JP2017175048A - Manufacturing method of light source unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a light source unit, having high reliability of electric connection to a printed board and capable of highly accurately positioning a semiconductor light-emitting element and capable of simply and inexpensively constituting a manufacturing line of an illumination module.SOLUTION: A base 8 and a terminal piece 9 are formed on a conductive plate 7 and an elastically deformable pressure contact terminal 10 is formed on a tip of the terminal piece 9. An LED 3 is mounted on the base 8 and a package 19 for storing the LED 3 is formed on the conductive plate 7 by resin. The terminal piece 9 is bent on the outside of the package 19 and the pressure contact terminal 10 is arranged at an approximately right angle to the package 19. The respectively different numbers of terminal pieces 9 are formed on respectively opposed sides of the base 8 so as not to misidentify the polarity of the LED 3. An aperture 19a for storing a heat discharge member is formed on a lower surface of the package 19 to expose a lower face of the base 8.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for manufacturing a light source unit including a semiconductor light emitting element.

  2. Description of the Related Art Conventionally, a technique for mounting a light source unit including a semiconductor light emitting element on a printed circuit board in a lighting module such as a vehicle lamp is known. For example, in the light source unit 51 shown in FIG. 11, the light source base 53 is molded on the insulating package 52, the LED 54 is mounted on the upper surface of the light source base 53, and the electrode 55 provided on the lower surface of the light source base 53 is It is joined to 57 wiring patterns 58. Patent Document 1 proposes a technique for accurately soldering an electrode of a light source unit to a land on a printed circuit board.

Japanese Patent Laid-Open No. 2015-56228

  However, since brazing materials such as solder are likely to deteriorate due to repeated temperature changes, in lighting modules such as vehicular lamps used in severe temperature environments (−30 ° C. to 80 ° C.), the bonding strength of the light source unit However, there is a problem that the reliability of the electrical connection remains uneasy and the position of the semiconductor light emitting element is likely to fluctuate due to the fluidity of the solder. In addition, a dedicated device such as a solder printing machine, a mounting machine, a flow / reflow device, and a maintenance engineer thereof are required, so that the lighting module manufacturing line is complicated and the manufacturing cost is high.

  Accordingly, an object of the present invention is to provide a method of manufacturing a light source unit that has high reliability of electrical connection, can position a semiconductor light emitting element with high accuracy, and can easily and inexpensively configure a manufacturing line of an illumination module.

  In order to solve the above problems, a method of manufacturing a light source unit according to the present invention includes a step of forming a base and a terminal piece on a conductive plate, a step of mounting a semiconductor light emitting device on the base, and a semiconductor light emitting device. Forming a contact piece that is elastically deformable on the terminal piece in the step of forming the terminal piece on the conductive plate, including a step of forming the package to be made of an insulating material and a step of bending the terminal piece outside the package. It is characterized by.

  In a preferred embodiment of the present invention, the press contact terminal of the light source unit is press-fitted into the terminal hole of the printed circuit board, and the light source unit is assembled to the printed circuit board by the elastic restoring force of the press contact terminal. At this time, in the step of bending the terminal piece of the light source unit, it is desirable to arrange the press contact terminals in a direction substantially perpendicular to the package so that the press contact terminals can be easily press-fitted into the terminal holes of the printed circuit board. In addition, as a press contact terminal, a press fit terminal can be used by the point from which strong press contact force is acquired.

  In addition, when assembling the light source unit, a pressure shoulder is provided on the terminal piece of the light source unit so that the press contact terminal can be pressed into the terminal hole without directly pressing the package containing the semiconductor light emitting element. desirable. Specifically, in the step of bending the terminal piece, a shoulder part included in the same plane as the base can be formed at the base end of the terminal piece so as to protrude to the side of the package.

  Further, in order to prevent the light source unit from being assembled to the printed circuit board in a state where the electric polarity is wrong, a different number of terminal pieces are formed on the opposite sides of the base in the step of forming the terminal pieces on the conductive plate. Is preferred.

