US9271391B2 - Multilayer wiring board - Google Patents

Multilayer wiring board Download PDF

Info

Publication number
US9271391B2
US9271391B2 US13/899,243 US201313899243A US9271391B2 US 9271391 B2 US9271391 B2 US 9271391B2 US 201313899243 A US201313899243 A US 201313899243A US 9271391 B2 US9271391 B2 US 9271391B2
Authority
US
United States
Prior art keywords
wiring board
multilayer wiring
ground
dielectric layer
coaxial structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US13/899,243
Other languages
English (en)
Other versions
US20130313003A1 (en
Inventor
Hiroshi Okayama
Toru Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WAKA Manufacturing CO Ltd
Original Assignee
WAKA Manufacturing CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WAKA Manufacturing CO Ltd filed Critical WAKA Manufacturing CO Ltd
Assigned to WAKA MANUFACTURING CO., LTD. reassignment WAKA MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAYAMA, HIROSHI, TAKADA, TORU
Publication of US20130313003A1 publication Critical patent/US20130313003A1/en
Application granted granted Critical
Publication of US9271391B2 publication Critical patent/US9271391B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Definitions

  • the present invention relates to a multilayer wiring board used for a high-frequency signal interface or the like, and more particularly to a multilayer wiring board to which a coaxial structure such as a connector is connected.
  • a center conductor of the small-sized connector is brought into close contact with a high-frequency signal line of the circuit board.
  • An outer conductor of the small-sized connector is brought into close contact with a ground electrode of the circuit board, which is formed on the same plane as the high-frequency signal line.
  • a ground layer is formed on a rear face of a circuit board as in the case of a microstrip line, a ground electrode formed on a front face of the circuit board is electrically connected to the ground layer formed on the rear face of the circuit board via through holes. In this manner, connection of high-frequency signals is established between the small-sized connector and the circuit board.
  • FIGS. 1A and 1B show a conventional example of a multilayer wiring board.
  • a multilayer wiring board 200 has a dielectric layer 500 , a high-frequency signal line 400 formed on a surface of the dielectric layer 500 for transmitting high-frequency signals, and a ground layer 600 .
  • the multilayer wiring board 200 has a control signal layer 900 for forming a control signal circuit that controls devices mounted on the multilayer wiring board 200 .
  • the characteristic impedance is likely to be discontinuous at a connection portion between a small-sized connector and a multilayer wiring board.
  • the signal band is so wide as to arise a serious problem of quality degradation of signal waveforms that is caused by discontinuous characteristic impedance.
  • the amount of signal reflection increases at a discontinuous point of the characteristic impedance, thus deteriorating the flatness of the transmission-frequency characteristics. As a result, the waveform quality of high-speed data signals is degraded.
  • a center conductor 300 of the small-sized connector 100 is connected to the high-frequency signal line 400 formed on the surface of the dielectric layer 500 .
  • Projecting portions 1000 A of an outer conductor 1000 of the small-sized connector 100 which serves as a ground, are connected to ground electrodes 1200 formed on the surface of the dielectric layer 500 .
  • the ground electrodes 1200 on the dielectric layer 500 which also has the high-frequency signal line 400 formed thereon, are electrically connected to the ground layer 600 via a plurality of through holes 130 .
  • each of those through holes 130 has a thickness corresponding to the thickness of the dielectric layer 500 and thus has a finite inductance. Therefore, provision of many through holes cannot sufficiently reduce a ground inductance at a connection portion between the coaxial structure (connector) and the circuit board. Accordingly, impedance discontinuity thus caused results in deterioration of frequency characteristics in transmission of high-frequency signals. Furthermore, for wide-band and high-frequency signals, such as high-speed data signals, variations in location and dimension of the through holes 130 being formed exert additional influences, make it difficult to obtain good frequency characteristics.
  • the present invention has been made in view of the above drawbacks. It is, therefore, an object of the present invention to provide a multilayer wiring board capable of ensuring good frequency characteristics at a connection portion between a coaxial structure such as a connector and the multilayer wiring board so as to solve a problem of an increased ground inductance at the connection portion.
  • a multilayer wiring board to which a coaxial structure for transmitting an electric signal with a center conductor and an outer conductor is connected.
  • the multilayer wiring board includes a first dielectric layer, a high-frequency signal line formed on a first surface of the first dielectric layer, a ground layer formed on a second surface of the first dielectric layer, and a second dielectric layer covering part of the ground layer.
