USD1015284S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD1015284S1
USD1015284S1 US29/808,052 US202129808052F USD1015284S US D1015284 S1 USD1015284 S1 US D1015284S1 US 202129808052 F US202129808052 F US 202129808052F US D1015284 S USD1015284 S US D1015284S
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United States
Prior art keywords
semiconductor module
view
design
sectional
taken along
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US29/808,052
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English (en)
Inventor
Yoshihisa Tsukamoto
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSUKAMOTO, YOSHIHISA
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US29/808,052 2021-03-19 2021-09-16 Semiconductor module Active USD1015284S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2021-5677F JP1695849S (enrdf_load_stackoverflow) 2021-03-19 2021-03-19
JP2021-005677D 2021-03-19

Publications (1)

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USD1015284S1 true USD1015284S1 (en) 2024-02-20

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US (1) USD1015284S1 (enrdf_load_stackoverflow)
JP (1) JP1695849S (enrdf_load_stackoverflow)

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD453746S1 (en) * 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD605607S1 (en) * 2007-11-13 2009-12-08 Citizen Electronics Co., Ltd. Illuminated switch
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
JP1615885S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615981S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615883S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615980S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
US20190304946A1 (en) * 2016-12-16 2019-10-03 Abb Schweiz Ag Power semiconductor module with low gate path inductance
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US20210320055A1 (en) * 2018-08-16 2021-10-14 Sumitomo Electric Industries, Ltd. Semiconductor module
US20220319975A1 (en) * 2019-07-02 2022-10-06 Rohm Co., Ltd. Semiconductor device
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
US20230037158A1 (en) * 2020-01-16 2023-02-02 Sumitomo Electric Industries, Ltd. Semiconductor module

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD453746S1 (en) * 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD605607S1 (en) * 2007-11-13 2009-12-08 Citizen Electronics Co., Ltd. Illuminated switch
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US20190304946A1 (en) * 2016-12-16 2019-10-03 Abb Schweiz Ag Power semiconductor module with low gate path inductance
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
JP1615980S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615883S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615981S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615885S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
US20210320055A1 (en) * 2018-08-16 2021-10-14 Sumitomo Electric Industries, Ltd. Semiconductor module
US20220319975A1 (en) * 2019-07-02 2022-10-06 Rohm Co., Ltd. Semiconductor device
US20230037158A1 (en) * 2020-01-16 2023-02-02 Sumitomo Electric Industries, Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,874, dated Mar. 6, 2023, 10 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,875, dated Mar. 7, 2023, 11 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,876, dated Mar. 13, 2023, 10 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,053, dated Mar. 8, 2023, 11 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,055, dated Mar. 8, 2023, 11 pages.
Notification to Make Rectification issued for Chinese Patent Application No. 202130619661.3, dated Jul. 24, 2023, 3 pages including English machine translation.
Notification to Make Rectification issued for Chinese Patent Application No. 202130619752.7, dated Jul. 24, 2023, 3 pages including English machine translation.

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