  On the other hand, in the usage form of the light source unit, it is desirable to interpose a heat radiating member between the light source unit and the printed board in order to dissipate the heat generated by the semiconductor light emitting element to the printed board. For this purpose, in the process of forming the package, an opening for accommodating the heat dissipation member is prepared in advance on the lower surface of the package, and at least a part of the base is exposed in this opening.

  According to the manufacturing method of the present invention, since the press contact terminal that can be elastically deformed is formed on the terminal piece of the light source unit, the light source unit is strongly held in the terminal hole of the printed circuit board for a long time by the elastic restoring force of the press contact terminal. be able to. For this reason, compared with the case where it is based on soldering, the electrical connection of the light source unit to the printed circuit board can be made highly reliable, and the semiconductor light emitting element can be positioned with high accuracy with respect to the printed circuit board. In addition, since the electrical connection of the light source unit is established by press-fitting the press contact terminal, it is possible to eliminate the need for soldering equipment and technicians and to easily and inexpensively configure the lighting module production line. Play.

It is a top view of the illumination module which shows one Embodiment of this invention. It is the II-II sectional view taken on the line of FIG. 1 which shows the assembly structure of a light source unit. It is the III-III sectional view taken on the line of FIG. 2 which shows the shape and effect | action of a press-contact terminal. It is explanatory drawing which shows the process of forming a base and a terminal piece in an electroconductive plate. It is explanatory drawing which shows the process of mounting a semiconductor light-emitting device in a base. It is explanatory drawing which shows the process of shape | molding a package. It is explanatory drawing which shows the process of bending a terminal piece. It is the top and elevation which show the modification of a press contact terminal. It is the top and elevation which show another modification of a press contact terminal. It is the top and elevation which show the modification of a terminal piece. It is sectional drawing which shows the assembly | attachment structure of the conventional light source unit.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The illumination module 1 shown in FIG. 1 includes, for example, a printed circuit board 2 attached in a lamp body (not shown) of a vehicle lamp. A plurality of light source units 4 including LEDs 3 as semiconductor light emitting elements are mounted on the printed circuit board 2 and are connected to an external power source (not shown) such as an in-vehicle battery, for example, a card that does not require solder connection. An edge connector 5 is provided. The card edge connector 5 is electrically connected to the LED 3 of each light source unit 4 via the wiring pattern 14 (see FIG. 2) on the printed circuit board 2, and power input from an external power source is supplied to each LED 3.

  In addition, although the plane board | substrate is typically shown by FIG. 1 as the printed circuit board 2, it can replace with this and a solid board | substrate can also be used. Moreover, the illumination module 1 is not limited to a vehicle lamp, It can also be used for a lighting fixture for a house. In addition to the LED 3, a semiconductor laser can be used for the semiconductor light emitting element of the light source unit 4.

  As shown in FIG. 2, the light source unit 4 is mounted on the surface of the electrically insulating printed circuit board 2, and the heat radiating plate 13 is disposed on the back surface of the printed circuit board 2 via the heat radiating sheet 12. A wiring pattern 14 is formed on both the front and back surfaces of the printed board 2 by copper plating, and most of the wiring pattern 14 is covered with a resist 15 made of an electrically insulating material. The resist 15 is removed from the mounting region of the light source unit 4 and its periphery, and a plurality of terminal holes 16 and a heat radiating copper foil portion 17 are provided in the removed wiring pattern 14. The terminal hole 16 is a through hole whose inner surface is covered with the same copper mesh as the wiring pattern 14, and is electrically connected to the card edge connector 5 through the wiring pattern 14.