  • the high-frequency signal line is electrically connectable to the center conductor of the coaxial structure.
  • the second dielectric layer is spaced from an edge of the first dielectric layer to which the coaxial structure is to be connected, so that a ground exposure portion of the ground layer is exposed on the edge of the first dielectric layer.
  • the ground layer is electrically connectable directly to the outer conductor of the coaxial structure at the ground exposure portion.
  • the multilayer wiring board has a multilayer structure including a dielectric layer having a high-frequency line, a ground layer, and a control signal layer for forming a control signal circuit.
  • a coaxial structure capable of transmitting an electric signal with a center conductor and an outer conductor is connected to the multilayer wiring board.
  • a ground exposure portion of the ground layer is exposed at a connection portion at which the coaxial structure is connected to the multilayer wiring board.
  • a connection structure is provided at the connection portion to connect the ground exposure portion of the ground layer directly to the outer conductor of the coaxial structure for electrical conduction between the ground exposure portion of the ground layer and the outer conductor of the coaxial structure.
  • the ground exposure portion of the ground layer may electrically be connected to the outer conductor of the coaxial structure by a solder material, silver paste, or a conductive adhesive material applied to the ground exposure portion.
  • the ground exposure portion of the ground layer may electrically be connected to the outer conductor of the coaxial structure by a contact protrusion extending from the outer conductor of the coaxial structure.
  • the multilayer wiring board may further include a control signal layer formed on a surface of the second dielectric layer for forming a control signal circuit.
  • the coaxial structure may be a connector to be mounted on the multilayer wiring board.
  • FIG. 1A is a side view showing an example of a conventional multilayer wiring board with a small-sized connector
  • FIG. 1B is a cross-sectional view taken along line A-A of FIG. 1A ;
  • FIG. 2A is a plan view schematically showing a configuration of a multilayer wiring board with a small-sized connector according to a first embodiment of the present invention
  • FIG. 2B is a cross-sectional view taken along line B-B of FIG. 2A ;
  • FIG. 2C is a cross-sectional view taken along line C-C of FIG. 2B ;
  • FIG. 3A is a plan view schematically showing a configuration of the multilayer wiring board according to the first embodiment of the present invention.
  • FIG. 3B is a cross-sectional view taken along line D-D of FIG. 3A ;
  • FIG. 3C is a plan view showing that a connector is to be mounted onto the multilayer wiring board of FIG. 3A .
  • FIG. 4 is a diagram schematically showing a configuration of a multilayer wiring board with a small-sized connector according to a second embodiment of the present invention
  • FIG. 5A is a graph showing results of measuring frequency characteristics of transmission and reflection of high-frequency signals for a multilayer wiring board according to the present invention, for the purposes of comparison.
  • FIG. 5B is a graph showing results of measuring frequency characteristics of transmission and reflection of high-frequency signals for a conventional multilayer wiring board, for the purposes of comparison.
  • FIG. 6A is a diagram schematically showing a configuration of a multilayer wiring board with a small-sized connector according to a third embodiment of the present invention.
  • FIG. 6B is a cross-sectional view taken along line E-E of FIG. 6A .
  • FIGS. 2A to 6B A multilayer wiring board according to embodiments of the present invention will be described below with reference to FIGS. 2A to 6B .
  • Like or corresponding parts are denoted by like or corresponding reference numerals throughout drawings, and will not be described below repetitively.
  • FIGS. 2A to 2C are diagrams schematically showing a configuration of a multilayer wiring board 2 according to a first embodiment of the present invention.
  • a small-sized connector 1 which corresponds to a coaxial structure according to the present invention, is mounted on the multilayer wiring board 2 .
  • FIG. 2A is a plan view of the multilayer wiring board 2
  • FIG. 2B is a cross-sectional view taken along line B-B of FIG. 2A
  • FIG. 2C is a cross-sectional view taken along line C-C of FIG. 2B .
  • the multilayer wiring board 2 has a multilayered structure including a first dielectric layer 5 having a high-frequency signal line 4 formed on an upper surface thereof, a ground layer 6 formed on a lower surface of the first dielectric layer 5 , a second dielectric layer 20 covering part of the ground layer 6 , and at least one control signal layer 9 for forming a control signal circuit, and a third dielectric layer 22 . At least one small-sized connector 1 is mounted onto the multilayer wiring board 2 .
  • the line formation of the high-frequency signal line 4 is of a grounded coplanar type, which has ground electrode portions 12 formed on both sides of the central signal line 4 as shown in FIG. 3A .
