US8933616B2 - Light emitting device with spring-loaded LED-holder - Google Patents

Light emitting device with spring-loaded LED-holder Download PDF

Info

Publication number
US8933616B2
US8933616B2 US14/002,134 US201214002134A US8933616B2 US 8933616 B2 US8933616 B2 US 8933616B2 US 201214002134 A US201214002134 A US 201214002134A US 8933616 B2 US8933616 B2 US 8933616B2
Authority
US
United States
Prior art keywords
connection
led
spring
module
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US14/002,134
Other versions
US20130334953A1 (en
Inventor
Merijn Keser
Wouter Oepts
Edwin Petrus Helena Van Lier
Ralph Hubert Peters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Signify Holding BV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N.V. reassignment KONINKLIJKE PHILIPS ELECTRONICS N.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PETERS, RALPH HUBERT, OEPTS, WOUTER, VAN LIER, EDWIN PETRUS HELENA, KESER, MERIJN
Publication of US20130334953A1 publication Critical patent/US20130334953A1/en
Application granted granted Critical
Publication of US8933616B2 publication Critical patent/US8933616B2/en
Assigned to PHILIPS LIGHTING HOLDING B.V. reassignment PHILIPS LIGHTING HOLDING B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS N.V.
Assigned to SIGNIFY HOLDING B.V. reassignment SIGNIFY HOLDING B.V. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: PHILIPS LIGHTING HOLDING B.V.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V29/004
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/06Electrode terminals
    • F21V29/20
    • F21V29/246
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • F21Y2101/02
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a LED-based light-emitting device.
  • LED-based light-emitting devices are becoming more and more popular.
  • One of the reasons for this popularity is the long lifetime of LEDs (light-emitting diodes).
  • the lifetime of currently available LED-based light-emitting devices may sometimes be limited not by the LEDs themselves, but by other parts of the light-emitting device, such as the electrical connection between LED-module and circuit board.
  • a LED-module In currently available LED-based light-emitting devices, a LED-module is often soldered to a regular printed circuit board (PCB), which may often be made of, for example, FR-4. Due to mismatch in the thermal expansion behavior of the LED-module and the PCB, temperature cycling may eventually result in defects in the solder connection between the LED-module and the PCB, which may lead to premature failure of the LED-based light-emitting device.
  • PCB printed circuit board
  • WO02/12788A1 discloses a LED assembly including an electrically and thermally conductive heat dissipater sandwiched under an electrically insulating layer with circuit traces disposed over the insulating layer to prevent electrical conduction between the traces and the heat dissipater.
  • a plurality of LEDs have electrical leads extending laterally from opposite extremities of each LED to overlie the traces for electrical contact with the traces for powering the LEDs.
  • An independent and generally U-shaped holding device as viewed in cross section, defines a base overlying the LED and a pair of legs depending therefrom and transversely to the electrical leads between the LED and the heat dissipater. The base defines a hole and the LED protrudes through the hole to emit light.
  • the insulating layer includes a void surrounding each LED and the legs of each associated holding device and each holding device includes a tensioning portion for applying a force urging the LED through the void and into thermal engagement with the heat dissipater and the electrical leads thereof into engagement with the traces.
  • a circuit board may, for example, be ceramic-based.
  • a general object of the present invention is to provide an improved LED-based light-emitting device combining a long lifetime with the potential for low cost solutions.
  • a light-emitting device comprising: an LED-module comprising at least one LED or LED die mounted on a carrier and at least one connection pad for electrical connection of the LED module; a heat dissipator for dissipating heat generated by the LED when in operation; a connection board comprising a substrate having a conductor pattern for enabling provision of external power to the LED module; an interconnecting arrangement electrically interconnecting the at least one connection pad of the LED module with the conductor pattern of the connection board; and an LED-holder pressing the LED-module against the heat dissipator to provide a thermal connection between the LED-module and the heat dissipator, wherein: the interconnecting member is configured to allow movement between the conductor pattern of the connection board and the at least one connection pad; and the LED-holder exerts a spring force to press the LED-module against the heat dissipator.
  • the present invention is based on the realization that an improved lifetime of a LED-based light-emitting device can be achieved at a lower cost than in prior art solutions by pressing the LED-module against the heat dissipator using a spring force and providing an electrical connection between the connection board and the LED-module that allows at least lateral movement between the conductor pattern of the connection board and the connection pad of the LED-module.
  • a robust electrical connection as well as good heat dissipation is provided even when there is a substantial mismatch between the coefficients of thermal expansion of the LED-module (often ceramic-based) and the connection board (typically FR-4 or similar).
  • This provides for a light-emitting device with a long lifetime and at a lower cost and/or with a greater design flexibility than other proposed solutions, such as using a connection board in the same material as the LED-module.
  • the LED-holder is advantageously formed by the connection board and at least one holding spring attached to the connection board.
