USB428447I5 - - Google Patents

Info

Publication number
USB428447I5
USB428447I5 US428447DD USB428447I5 US B428447 I5 USB428447 I5 US B428447I5 US 428447D D US428447D D US 428447DD US B428447 I5 USB428447 I5 US B428447I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of USB428447I5 publication Critical patent/USB428447I5/en
Priority claimed from US428447A external-priority patent/US3323198A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481Internal lead connections, e.g. via connections, feedthrough structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/023Deep level dopants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemically Coating (AREA)
US428447D 1965-01-27 Pending USB428447I5 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US428447A US3323198A (en) 1965-01-27 1965-01-27 Electrical interconnections
US43642165A 1965-02-26 1965-02-26

Publications (1)

Publication Number Publication Date
USB428447I5 true USB428447I5 (pl)

Family

ID=27027760

Family Applications (3)

Application Number Title Priority Date Filing Date
US428447D Pending USB428447I5 (pl) 1965-01-27
US436421D Pending USB436421I5 (pl) 1965-01-27
US436421A Expired - Lifetime US3501342A (en) 1965-01-27 1965-02-26 Semiconductors having selectively formed conductive or metallic portions and methods of making same

Family Applications After (2)

Application Number Title Priority Date Filing Date
US436421D Pending USB436421I5 (pl) 1965-01-27
US436421A Expired - Lifetime US3501342A (en) 1965-01-27 1965-02-26 Semiconductors having selectively formed conductive or metallic portions and methods of making same

Country Status (4)

Country Link
US (3) US3501342A (pl)
DE (1) DE1590695A1 (pl)
GB (1) GB1130711A (pl)
NL (1) NL6600993A (pl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1311659A (en) * 1969-07-30 1973-03-28 Secr Defence Electrical device substrates
US3757322A (en) * 1971-02-03 1973-09-04 Hall Barkan Instr Inc Transparent touch controlled interface with interreactively related display
US3790412A (en) * 1972-04-07 1974-02-05 Bell Telephone Labor Inc Method of reducing the effects of particle impingement on shadow masks
CH575166A5 (pl) * 1974-05-20 1976-04-30 Suisse Horlogerie
CA1047654A (en) * 1974-10-17 1979-01-30 Norman Rain Electrodeposition on semiconductor material
US5032538A (en) * 1979-08-10 1991-07-16 Massachusetts Institute Of Technology Semiconductor embedded layer technology utilizing selective epitaxial growth methods
GB2136203B (en) * 1983-03-02 1986-10-15 Standard Telephones Cables Ltd Through-wafer integrated circuit connections
US4540620A (en) * 1983-10-19 1985-09-10 Phillips Petroleum Company Conductive patterns in polymeric films
GB2150749B (en) * 1983-12-03 1987-09-23 Standard Telephones Cables Ltd Integrated circuits
US5051811A (en) * 1987-08-31 1991-09-24 Texas Instruments Incorporated Solder or brazing barrier
DE69324067T2 (de) * 1992-06-08 1999-07-15 Synaptics Inc Objekt-Positionsdetektor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1011528B (de) * 1954-05-17 1957-07-04 Licentia Gmbh Verfahren zur Oberflaechenbehandlung eines Kristalles aus einer halbleitenden Verbindung
GB847927A (en) * 1955-10-11 1960-09-14 Philco Corp A method and apparatus for the electrolytic treatment of semiconductive bodies
US3056881A (en) * 1961-06-07 1962-10-02 United Aircraft Corp Method of making electrical conductor device
US3323198A (en) * 1965-01-27 1967-06-06 Texas Instruments Inc Electrical interconnections

Also Published As

Publication number Publication date
US3501342A (en) 1970-03-17
USB436421I5 (pl)
NL6600993A (pl) 1966-07-28
GB1130711A (en) 1968-10-16
DE1590695A1 (de) 1970-05-21

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