  • Each of the ground electrode portions 12 has a plurality of through holes 13 formed therein.
  • the small-sized connector 1 has a center conductor 3 and a cylindrical outer conductor 10 with two projecting portions 10 A (see FIG. 2A ).
  • the through holes 13 are used to electrically connect the projecting portions 10 A of the outer conductor 10 of the small-sized connector 1 to the ground layer 6 . From a state shown in FIG. 3C where the small-sized connector 1 has not been mounted on the multilayer wiring board 2 , the small-sized connector 1 is mounted onto the multilayer wiring board 2 as shown in FIG.
  • the center conductor 3 of the small-sized connector 1 is brought into electrical contact with the high-frequency signal line 4 of the multilayer wiring board 2 at the shortest distance (for example, by joint, bonding, or adhesion).
  • the center conductor 3 of the small-sized connector 1 may be joined to the high-frequency signal line 4 of the multilayer wiring board 2 by a solder material, silver paste, or the like, or may be bonded to the high-frequency signal line 4 of the multilayer wiring board 2 by a conductive adhesive material.
  • the high-frequency signal line 4 is formed on the upper surface (first surface) of the dielectric layer 5
  • the ground layer 6 is formed on the lower surface (second surface) of the dielectric layer 5 .
  • the width of the high-frequency signal line 4 and the thickness of the dielectric layer 5 are determined such that the characteristic impedance of the high-frequency signals is made equal to a predetermined value by the high-frequency signal line 4 and the ground layer 6 .
  • the ground layer 6 is exposed so as to form a ground exposure portion 6 A at a connection portion 7 of the multilayer wiring board 2 at which the small-sized connector 1 is mounted on the multilayer wiring board 2 .
  • the control signal layer 9 in which a control signal circuit is provided is formed in an area 8 other than the connection portion 7 of the multilayer wiring board 2 . More specifically, as shown in FIG. 2B , the second dielectric layer 20 is spaced from an edge of the first dielectric layer 5 , so that a portion of the ground layer 6 is exposed on the edge of the first dielectric layer 5 (connection portion 7 ) to thus form a ground exposure portion 6 A.
  • connection structure 11 is provided in the connection portion 7 for electrically connecting the ground exposure portion 6 A of the ground layer 6 to the outer conductor 10 of the small-sized connector 1 .
  • the connection structure 11 may be formed of a solder material, silver paste, or a conductive adhesive material applied to the ground exposure portion 6 A.
  • the outer conductor 10 and the ground layer 6 are connected directly to each other and are thus brought into satisfactory conduction with each other. Therefore, a high-frequency signal line for the ground can be formed by the shortest distance of connection. Thus, the ground inductance of the small-sized connector 1 and the multilayer wiring board 2 is prevented from increasing, thereby ensuring the waveform quality of high-speed data signals.
  • FIG. 4 is a diagram schematically showing a configuration of a multilayer wiring board with a small-sized connector according to a second embodiment of the present invention.
  • FIG. 4 corresponds to FIG. 2C .
  • a portion of the ground layer 6 is exposed at the connection portion 7 at which the small-sized connector 1 is mounted on the multilayer wiring board 2 , and the control signal layer 9 in which a control signal circuit is provided is formed in an area 8 other than the connection portion 7 of the multilayer wiring board 2 (see FIG. 2B ).
  • only a portion of the ground exposure portion 6 A of the ground layer 6 that is located near a portion opposed to the center conductor 3 of the small-sized connector 1 is electrically connected to the outer conductor 10 of the small-sized connector 1 in order to prevent the ground inductance from increasing at the connection portion 7 when the outer conductor 10 of the small-sized connector 1 and the ground exposure portion 6 A of the ground layer 6 are brought into conduction with each other.
  • a joining member 15 such as a solder material or silver paste is filled between the ground exposure portion 6 A of the ground layer 6 and the outer conductor 10 of the small-sized connector 1 such that a portion of the ground exposure portion 6 A of the ground layer 6 that is located near a portion opposed to the center conductor 3 , for example, a portion 14 of the ground exposure portion 6 A located right below the center conductor 3 (see FIG. 3B ) is brought into conduction with the outer conductor 10 of the small-sized connector 1 .
  • the ground exposure portion 6 A of the ground layer 6 and the outer conductor 10 of the small-sized connector 1 are electrically connected to each other.
  • the density of electric lines of force between the center conductor 3 of the small-sized connector 1 and the ground surface is the highest near the portion opposed to the center conductor 3 .
  • the density of electric lines of force is the highest at the portion 14 located right below the center conductor 3 , i.e., a portion located at the shortest distance from the ground surface.