  • the interconnecting arrangement comprises at least one electrically conducting connection spring attached to the connection board and in electrical contact with the conductor pattern of the connection board, the at least one connection spring exerting a spring force to press against the at least one connection pad of the LED-module to electrically interconnect the at least one connection pad of the LED-module with the conductor pattern of the connection board.
  • connection spring(s) and the connection pad(s) can be made to remain intact over a large number of cycles of relative movement between the connection spring(s) and the connection pad(s), and can thus be made more reliable than a “normal” solder connection would be.
  • the at least one connection spring may advantageously be made of metal.
  • the at least one connection spring constitutes the at least one holding spring, to simultaneously electrically interconnect the at least one connection pad of the LED-module with the conductor pattern of the connection board and press the LED-module against the heat dissipator.
  • the connection spring will fulfill two functions—to provide a reliable electrical connection between the LED-module and the connection board, and to press the LED-module against the heat dissipator to efficiently dissipate heat generated by the LED(s) comprised in the LED-module when the light-emitting device is in operation.
  • the at least one holding spring may exert a greater force on the LED-module than the at least one connection spring exerts on the LED-module.
  • the connection spring may be optimized for providing a contact force on the connection pad of the LED-module that is sufficient to provide electrical connection, but not necessarily to ensure a good thermal connection between the LED-module and the heat dissipator, while the holding spring may be dimensioned to provide a force that is sufficient to achieve a good thermal connection.
  • the at least one holding spring may advantageously be dimensioned to exert a pressure on the LED-module that is at least 20% higher than the force exerted by the at least one connection spring on the its associated contact pad(s).
  • the at least one holding spring and the at least one connection spring in this case may be provided as different portions of a single sheet of a resilient material, such as sheet metal, whereby the above-mentioned dual functionality can be achieved using a single piece comprising a holding spring portion and a connection spring portion. This provides for simple and cost-efficient manufacturing.
  • connection board may advantageously comprise an opening accommodating the LED-module, such that the LED-module is at least partly surrounded by the connection board.
  • the design of the connection board, including the position and shape of the opening can easily be adapted to different LED-modules, which simplifies upgrades etc involving using another LED-module in the light-emitting device.
  • the opening in the connection board may be substantially rectangular, and springs may be provided on opposite sides of the opening.
  • the at least one holding spring and/or the at least one connection spring may advantageously be soldered to the connection board.
  • connection board comprises a moulded interconnect device into which one end of the at least one holding spring is clamped. This clamping provides for an improved mechanical fixation of the at least one holding spring.
  • the moulded interconnect device comprises a hole filled with solder which is electrically contacting a part of the at least one holding spring. In this way the mechanical fixation of the at least one holding spring by the moulded interconnect device induces less stress on the solder.
  • the solder may electrically contact a conduction pattern of the moulded interconnect device.
  • the at least one holding spring and/or the at least one connection spring may, furthermore, be a leaf spring.
  • Leaf springs which may be made of sheet metal, can be arranged using pick-and-place machinery, and can be soldered to the connection board.
  • FIG. 1 is an exploded view of a first exemplary embodiment of the light-emitting device according to the present invention
  • FIG. 2 is an exploded view of a light-emitting device
  • FIG. 3 is a schematic cross-section of another exemplary embodiment of the light-emitting device according to the present invention.
  • connection board has a rectangular opening that completely surrounds the LED-module and sheet metal leaf springs are soldered to the connection board.
  • the scope of the invention which is equally applicable to other light-emitting devices having an LED-holder that exerts a spring force to press the LED-module against the heat dissipator and an interconnecting member that allows movement between the connection pad(s) of the LED-module and the conductor pattern of the connection board.
  • springs such as one or several helical springs or plate springs, could be used to press the LED-module against the heat dissipator.
  • the interconnecting member may provide the desired relative lateral movement by other means, such as through a flexible wire that is electrically connected to the conductor pattern of the connection board and the connection pad(s) of the LED-module.
  • FIG. 1 is an exploded view of a first embodiment of the light-emitting device according to the present invention.
  • the light-emitting device 1 comprises a heat dissipator in the form of a metal heat sink 2 , a LED-module 3 , a connection board 4 and a cover 5 .
  • the light-emitting device 1 further comprises springs 7 a - d and a connector 8 for allowing the provision of external power to the LED(s) in the LED-module 3 .
  • the springs 7 a - d and the connector 8 are soldered to a conductor pattern (not shown) of the connection board 4 so that at least two of the springs 7 a - d are connected to appropriate pins of the connector 8 .
  • the LED-module 3 is provided with at least one LED (covered by the lens 9 in FIG. 1 ) and two connector pads 10 a - b for allowing electrical connection to the LEDs. Furthermore, the connection board has a rectangular opening 6 that accommodates the LED-module 3 .