  The light source unit 4 includes a conductive plate 7 and an electrically insulating package 19. An opening 19a for releasing heat of the LED 3 is formed at the bottom of the package 19, and a heat radiating heat transfer member 20 made of a heat radiating pad, heat radiating grease, or a metal plate is housed in the opening 19a, and is positioned by the inner surface of the opening 19a. In this state, it is interposed between the light source unit 4 and the heat radiating copper foil portion 17. The LED (chip) 3 is encapsulated inside the package 19 with a fluorescent material mixed resin 21, and the heat generated by the LED 3 is radiated through the heat radiating heat transfer member 20, the heat radiating copper foil portion 17, the wiring pattern 14, and the heat radiating sheet 12. 13 is emitted to the periphery of the lighting module 1.

  On the conductive plate 7, a base 8 on which the LED 3 is mounted and a terminal piece 9 electrically connected to the wiring pattern 14 of the printed board 2 are integrally formed. The base 8 is formed such that the upper surface supports the LED 3 and the lower surface is exposed to the package opening 19a. The terminal piece 9 has an L-shaped or U-shaped lead frame structure like a normal semiconductor package, and a shoulder portion 9a is provided at the base end of the terminal piece 9 so that the package 19 is not directly pressed during assembly. 19 is provided so as to jump out to the outside. Further, the terminal pieces 9 are formed in different numbers on the opposite sides of the base 8 so as not to misidentify the polarity of the LEDs 3 during assembly (see FIG. 4).

  As shown in FIG. 3, the terminal piece 9 is bent downward from the package 19, and the press contact terminal 10 to be press-fitted into the terminal hole 16 of the printed circuit board 2 is formed at the lower end thereof. The press-contact terminal 10 in the illustrated example is a press-fit terminal having a longitudinal long hole 10a, and when pressed into the terminal hole 16, it comes into contact with the inner surface (copper-plated portion) of the terminal hole 16 to thereby form a terminal piece. 9 is elastically deformed in a direction orthogonal to the press-fitting direction 9 and the light source unit 4 is strongly held on the printed circuit board 2 by the elastic restoring force after the press-fitting. Note that the press contact terminal 10 is desirably formed with such a length that the lower end thereof is not exposed from the lower surface of the printed circuit board 2.

  Next, the manufacturing method of the light source unit 4 is demonstrated according to FIGS. In manufacturing the light source unit 4 having the above configuration, first, as shown in FIG. 4, a conductive plate 7 having a predetermined size is prepared, and using processing means such as press, laser cutting, and etching, A base 8 and terminal pieces 9 are formed on the conductive plate 7. At this time, three terminal pieces 9 are formed on one side of the base 8 and four terminal pieces 9 are formed on the opposite side of the base 8, so that different numbers of terminal pieces 9 are formed on opposite sides of the base 8. A pressure contact terminal 10 that is elastically deformable is formed at the tip of 9.

  Subsequently, as shown in FIG. 5, the LED 3 is mounted on the base 8, and the anode (not shown) of the LED 3 is connected to the base 3. Next, as shown in FIG. 6, the package 19 is formed of an insulating material so that a part of the conductive plate 7 is molded, and the heat radiating heat transfer member 20 (see FIG. 2) is accommodated on the lower surface of the package 19. An opening 19a is formed, and the lower surface of the base 8 is exposed in the opening 19a. And after connecting the cathode of LED3 to the terminal piece 9 of the same polarity with the wire 24, the inside of the package 19 is filled with the fluorescent agent mixed resin 21, and thereby the LED3 and the wire 24 are sealed.

  Thereafter, as shown in FIG. 7, each terminal piece 9 is bent outside the package 19, and the base 8 and the terminal piece 9 are separated from the conductive plate 7 to complete the light source unit 4. In this bending step, the portion on the tip side of the shoulder portion 9 a of the terminal piece 9, that is, the portion including the press contact terminal 10 is arranged in a direction perpendicular to the package 19, and the shoulder portion 9 a is in the same plane as the base 8. Project to the side of the package 19. The step of separating the base 8 and the terminal piece 9 from the conductive plate 7 may be performed before the terminal piece 9 is bent or after the terminal piece 9 is bent.