  • the ground exposure portion 6 A of the ground layer 6 is connected to the outer conductor 10 with the shortest distance by the joining member 15 on the portion 14 located right below the center conductor 3 . Therefore, disturbance of the electric lines of force between the high-frequency signal line 4 and the ground layer 6 are minimized at the connection portion 7 (see FIG. 2B ) between the small-sized connector 1 and the multilayer wiring board 2 . As a result, the ground inductance is prevented from increasing at the connection portion 7 . Thus, satisfactory high-frequency transmission characteristics can be achieved.
  • FIGS. 5A and 5B show measurement results of frequency characteristics of transmission and reflection of high-frequency signals in an example using a multilayer wiring board with a small-sized connector according to the present invention and a comparative example using a conventional multilayer wiring board with a small-sized connector.
  • through lines were formed with a length of 10 mm.
  • FIG. 5A shows the results for the multilayer wiring board according to the present invention
  • FIG. 5B shows the results for the conventional multilayer wiring board. Comparison of those results reveals that the through line according to the present invention exhibited less reflection and demonstrated more flatness of the transmission-frequency characteristic.
  • the ground exposure portion 6 A of the ground layer 6 is electrically connected to the outer conductor 10 at the shortest distance by the joining member 15 on the portion 14 located right below the center conductor 3 . Accordingly, the discontinuity of the characteristic impedance is mitigated as compared to the conventional technology as shown in FIGS. 1A and 1B . Therefore, according to the present embodiment, the discontinuity of the characteristic impedance can be reduced so as to prevent quality degradation of waveforms of high-speed data signals.
  • FIGS. 6A and 6B are diagrams schematically showing a configuration of a multilayer wiring board with a small-sized connector according to a third embodiment of the present invention.
  • the joining member 15 is filled between the portion 14 located right below the center conductor 3 and the outer conductor 10 of the small-sized connector 1 .
  • the shape of the small-sized connector 1 may be changed so as to have a contact protrusion 17 extending from the outer conductor 10 of the small-sized connector 1 .
  • This contact protrusion 17 may be adhered to and brought into direct contact with the ground exposure portion 6 A of the ground layer 6 right below the center conductor 3 .
  • the line formation of the high-frequency signal line 4 may not be of a grounded coplanar type and may be of a microstrip type, which has no ground patterns on the top side of a multilayer wiring board.
  • the present invention is applicable to such a line formation, and the same advantageous effects can also be obtained in such a case.
  • the above embodiments illustrate examples in which the outer conductor 10 of the small-sized connector 1 is connected to the ground layer 6 via the through holes 13 . Nevertheless, no through holes 13 may be formed in the multilayer wiring board 2 as long as the outer 10 of the small-sized connector 1 is electrically connected directly to the ground exposure portion 6 A of the ground layer 6 .
  • a multilayer wiring board with a small-sized connector has been described in the above embodiments of the present invention, the present invention is not limited to the aforementioned embodiments. It should be understood that those skilled in the art would make any modifications to the above embodiments within the scope of the present invention.
  • a high-frequency coaxial cable may be used as a coaxial structure to be mounted on and connected to a multilayer wiring board.
  • the present invention is also effective in such a case. Specifically, when an outer conductor of a high-frequency coaxial cable is connected to a ground layer of a multilayer wiring board, the outer conductor of the high-frequency coaxial cable is connected directly to a ground exposure portion of the ground layer formed in the multilayer wiring board. With such an arrangement, the ground inductance is prevented from increasing, so that influence on the waveform quality of high-frequency data signals can be reduced.
  • the ground layer of the multilayer wiring board is connected directly to the outer conductor of the coaxial structure. Therefore, the ground inductance is prevented from increasing, so that high-frequency connection having flat transmission-frequency characteristics and less reflection can be achieved between the coaxial structure and the multilayer wiring board. Accordingly, quality degradation of waveforms of high-speed data signals is suppressed.
  • the present invention is advantageous to a multilayer wiring board on which a small-sized connector is to be mounted.
  • the present invention is advantageous to a multilayer wiring board with a small-sized connector that has increasingly been desired to be reduced in size.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
US13/899,243 2012-05-28 2013-05-21 Multilayer wiring board Expired - Fee Related US9271391B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-121419 2012-05-28
JP2012121419 2012-05-28