  • the springs 7 a - d will press against the connector pads 10 a - b of the LED-module 3 when the light-emitting device 1 is assembled, so that electrical connection between the connector 8 and the LEDs is achieved while at the same time pressing the LED-module 3 against the heat sink 2 .
  • the springs 7 a - d perform the double function of providing electrical connection between the appropriate pins of the connector 8 and the LEDs of the LED-module 3 and pressing the LED-module against the heat sink 2 .
  • FIG. 2 schematically shows a light-emitting device 20 , which differs from that described above with reference to FIG. 1 in that the electrical connection between the connector pads 10 a - b of the LED-module 3 and the connector 8 and the pressing of the LED-module 3 against the heat sink 2 is achieved by spring arrangements 21 a - b made of sheet metal.
  • the spring arrangements 21 a - b are, as can be seen in FIG. 2 , attached to the connection board 4 on opposite sides of the substantially rectangular opening 6 .
  • each of the spring arrangements 21 a - b comprises a connection spring portion 23 and a holding spring portion 22 .
  • connection spring portion 23 has a relatively narrow profile and the holding spring portion 22 has a relatively wide profile, which means that the holding spring portion 22 has a higher spring constant than the connection spring portion.
  • the connection spring portion 22 is dimensioned so that the force exerted by the connection spring portion 23 on the connection pad(s) 10 a - b of the LED-module 3 becomes sufficiently high to achieve a reliable electrical connection between the connection spring portion 23 and the connection pad(s) 10 a - b , but not so high that it results in contact surface wear over time.
  • the connection spring portion 23 is dimensioned to achieve the function of electrically interconnecting the connection pad(s) of the LED-module with the conductor pattern of the connection board 4 .
  • the holding spring portion 22 is dimensioned to exert a substantially higher force on the LED-module 3 when the light-emitting device 20 is assembled.
  • FIG. 3 is a schematic cross-section of an embodiment of a light-emitting device 30 according to the present invention.
  • the light-emitting device 30 is in most aspects similar to the embodiments described with reference to FIG. 1 , the main difference being the connection board which for this embodiment is a molded interconnect device (MID) 31 .
  • the light-emitting device 30 comprises the heat dissipator in the form of the metal heat sink 2 , the LED-module 3 and the MID 31 .
  • the LED-module 3 is provided with at least one LED (covered by the lens 9 ) and two connector pads 10 a - b for allowing electrical connection to the LEDs of which only connector pad 10 a is shown in FIG. 3 .
  • the light-emitting device 30 further comprises the springs 7 a - d of which only the spring 7 b is shown in FIG. 3 .
  • the springs 7 a - d have similar properties as described with reference to FIG. 1 .
  • one end of the springs 7 a - d is mechanically fixed in the MID 31 and the opposite end of the springs contacts and exerts a pressing force on a part of the LED module 3 , for example the connection pads 10 a - b for establishing an electrical contact.
  • the springs 7 a - d thus press against the connector pads 10 a - b of the LED-module 3 when the light-emitting device 30 is assembled, so that an electrical connection between the connector 8 and the LEDs is achieved while at the same time pressing the LED-module 3 against the heat sink 2 .
  • the springs 7 a - d are electrically connected to the conductor pattern (not shown) of the MID 31 via solder 32 that is applied in vias or openings of the MID 31 , which vias or openings expose a part of the springs 7 a - d that is clamped inside the MID 31 , and thus establishing an electrical interconnection from the conductor pattern of the MID 31 via the springs 7 a - d to the connector pads 10 a - b .
  • the MID 31 gives more freedom in choosing the shape of the connection board than a for example laminated printed circuit board. This embodiment provides for an improved reliability because the springs 7 a - d are clamped in the MID 31 , thus achieving an improved mechanical fixation.
  • the opening 6 need not completely surround the LED-module 3 .
  • the spring component it could be designed as an SMD component (as in the other examples), but also possible is a through-hole component. Or as a component that is inserted into a hole (not below PCB level) scraping into the PCB material. This way a component can be created that can accommodate a higher total force because the solder connection is not the sole interface transmitting the force.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A light-emitting device (1), comprising an LED-module (3) comprising at least one LED mounted on a carrier and at least one connection pad (10 a-b) for electrical connection of the LED module (3), a heat dissipator (2) for dissipating heat generated by the LED when in operation, a connection board (4) comprising a substrate having a conductor pattern for enabling provision of external power to the LED module (3), an interconnecting arrangement (7 a-d) comprising at least one connection spring (7 a-d) attached to the connection board (4) electrically interconnecting the at least one connection pad (10 a-b) of the LED module (3) with the conductor pattern of the connection board (4), and an LED-holder comprising at least one holding spring (7 a-d) attached to the connection board (4) exerting a spring force there by pressing the LED-module (3) against the heat dissipator (2) to provide a thermal connection between the LED-module (3) and the heat dissipator (2). The interconnecting arrangement (7 a-d) is configured to allow movement between the conductor pattern of the connection board (4) and the at least one connection pad (10 a-b). The at least one connection spring (7 a-d) constitutes the at least one holding spring (7 a-d), to simultaneously electrically interconnect the at least one connection pad (10 a-b) of the LED-module (3) with the conductor pattern of the connection board (4) and press the LED-module (3) against the heat dissipator (2).

