USD1031652S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD1031652S1
USD1031652S1 US29/823,890 US202229823890F USD1031652S US D1031652 S1 USD1031652 S1 US D1031652S1 US 202229823890 F US202229823890 F US 202229823890F US D1031652 S USD1031652 S US D1031652S
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US
United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/823,890
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English (en)
Inventor
Hideo Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARA, HIDEO
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Publication of USD1031652S1 publication Critical patent/USD1031652S1/en
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US29/823,890 2021-07-29 2022-01-20 Semiconductor module Active USD1031652S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021016450F JP1711706S (cs) 2021-07-29 2021-07-29
JP2021-016450D 2021-07-29

Publications (1)

Publication Number Publication Date
USD1031652S1 true USD1031652S1 (en) 2024-06-18

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ID=80952757

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/823,890 Active USD1031652S1 (en) 2021-07-29 2022-01-20 Semiconductor module

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US (1) USD1031652S1 (cs)
JP (1) JP1711706S (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD240046S (zh) 2024-07-02 2025-08-21 日商新電元工業股份有限公司 (日本) 半導體模組
TWD240047S (zh) 2024-07-02 2025-08-21 日商新電元工業股份有限公司 (日本) 半導體模組

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
US20210217741A1 (en) * 2018-06-20 2021-07-15 Rohm Co., Ltd. Semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
US20210217741A1 (en) * 2018-06-20 2021-07-15 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
International Registration No. DM/209,494, Date of the international registration: Jul. 22, 2020 (49 pages).
Office Action issued for Chinese Patent Application No. 202230025877.1, dated Jul. 19, 2023, 3 pages including English machine translation.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD240046S (zh) 2024-07-02 2025-08-21 日商新電元工業股份有限公司 (日本) 半導體模組
TWD240047S (zh) 2024-07-02 2025-08-21 日商新電元工業股份有限公司 (日本) 半導體模組

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