According to the light source unit 4 manufactured by the above method, the following operational effects can be obtained.
(A) Since the press contact terminal 10 is formed on the terminal piece 9, the light source unit 4 can be strongly held against the printed circuit board 2 for a long time by the elastic restoring force of the press contact terminal 10.
(B) Unlike the soldering material such as solder, the elasticity of the pressure contact terminal 10 does not deteriorate depending on the temperature condition, so that the electrical connection between the printed circuit board 2 and the light source unit 4 even under a severe temperature environment such as a vehicular lamp. The illumination module 1 can be operated reliably over a long period of time.

(C) Since the electrical connection of the light source unit is established by press-fitting the press contact terminal 10 into the terminal hole 16 of the printed circuit board 2, it eliminates the need for soldering equipment and technicians, and simplifies the lighting module production line. And it can be configured at low cost.
(D) Since the position of the light source unit 4 is determined by press-fitting, the position variation of the light source unit during assembly can be prevented, and the positional accuracy of the LED 3 with respect to the printed circuit board 2 can be increased.

(E) Since the terminal piece 9 is bent at a right angle to the package 19 and the shoulder portion 9a of the terminal piece 9 protrudes to the side of the package 19, the shoulder portion 9a, not the package 19, is pressed during assembly. Thus, the press contact terminal 10 can be easily press-fitted into the terminal hole 16.
(F) Since the different number of terminal pieces 9 are formed on the opposite sides of the base 8, there is no possibility that the light source unit 4 is assembled to the printed circuit board 2 with the polarity of the LED 3 being incorrect.
(G) Since the lower surface of the base 8 is exposed to the opening 19a of the package 19, the heat generated by the LED 3 is transferred to the printed circuit board 2 through the heat radiating heat transfer member 20 accommodated in the opening 19a when the light source unit 4 is used. Can communicate efficiently.

Note that the present invention is not limited to the above-described embodiment, and can be implemented by appropriately changing the shape and configuration of each part without departing from the spirit of the invention, as exemplified below. .
(A) As shown in FIG. 8, the terminal piece 9 is provided with a stopper 27 for determining the insertion limit position of the press contact terminal 10. If it carries out like this, it can prevent beforehand that the press-contact terminal 10 contacts the electroconductive member and heat radiating member which are under the printed circuit board 2. FIG.
(A) The shape of the press contact terminal 10 is not limited to the annular shape shown in FIG. 3, and may be a substantially U shape with a part opened as shown in FIG. 9.
(C) In order to absorb the difference in thermal expansion between the printed circuit board 2 and the light source unit 4 in use, a bent portion 28 is provided in a part of the terminal piece 9 as shown in FIG.

1 Illumination module 2 Printed circuit board 3 LED
4 Light source unit 7 Conductive plate 8 Base 9 Terminal piece 10 Press contact terminal 16 Terminal hole 19 Package 19a Opening 20 Heat transfer member for heat dissipation

Claims (5)

Forming a base and a terminal piece on the conductive plate;
Mounting a semiconductor light emitting element on the base;
Forming a package containing the semiconductor light emitting element with an insulating material;
Bending the terminal strip outside the package;
In the process of forming the terminal piece, a pressure contact terminal that is elastically deformable is formed on the terminal piece.   The method of manufacturing a light source unit according to claim 1, wherein in the step of bending the terminal piece, the press contact terminal is disposed in a direction substantially perpendicular to the package.   3. The method of manufacturing a light source unit according to claim 1, wherein in the step of bending the terminal piece, a shoulder part included in the same plane as the base is formed at the base end of the terminal piece so as to protrude to the side of the package.   4. The method of manufacturing a light source unit according to claim 1, wherein in the step of forming the terminal pieces, a different number of terminal pieces are formed on opposite sides of the base.   5. The process according to claim 1, wherein, in the step of forming the package, an opening for accommodating a heat dissipation member is formed on a lower surface of the package, and at least a part of the base is exposed to the opening. Manufacturing method of the light source unit of

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