Description

CROSS-REFERENCE TO PRIOR APPLICATIONS
This application is the U.S. National Phase application under 35 U.S.C. §371 of International Application No. PCT/IB2012/050681, filed on Feb. 15, 2012, which claims the benefit of EP11156862.2 filed on Mar. 3, 2011. These applications are hereby incorporated by reference herein.
FIELD OF THE INVENTION
The present invention relates to a LED-based light-emitting device.
BACKGROUND OF THE INVENTION
LED-based light-emitting devices are becoming more and more popular. One of the reasons for this popularity is the long lifetime of LEDs (light-emitting diodes). However, the lifetime of currently available LED-based light-emitting devices may sometimes be limited not by the LEDs themselves, but by other parts of the light-emitting device, such as the electrical connection between LED-module and circuit board.
In currently available LED-based light-emitting devices, a LED-module is often soldered to a regular printed circuit board (PCB), which may often be made of, for example, FR-4. Due to mismatch in the thermal expansion behavior of the LED-module and the PCB, temperature cycling may eventually result in defects in the solder connection between the LED-module and the PCB, which may lead to premature failure of the LED-based light-emitting device.
WO02/12788A1 discloses a LED assembly including an electrically and thermally conductive heat dissipater sandwiched under an electrically insulating layer with circuit traces disposed over the insulating layer to prevent electrical conduction between the traces and the heat dissipater. A plurality of LEDs have electrical leads extending laterally from opposite extremities of each LED to overlie the traces for electrical contact with the traces for powering the LEDs. An independent and generally U-shaped holding device, as viewed in cross section, defines a base overlying the LED and a pair of legs depending therefrom and transversely to the electrical leads between the LED and the heat dissipater. The base defines a hole and the LED protrudes through the hole to emit light. The insulating layer includes a void surrounding each LED and the legs of each associated holding device and each holding device includes a tensioning portion for applying a force urging the LED through the void and into thermal engagement with the heat dissipater and the electrical leads thereof into engagement with the traces. To solve this problem and to prolong the life of LED-based light-emitting devices, it has been proposed to replace the regular PCB with a circuit board that has a coefficient of thermal expansion that more closely matches that of the LED-module. Such a circuit board may, for example, be ceramic-based. Although solving the lifetime problem, the replacement of the regular PCB by a ceramic-based circuit board results in a higher cost. Furthermore, ceramic-based circuit boards are brittle, which may limit the form factor of the light-emitting device.
SUMMARY OF THE INVENTION
In view of the above-mentioned and other drawbacks of the prior art, a general object of the present invention is to provide an improved LED-based light-emitting device combining a long lifetime with the potential for low cost solutions.
According to the present invention there is provided a light-emitting device, comprising: an LED-module comprising at least one LED or LED die mounted on a carrier and at least one connection pad for electrical connection of the LED module; a heat dissipator for dissipating heat generated by the LED when in operation; a connection board comprising a substrate having a conductor pattern for enabling provision of external power to the LED module; an interconnecting arrangement electrically interconnecting the at least one connection pad of the LED module with the conductor pattern of the connection board; and an LED-holder pressing the LED-module against the heat dissipator to provide a thermal connection between the LED-module and the heat dissipator, wherein: the interconnecting member is configured to allow movement between the conductor pattern of the connection board and the at least one connection pad; and the LED-holder exerts a spring force to press the LED-module against the heat dissipator.
The present invention is based on the realization that an improved lifetime of a LED-based light-emitting device can be achieved at a lower cost than in prior art solutions by pressing the LED-module against the heat dissipator using a spring force and providing an electrical connection between the connection board and the LED-module that allows at least lateral movement between the conductor pattern of the connection board and the connection pad of the LED-module. Hereby, a robust electrical connection as well as good heat dissipation is provided even when there is a substantial mismatch between the coefficients of thermal expansion of the LED-module (often ceramic-based) and the connection board (typically FR-4 or similar). This provides for a light-emitting device with a long lifetime and at a lower cost and/or with a greater design flexibility than other proposed solutions, such as using a connection board in the same material as the LED-module.
According to the present invention, the LED-holder is advantageously formed by the connection board and at least one holding spring attached to the connection board. By using the connection board rather than a separate part for the LED-holder, cost can be kept down.
The interconnecting arrangement comprises at least one electrically conducting connection spring attached to the connection board and in electrical contact with the conductor pattern of the connection board, the at least one connection spring exerting a spring force to press against the at least one connection pad of the LED-module to electrically interconnect the at least one connection pad of the LED-module with the conductor pattern of the connection board. Hereby, electrical interconnection is provided, while allowing some movement (due to thermal mismatch) between the LED-module and the connection board. The electrical connection between the connection spring(s) and the connection pad(s) can be made to remain intact over a large number of cycles of relative movement between the connection spring(s) and the connection pad(s), and can thus be made more reliable than a “normal” solder connection would be. The at least one connection spring may advantageously be made of metal.
According to the invention, the at least one connection spring constitutes the at least one holding spring, to simultaneously electrically interconnect the at least one connection pad of the LED-module with the conductor pattern of the connection board and press the LED-module against the heat dissipator. Accordingly, the connection spring will fulfill two functions—to provide a reliable electrical connection between the LED-module and the connection board, and to press the LED-module against the heat dissipator to efficiently dissipate heat generated by the LED(s) comprised in the LED-module when the light-emitting device is in operation.
In the case that the at least one connection spring does not constitute the at least one holding spring, the at least one holding spring may exert a greater force on the LED-module than the at least one connection spring exerts on the LED-module. Through such a dimensioning of the different springs, the connection spring may be optimized for providing a contact force on the connection pad of the LED-module that is sufficient to provide electrical connection, but not necessarily to ensure a good thermal connection between the LED-module and the heat dissipator, while the holding spring may be dimensioned to provide a force that is sufficient to achieve a good thermal connection. In this way, a good thermal connection to the heat dissipator can be achieved while at the same time avoiding or at least significantly reducing contact surface wear on the connection pad(s) of the LED-module, which in turn reduces the risk of corrosion and accompanying contact resistance. Further, to provide for the desired combination of very low contact surface wear and a good thermal connection in this case, the at least one holding spring may advantageously be dimensioned to exert a pressure on the LED-module that is at least 20% higher than the force exerted by the at least one connection spring on the its associated contact pad(s). Moreover, the at least one holding spring and the at least one connection spring in this case may be provided as different portions of a single sheet of a resilient material, such as sheet metal, whereby the above-mentioned dual functionality can be achieved using a single piece comprising a holding spring portion and a connection spring portion. This provides for simple and cost-efficient manufacturing.
According to the various embodiments of the present invention, the connection board may advantageously comprise an opening accommodating the LED-module, such that the LED-module is at least partly surrounded by the connection board. The design of the connection board, including the position and shape of the opening can easily be adapted to different LED-modules, which simplifies upgrades etc involving using another LED-module in the light-emitting device.
