USD1032517S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD1032517S1
USD1032517S1 US29/823,888 US202229823888F USD1032517S US D1032517 S1 USD1032517 S1 US D1032517S1 US 202229823888 F US202229823888 F US 202229823888F US D1032517 S USD1032517 S US D1032517S
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United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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Active
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US29/823,888
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English (en)
Inventor
Hideo Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARA, HIDEO
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Publication of USD1032517S1 publication Critical patent/USD1032517S1/en
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US29/823,888 2021-07-29 2022-01-20 Semiconductor module Active USD1032517S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-016449D 2021-07-29
JP2021016449F JP1711705S (enrdf_load_stackoverflow) 2021-07-29 2021-07-29

Publications (1)

Publication Number Publication Date
USD1032517S1 true USD1032517S1 (en) 2024-06-25

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US29/823,888 Active USD1032517S1 (en) 2021-07-29 2022-01-20 Semiconductor module

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US (1) USD1032517S1 (enrdf_load_stackoverflow)
JP (1) JP1711705S (enrdf_load_stackoverflow)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
US20210217741A1 (en) * 2018-06-20 2021-07-15 Rohm Co., Ltd. Semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
US20210217741A1 (en) * 2018-06-20 2021-07-15 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
International Registration No. DM/209,494, Date of the international registration: Jul. 22, 2020 (49 pages).
Office Action issued for Chinese Patent Application No. 202230025877.1, dated Jul. 19, 2023, 3 pages including English machine translation.

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JP1711705S (enrdf_load_stackoverflow) 2022-04-04

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