-02-15 2018-07-17 Izzy Industries Inc. Grounding strap head
US20200066620A1 (en) * 2017-04-24 2020-02-27 Rohm Co., Ltd. Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
US20230245954A1 (en) * 2020-07-13 2023-08-03 Rohm Co., Ltd. Semiconductor device, and production method for semiconductor device
US20230299036A1 (en) * 2020-08-05 2023-09-21 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
US20230402348A1 (en) * 2021-01-04 2023-12-14 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US20230343739A1 (en) * 2022-04-21 2023-10-26 Semiconductor Components Industries, Llc Semiconductor device including bonding covers
US20240014104A1 (en) * 2022-07-06 2024-01-11 Infineon Technologies Austria Ag Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Bojack IRFP260 Mosfet, available in Amazon.com, date first available Mar. 5, 2020 [online], [site visited Feb. 1, 2024], Available from the internet URL: https://www.amazon.com/dp/B085J2HQQ5/ (Year: 2020). *
Chanzon 5pcs IRFP150NPBF, available in Amazon.com, date first available Oct. 28, 2020 [online], [site visited Feb. 1, 2024], Available from the internet URL: https://www.amazon.com/Chanzon-IRFP150NPBF-Power-MOSFET-Transistor/dp/B08M3BYMWT?th=1 (Year: 2020). *
Power Amplifier Transistor, available in Amazon.com, date first available Jul. 18, 2019 [online], [site visited Feb. 1, 2024], Available from the internet URL: https://www.amazon.com/dp/B07VDLKS45/ (Year: 2019). *

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