The opening in the connection board may be substantially rectangular, and springs may be provided on opposite sides of the opening.
Moreover, the at least one holding spring and/or the at least one connection spring may advantageously be soldered to the connection board.
In an embodiment the connection board comprises a moulded interconnect device into which one end of the at least one holding spring is clamped. This clamping provides for an improved mechanical fixation of the at least one holding spring. In a further embodiment the moulded interconnect device comprises a hole filled with solder which is electrically contacting a part of the at least one holding spring. In this way the mechanical fixation of the at least one holding spring by the moulded interconnect device induces less stress on the solder. The solder may electrically contact a conduction pattern of the moulded interconnect device.
To provide for a low form factor and automated production using standard electronics manufacturing equipment, the at least one holding spring and/or the at least one connection spring may, furthermore, be a leaf spring. Leaf springs, which may be made of sheet metal, can be arranged using pick-and-place machinery, and can be soldered to the connection board.
BRIEF DESCRIPTION OF THE DRAWINGS
These and other aspects of the present invention will now be described in more detail, with reference to the appended drawings showing example embodiments of the invention, wherein:
FIG. 1 is an exploded view of a first exemplary embodiment of the light-emitting device according to the present invention;
FIG. 2 is an exploded view of a light-emitting device; and
FIG. 3 is a schematic cross-section of another exemplary embodiment of the light-emitting device according to the present invention.
DESCRIPTION OF EXAMPLE EMBODIMENTS OF THE PRESENT INVENTION
In the following description, the present invention is described with reference to a LED-based light-emitting device in which the connection board has a rectangular opening that completely surrounds the LED-module and sheet metal leaf springs are soldered to the connection board.
It should be noted that this by no means limits the scope of the invention, which is equally applicable to other light-emitting devices having an LED-holder that exerts a spring force to press the LED-module against the heat dissipator and an interconnecting member that allows movement between the connection pad(s) of the LED-module and the conductor pattern of the connection board. For example, other kinds of springs, such as one or several helical springs or plate springs, could be used to press the LED-module against the heat dissipator. Moreover, the interconnecting member may provide the desired relative lateral movement by other means, such as through a flexible wire that is electrically connected to the conductor pattern of the connection board and the connection pad(s) of the LED-module.
FIG. 1 is an exploded view of a first embodiment of the light-emitting device according to the present invention. With reference to FIG. 1, the light-emitting device 1 comprises a heat dissipator in the form of a metal heat sink 2, a LED-module 3, a connection board 4 and a cover 5. As can be seen in FIG. 1, the light-emitting device 1 further comprises springs 7 a-d and a connector 8 for allowing the provision of external power to the LED(s) in the LED-module 3. The springs 7 a-d and the connector 8 are soldered to a conductor pattern (not shown) of the connection board 4 so that at least two of the springs 7 a-d are connected to appropriate pins of the connector 8. The LED-module 3 is provided with at least one LED (covered by the lens 9 in FIG. 1) and two connector pads 10 a-b for allowing electrical connection to the LEDs. Furthermore, the connection board has a rectangular opening 6 that accommodates the LED-module 3.
As can easily be understood from FIG. 1, the springs 7 a-d will press against the connector pads 10 a-b of the LED-module 3 when the light-emitting device 1 is assembled, so that electrical connection between the connector 8 and the LEDs is achieved while at the same time pressing the LED-module 3 against the heat sink 2.
Thus, in the first embodiment described above with reference to FIG. 1, the springs 7 a-d perform the double function of providing electrical connection between the appropriate pins of the connector 8 and the LEDs of the LED-module 3 and pressing the LED-module against the heat sink 2.
FIG. 2 schematically shows a light-emitting device 20, which differs from that described above with reference to FIG. 1 in that the electrical connection between the connector pads 10 a-b of the LED-module 3 and the connector 8 and the pressing of the LED-module 3 against the heat sink 2 is achieved by spring arrangements 21 a-b made of sheet metal. The spring arrangements 21 a-b are, as can be seen in FIG. 2, attached to the connection board 4 on opposite sides of the substantially rectangular opening 6. As is also shown in FIG. 2, each of the spring arrangements 21 a-b comprises a connection spring portion 23 and a holding spring portion 22. The connection spring portion 23 has a relatively narrow profile and the holding spring portion 22 has a relatively wide profile, which means that the holding spring portion 22 has a higher spring constant than the connection spring portion. The connection spring portion 22 is dimensioned so that the force exerted by the connection spring portion 23 on the connection pad(s) 10 a-b of the LED-module 3 becomes sufficiently high to achieve a reliable electrical connection between the connection spring portion 23 and the connection pad(s) 10 a-b, but not so high that it results in contact surface wear over time. In other words, the connection spring portion 23 is dimensioned to achieve the function of electrically interconnecting the connection pad(s) of the LED-module with the conductor pattern of the connection board 4. In order to achieve the function of pressing the LED-module 3 against the heat sink 2, the holding spring portion 22 is dimensioned to exert a substantially higher force on the LED-module 3 when the light-emitting device 20 is assembled.
FIG. 3 is a schematic cross-section of an embodiment of a light-emitting device 30 according to the present invention. The light-emitting device 30 is in most aspects similar to the embodiments described with reference to FIG. 1, the main difference being the connection board which for this embodiment is a molded interconnect device (MID) 31. With reference to FIG. 3, the light-emitting device 30 comprises the heat dissipator in the form of the metal heat sink 2, the LED-module 3 and the MID 31. The LED-module 3 is provided with at least one LED (covered by the lens 9) and two connector pads 10 a-b for allowing electrical connection to the LEDs of which only connector pad 10 a is shown in FIG. 3. The light-emitting device 30 further comprises the springs 7 a-d of which only the spring 7 b is shown in FIG. 3. The springs 7 a-d have similar properties as described with reference to FIG. 1. In this embodiment one end of the springs 7 a-d is mechanically fixed in the MID 31 and the opposite end of the springs contacts and exerts a pressing force on a part of the LED module 3, for example the connection pads 10 a-b for establishing an electrical contact. The springs 7 a-d thus press against the connector pads 10 a-b of the LED-module 3 when the light-emitting device 30 is assembled, so that an electrical connection between the connector 8 and the LEDs is achieved while at the same time pressing the LED-module 3 against the heat sink 2. The springs 7 a-d are electrically connected to the conductor pattern (not shown) of the MID 31 via solder 32 that is applied in vias or openings of the MID 31, which vias or openings expose a part of the springs 7 a-d that is clamped inside the MID 31, and thus establishing an electrical interconnection from the conductor pattern of the MID 31 via the springs 7 a-d to the connector pads 10 a-b. The MID 31 gives more freedom in choosing the shape of the connection board than a for example laminated printed circuit board. This embodiment provides for an improved reliability because the springs 7 a-d are clamped in the MID 31, thus achieving an improved mechanical fixation. Furthermore, an improved protection of the solder connection 32 against mechanical forces and stress induced by the springs 7 a-d is achieved compared to the fixation of the springs 7 a-d with solder as exemplified with respect to FIG. 1.
Additionally, variations to the disclosed embodiments can be understood and effected by the skilled person in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. For example, the opening 6 need not completely surround the LED-module 3. Another example could be found in the design of the spring component: it could be designed as an SMD component (as in the other examples), but also possible is a through-hole component. Or as a component that is inserted into a hole (not below PCB level) scraping into the PCB material. This way a component can be created that can accommodate a higher total force because the solder connection is not the sole interface transmitting the force.
In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage.