Publications (2)

Publication Number Publication Date
US20130313003A1 US20130313003A1 (en) 2013-11-28
US9271391B2 true US9271391B2 (en) 2016-02-23

Family

ID=49620704

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/899,243 Expired - Fee Related US9271391B2 (en) 2012-05-28 2013-05-21 Multilayer wiring board

Country Status (2)

Country Link
US (1) US9271391B2 (pt)
JP (1) JP6002083B2 (pt)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9640913B1 (en) * 2015-12-31 2017-05-02 Uniconn Corp. Electrical connector
US20180138615A1 (en) * 2016-11-14 2018-05-17 Hirose Electric Co., Ltd. Structure for connecting board and connector, board, and method for connecting board and connector
US10971838B1 (en) * 2019-11-14 2021-04-06 Chun-Te Lee Combination structure of clamping member and circuit board for signal connector

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7005116B2 (ja) * 2019-04-23 2022-01-21 矢崎総業株式会社 回路モジュールと回路モジュールの製造方法
CN114512868A (zh) * 2022-01-19 2022-05-17 中国电子科技集团公司第十研究所 键合式射频同轴连接器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040057220A1 (en) * 2002-09-19 2004-03-25 Nec Corporation Electronic apparatus
US20040248437A1 (en) 2003-06-03 2004-12-09 Wong Marvin Glenn Reinforced substrates having edge-mount connectors
US20110247209A1 (en) * 2006-04-21 2011-10-13 National Institute Of Advanced Industrial Science And Technology Method of making contact probe
US20120184135A1 (en) * 2010-06-07 2012-07-19 Andrew Llc Low PIM Coaxial Connector

