JP1695849S - - Google Patents

Info

Publication number
JP1695849S
JP1695849S JPD2021-5677F JP2021005677F JP1695849S JP 1695849 S JP1695849 S JP 1695849S JP 2021005677 F JP2021005677 F JP 2021005677F JP 1695849 S JP1695849 S JP 1695849S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-5677F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2021-5677F priority Critical patent/JP1695849S/ja
Priority to US29/808,052 priority patent/USD1015284S1/en
Application granted granted Critical
Publication of JP1695849S publication Critical patent/JP1695849S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2021-5677F 2021-03-19 2021-03-19 Active JP1695849S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2021-5677F JP1695849S (enrdf_load_stackoverflow) 2021-03-19 2021-03-19
US29/808,052 USD1015284S1 (en) 2021-03-19 2021-09-16 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2021-5677F JP1695849S (enrdf_load_stackoverflow) 2021-03-19 2021-03-19

Publications (1)

Publication Number Publication Date
JP1695849S true JP1695849S (enrdf_load_stackoverflow) 2021-09-27

Family

ID=77847398

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-5677F Active JP1695849S (enrdf_load_stackoverflow) 2021-03-19 2021-03-19

Country Status (2)

Country Link
US (1) USD1015284S1 (enrdf_load_stackoverflow)
JP (1) JP1695849S (enrdf_load_stackoverflow)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD453746S1 (en) * 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD605607S1 (en) * 2007-11-13 2009-12-08 Citizen Electronics Co., Ltd. Illuminated switch
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
JP1615980S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615883S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
US9646912B2 (en) * 2013-09-10 2017-05-09 Mitsubishi Electric Corporation Semiconductor device and semiconductor module having cooling fins
JP1528936S (enrdf_load_stackoverflow) * 2015-01-14 2015-07-13
CN110050339B (zh) * 2016-12-16 2023-12-22 日立能源有限公司 具有低栅极通路电感的功率半导体模块
JP1615981S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
JP1615885S (enrdf_load_stackoverflow) 2018-04-13 2018-10-15
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
JP7060099B2 (ja) * 2018-08-16 2022-04-26 住友電気工業株式会社 半導体モジュール
DE112020003885T5 (de) * 2019-07-02 2022-04-28 Rohm Co., Ltd. Halbleiterbauteil
WO2021144925A1 (en) * 2020-01-16 2021-07-22 Sumitomo Electric Industries, Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
JP7394038B2 (ja) * 2020-09-11 2023-12-07 株式会社東芝 半導体装置
JP1699856S (ja) * 2020-12-15 2021-11-15 半導体素子

Also Published As

Publication number Publication date
USD1015284S1 (en) 2024-02-20

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