Claims (20)

The invention claimed is:
1. A light-emitting device, comprising:
an LED-module comprising at least one LED mounted on a carrier and at least one connection pad;
a heat dissipator;
a connection board comprising a substrate having a conductor pattern arranged to provide external power to the LED-module;
an interconnecting arrangement comprising at least one connection spring fixedly attached to the connection board, the at least one connection spring exerting a spring force to press against the at least one connection pad of the LED-module to electrically interconnect the at least one connection pad of the LED-module with the conductor pattern of the connection board, the interconnecting arrangement being configured to allow movement between the conductor pattern of the connection board and the at least one connection pad;
and an LED-holder formed by the connection board and at least one holding spring fixedly attached to the connection board, the at least one holding spring exerting a spring force thereby pressing the LED-module against the heat dissipator to provide a thermal connection between the LED-module and the heat dissipator,
wherein the at least one connection spring constitutes the at least one holding spring, to simultaneously electrically interconnect the at least one connection pad of the LED-module with the conductor pattern of the connection board and press the LED module against the heat dissipator, and
wherein the spring force of the at least one holding spring is at least 20% greater than the spring force of the at least one connection spring.
2. The light-emitting device according to claim 1, wherein the connection board comprises an opening accommodating the LED-module, such that the LED-module is at least partly surrounded by the connection board.
3. The light-emitting device according to claim 2, wherein the opening is substantially rectangular.
4. The light-emitting device according to claim 3, wherein the LED-holder comprises a first set of springs attached to the connection board on a first side of the LED-module and a second set of springs attached to the connection board on a second side of the LED-module opposite the first side of the LED-module.
5. The light-emitting device according to claim 1, wherein the at least one holding spring is soldered to the connection board.
6. The light-emitting device according to claim 1, wherein the at least one holding spring is a leaf spring.
7. The light-emitting device according to claim 1, wherein the connection board comprises a moulded interconnect device into which one end of the at least one holding spring is clamped.
8. The light-emitting device according to claim 7, wherein the moulded interconnect device further comprises a hole filled with solder which is connected to a part of the at least one holding spring.
9. A light emitting device, comprising:
an LED-module that includes at least one light emitting element mounted on a carrier that includes at least one connection pad;
a heat dissipator; and
a connection board that includes:
a conductor pattern arranged to provide power to the LED-module;
at least one connection spring affixed to the board that exerts a spring force against the at least one connection pad to electrically connect the at least one connection pad and the conductor pattern; and
at least one holding spring affixed to the board that exerts a spring force against the LED module to thermally connect the LED module to the heat dissipator;
wherein the holding spring is configured to exert at least 20% more spring force than the connection spring.
10. The light emitting device of claim 9, wherein the at least one connection spring and the at least one holding spring are leaf springs.
11. The light emitting device of claim 10, wherein the at least one holding leaf spring has more mass than the at least one connection leaf spring.
12. The light emitting device of claim 9, wherein the at least one holding spring and the at least one connection spring are integrally connected.
13. The light emitting device of claim 9, wherein the at least one holding spring and the at least one connection spring are soldered to the connection board.
14. The light emitting device of claim 9, wherein the connection board comprises a molded interconnection device, and an end of the at least one holding spring is molded into the molded interconnection device.
15. The light-emitting device of claim 9, wherein the connection board comprises an opening that accommodates the LED-module, such that the LED-module is at least partly surrounded by the connection board.
16. The light-emitting device of claim 15, wherein the connection board includes at least two connection springs and at least two holding springs affixed to the connection board, and each of two connection springs and each of two holding springs are situated on opposite edges of the perimeter of the opening.
17. The light-emitting device of claim 9, wherein the spring force that is exerted by the connection spring allows for movement of the contact pad with respect to the connection spring.
18. A method of assembling a light-emitting device comprising:
providing an LED module that includes at least one a light emitting device on a carrier that includes at least one connection pad;
providing a connection board that includes:
a conductor pattern arranged to provide power to the LED-module;
at least one connection spring affixed to the board; and
at least one holding spring affixed to the board;
situating the LED module upon a heat dissipator; and
affixing the connection board to the heat dissipator, such that:
the connection spring exerts a spring force against the at least one connection pad to electrically connect the at least one connection pad and the conductor pattern; and
the holding spring exerts a spring force against the LED module to thermally connect the LED module to the heat dissipator with a spring force that is at least 20% greater than the spring force of the connection spring.
19. The method of claim 18, wherein the at least one connection spring and the at least one holding spring are leaf springs.
20. The method of claim 19, wherein the at least one holding leaf spring has more mass than the at least one connection leaf spring.
US14/002,134 2011-03-03 2012-02-15 Light emitting device with spring-loaded LED-holder Active US8933616B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP11156862 2011-03-03
EP11156862.2 2011-03-03
EP11156862 2011-03-03
PCT/IB2012/050681 WO2012117310A1 (en) 2011-03-03 2012-02-15 Light-emitting device with spring-loaded led-holder