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10345218B3 (de) * 2003-09-29 2004-12-30 Siemens Ag Vorrichtung zur Verbindung einer Koaxialleitung mit einer Koplanarleitung
TWI290443B (en) * 2005-05-10 2007-11-21 Via Tech Inc Signal transmission structure, wire board and connector assembly structure
WO2010061582A1 (ja) * 2008-11-26 2010-06-03 日本電気株式会社 回路モジュールの基板及びその製造方法
JP2012114365A (ja) * 2010-11-26 2012-06-14 Japan Radio Co Ltd プリント基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040057220A1 (en) * 2002-09-19 2004-03-25 Nec Corporation Electronic apparatus
US20040248437A1 (en) 2003-06-03 2004-12-09 Wong Marvin Glenn Reinforced substrates having edge-mount connectors
JP2004363593A (ja) 2003-06-03 2004-12-24 Agilent Technol Inc エッジマウント型コネクタ付き強化基板
US20110247209A1 (en) * 2006-04-21 2011-10-13 National Institute Of Advanced Industrial Science And Technology Method of making contact probe
US20120184135A1 (en) * 2010-06-07 2012-07-19 Andrew Llc Low PIM Coaxial Connector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9640913B1 (en) * 2015-12-31 2017-05-02 Uniconn Corp. Electrical connector
US20180138615A1 (en) * 2016-11-14 2018-05-17 Hirose Electric Co., Ltd. Structure for connecting board and connector, board, and method for connecting board and connector
US10148027B2 (en) * 2016-11-14 2018-12-04 Hirose Electric Co., Ltd. Structure for connecting board and connector, board, and method for connecting board and connector
US10971838B1 (en) * 2019-11-14 2021-04-06 Chun-Te Lee Combination structure of clamping member and circuit board for signal connector

Also Published As

Publication number Publication date
JP6002083B2 (ja) 2016-10-05
US20130313003A1 (en) 2013-11-28
JP2014007390A (ja) 2014-01-16

Similar Documents

Publication Publication Date Title
US11605869B2 (en) Electronic apparatus and electrical element
US7443272B2 (en) Signal transmission structure, circuit board and connector assembly structure
US8611094B2 (en) Optical module
US10042133B2 (en) Optical module
US9271391B2 (en) Multilayer wiring board
US20090135864A1 (en) Optical module
US10231327B1 (en) Optical module and optical transmission equipment
KR20170100752A (ko) 연성회로기판
US10502982B2 (en) Optical modulator
US10624204B2 (en) Optical module and optical transmission equipment
KR20120105264A (ko) 데이터 통신 선로 구조 및 데이터 통신 선로 설계 방법
US11612053B2 (en) Circuit board and electronic device
JP7063695B2 (ja) 光モジュール
US8721349B2 (en) Connector, optical transmission device, and connector connection method
JP2015204398A (ja) 光モジュール
JP5544102B2 (ja) 基板の接続方式および基板の接続方法
US11317513B2 (en) Optical module
JP2013172128A (ja) フレキシブル基板、フレキシブル基板を備えた光モジュール
JP6958396B2 (ja) フレキシブル基板及び光デバイス
US20190387626A1 (en) Electronic device
JP4883010B2 (ja) 電子部品パッケージ
JP2010016076A (ja) フレキシブルプリント基板及びこれを備えたリジッドフレキシブルプリント基板
JP2017004988A (ja) フレキシブル基板
US11984637B2 (en) Transmission line and electronic device
JP4329702B2 (ja) 高周波デバイス装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: WAKA MANUFACTURING CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OKAYAMA, HIROSHI;TAKADA, TORU;REEL/FRAME:030461/0604

Effective date: 20130501

STCF Information on status: patent grant

Free format text: PATENTED CASE

CC Certificate of correction
FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20200223