Publications (2)

Publication Number Publication Date
US20130334953A1 US20130334953A1 (en) 2013-12-19
US8933616B2 true US8933616B2 (en) 2015-01-13

Family

ID=43904584

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/002,134 Active US8933616B2 (en) 2011-03-03 2012-02-15 Light emitting device with spring-loaded LED-holder

Country Status (6)

Country Link
US (1) US8933616B2 (en)
EP (1) EP2681488B1 (en)
JP (1) JP6031666B2 (en)
KR (1) KR20140031204A (en)
CN (1) CN103403445B (en)
WO (1) WO2012117310A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140247611A1 (en) * 2011-10-12 2014-09-04 Osram Gmbh Led module with a heat sink
US9226348B2 (en) * 2012-04-05 2015-12-29 Trodonic Gmbh & Co. Kg Light-emission device with an OLED element
USD750314S1 (en) * 2014-12-22 2016-02-23 Cree, Inc. Photocontrol receptacle for lighting fixture
US10253954B2 (en) 2015-11-16 2019-04-09 Banner Engineering Corp. Longitudinal stress mitigation for elongate LED luminaires
US10317015B2 (en) 2015-08-19 2019-06-11 Auroralight, Inc. Light module with self-aligning electrical and mechanical connection

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9170002B2 (en) * 2012-01-05 2015-10-27 Molex, Llc Holder and LED module using same
JP5548283B2 (en) * 2012-10-26 2014-07-16 株式会社東和化成工業所 Plastic socket
CN102927540B (en) 2012-11-02 2014-09-03 阳江纳谷科技有限公司 Device, method and system for modular light emitting diode circuit assembly
CN103016979B (en) * 2012-11-30 2015-02-04 深圳市九洲光电科技有限公司 Cross-inserted-type LED light source module
US20140168981A1 (en) * 2012-12-17 2014-06-19 Molex Incorporated Cover Assembly
DE102013103815A1 (en) * 2013-04-16 2014-10-16 Bender & Wirth Gmbh & Co. LED holders
TWM485353U (en) * 2013-12-17 2014-09-01 Molex Inc Cover assembly
EP3092440A4 (en) * 2014-01-10 2017-06-14 Molex, LLC Insert and led holder assembly using same
ES2563651B1 (en) * 2014-09-15 2016-12-21 Jaume GIMENO GIRÓ Led support module
EP3048364B1 (en) 2015-01-23 2019-01-02 Viabizzuno S.R.L. Modular led lamp structure
CN105805575A (en) * 2016-04-15 2016-07-27 宁波市凯迪森照明科技有限公司 LED floodlight
EP3349259A1 (en) * 2017-01-16 2018-07-18 Lumileds Holding B.V. Light emitting device
FR3078382B1 (en) * 2018-02-27 2020-10-02 Valeo Vision LIGHT MODULE FOR A MOTOR VEHICLE HAVING AT LEAST ONE LIGHT SOURCE DEPORTED FROM A POWER SUPPLY CIRCUIT
DE102018105010A1 (en) * 2018-03-05 2019-03-14 Bjb Gmbh & Co. Kg LED connection element for connecting an LED light source arranged on a circuit board
JP2022500840A (en) * 2018-09-07 2022-01-04 ルミレッズ リミテッド ライアビリティ カンパニー Lighting devices including circuit boards
EP3789772A1 (en) 2019-09-05 2021-03-10 Roche Diagnostics GmbH Method for determining a position of a rack on a rack placement unit of a laboratory handling system and laboratory handling system
KR20230156859A (en) * 2022-05-06 2023-11-15 주식회사 비에스테크닉스 LED lamp for vehicle applying MID and magnetic induction technology And Manufacturing method of the same

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002012788A1 (en) 2000-08-09 2002-02-14 Relume Corporation Led mounting system
US20060044840A1 (en) * 2004-08-24 2006-03-02 Koito Manufacturing Co., Ltd. Light emitting module and lighting unit
WO2006049086A1 (en) 2004-11-01 2006-05-11 Matsushita Electric Industrial Co., Ltd. Light emitting module, lighting device, and display device
US20080224166A1 (en) * 2007-03-14 2008-09-18 Glovatsky Andrew Z Led interconnect spring clip assembly
DE102007049310A1 (en) 2007-10-15 2009-04-16 Automotive Lighting Reutlingen Gmbh Light module for a headlight or a lamp of a motor vehicle
WO2009128005A1 (en) 2008-04-17 2009-10-22 Koninklijke Philips Electronics N.V. Thermally conductive mounting element for attachment of printed circuit board to heat sink
WO2009150590A1 (en) 2008-06-11 2009-12-17 Koninklijke Philips Electronics N.V. Press springs
US20100208480A1 (en) * 2009-02-16 2010-08-19 Koito Manufacturing Co., Ltd. Light source module and vehicle lamp
US20120051068A1 (en) * 2010-08-27 2012-03-01 Tyco Electronic Corporation Light module
US20120287602A1 (en) * 2010-01-19 2012-11-15 Panasonic Corporation Lighting apparatus
US20130187190A1 (en) * 2012-01-25 2013-07-25 Shinko Electric Industries Co., Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4943930B2 (en) * 2007-04-24 2012-05-30 パナソニック株式会社 Mounting structure of 3D circuit parts
JP2009199780A (en) * 2008-02-19 2009-09-03 Ichikoh Ind Ltd Lighting fixture for vehicle
JP5740144B2 (en) * 2010-12-03 2015-06-24 スタンレー電気株式会社 Light emitting module and light emitting device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002012788A1 (en) 2000-08-09 2002-02-14 Relume Corporation Led mounting system
US6582100B1 (en) * 2000-08-09 2003-06-24 Relume Corporation LED mounting system
US20060044840A1 (en) * 2004-08-24 2006-03-02 Koito Manufacturing Co., Ltd. Light emitting module and lighting unit
WO2006049086A1 (en) 2004-11-01 2006-05-11 Matsushita Electric Industrial Co., Ltd. Light emitting module, lighting device, and display device
US20080224166A1 (en) * 2007-03-14 2008-09-18 Glovatsky Andrew Z Led interconnect spring clip assembly
US7905632B2 (en) 2007-10-15 2011-03-15 Automotive Lighting Reutlingen Gmbh Projection module for a headlamp or an automobile light
DE102007049310A1 (en) 2007-10-15 2009-04-16 Automotive Lighting Reutlingen Gmbh Light module for a headlight or a lamp of a motor vehicle
WO2009128005A1 (en) 2008-04-17 2009-10-22 Koninklijke Philips Electronics N.V. Thermally conductive mounting element for attachment of printed circuit board to heat sink
WO2009150590A1 (en) 2008-06-11 2009-12-17 Koninklijke Philips Electronics N.V. Press springs
US20100208480A1 (en) * 2009-02-16 2010-08-19 Koito Manufacturing Co., Ltd. Light source module and vehicle lamp
US20120287602A1 (en) * 2010-01-19 2012-11-15 Panasonic Corporation Lighting apparatus
US20120051068A1 (en) * 2010-08-27 2012-03-01 Tyco Electronic Corporation Light module
US20130187190A1 (en) * 2012-01-25 2013-07-25 Shinko Electric Industries Co., Ltd. Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140247611A1 (en) * 2011-10-12 2014-09-04 Osram Gmbh Led module with a heat sink
US9903580B2 (en) * 2011-10-12 2018-02-27 Osram Gmbh LED module with a heat sink
US9226348B2 (en) * 2012-04-05 2015-12-29 Trodonic Gmbh & Co. Kg Light-emission device with an OLED element
USD750314S1 (en) * 2014-12-22 2016-02-23 Cree, Inc. Photocontrol receptacle for lighting fixture
US10317015B2 (en) 2015-08-19 2019-06-11 Auroralight, Inc. Light module with self-aligning electrical and mechanical connection
US10253954B2 (en) 2015-11-16 2019-04-09 Banner Engineering Corp. Longitudinal stress mitigation for elongate LED luminaires

Also Published As

Publication number Publication date
EP2681488A1 (en) 2014-01-08
CN103403445A (en) 2013-11-20
US20130334953A1 (en) 2013-12-19
CN103403445B (en) 2016-09-14
JP6031666B2 (en) 2016-11-24
WO2012117310A1 (en) 2012-09-07
JP2014507076A (en) 2014-03-20
EP2681488B1 (en) 2014-12-17
KR20140031204A (en) 2014-03-12

Similar Documents

Publication Publication Date Title
US8933616B2 (en) Light emitting device with spring-loaded LED-holder
JP5283750B2 (en) Thermally conductive mounting elements for mounting printed circuit boards to heat sinks
JP5354795B2 (en) Jumper connector for lighting assembly
JP5871621B2 (en) LED device, manufacturing method thereof, and light emitting device
JP5714899B2 (en) Solderless integrated package connector and LED for LED
KR101203296B1 (en) Led interconnect assembly
KR101134671B1 (en) LED lamp module with the cooling structure
JP2009502024A (en) Light emitting diode package and manufacturing method thereof
KR20130059871A (en) Light emitting modul
KR101791149B1 (en) Light emitting diode illumination lamp
TW201243225A (en) Light-emitting device with spring-loaded LED-holder
WO2015047974A2 (en) Systems and methods for improving service life of circuit boards
JP2011258313A (en) Wire connection apparatus and lighting device
JP2011034914A (en) Contact and socket equipped with the same
JP2017152371A (en) Mounting structure of light source unit
KR20120000739A (en) Led module on heat sink and method of manufacturing the same
KR101421919B1 (en) LED lighting fixture circuit board a fixture
JP2017175048A (en) Manufacturing method of light source unit
JP2017162575A (en) Heat radiation structure of light source unit

Legal Events

Date Code Title Description
AS Assignment

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KESER, MERIJN;OEPTS, WOUTER;VAN LIER, EDWIN PETRUS HELENA;AND OTHERS;SIGNING DATES FROM 20120321 TO 20120405;REEL/FRAME:031107/0362

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: PHILIPS LIGHTING HOLDING B.V., NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KONINKLIJKE PHILIPS N.V.;REEL/FRAME:040060/0009

Effective date: 20160607

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551)

Year of fee payment: 4

AS Assignment

Owner name: SIGNIFY HOLDING B.V., NETHERLANDS

Free format text: CHANGE OF NAME;ASSIGNOR:PHILIPS LIGHTING HOLDING B.V.;REEL/FRAME:050837/0576

Effective date: 20190201

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8