US8649213B2 - Multiple bit phase change memory cell - Google Patents

Multiple bit phase change memory cell Download PDF

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US8649213B2
US8649213B2 US12/935,656 US93565609A US8649213B2 US 8649213 B2 US8649213 B2 US 8649213B2 US 93565609 A US93565609 A US 93565609A US 8649213 B2 US8649213 B2 US 8649213B2
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phase change
memory
resistance state
electrodes
regions
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US20120069645A1 (en
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Ludovic R. A. Goux
Thomas Gille
Judit G. Lisoni
Dirk J. C. C. M. Wouters
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Morgan Stanley Senior Funding Inc
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Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/061—Shaping switching materials
    • H10N70/066—Shaping switching materials by filling of openings, e.g. damascene method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/828—Current flow limiting means within the switching material region, e.g. constrictions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe

Definitions

  • the invention relates to a phase change memory cell with multiple bits, and methods for storing data in such a cell.
  • Phase change memory cells involve a phase change material that changes state, generally between a low and a high resistance state.
  • chalcogenide materials are used. Such materials can have a low resistance in a crystalline state and a high resistance in an amorphous state. Applying a suitable current in the low resistance crystalline state causes sufficient heating to change the state to the high resistance amorphous state, known as a reset. Applying a suitable lower voltage to the high resistance amorphous state changes the material back to the low resistance crystalline state.
  • the cells can be used as memory cells each storing one bit, represented by the low or high resistance state.
  • the changes in state are reversible allowing the memory to be erased and reprogrammed as required.
  • Phase change memory cells can be implemented in a vertical format as explained in more detail in WO2007/0732308 (Philips/IMEC) which also discloses suitable manufacturing methods.
  • the memory regions may have different resistances so that the state of all of the memory regions can be determined simply by measuring the resistance between the electrodes.
  • the memory regions also need to be separately programmable and this may be achieved by ensuring that the reset currents needed to change the state of each region to a high resistance state and the set voltage needed to change the state of each region to a low resistance state varies between the elements.
  • Each memory region may be a memory region surrounded by a region of greater width than the memory region, i.e. the memory region may be of reduced width. Such memory regions may also be referred to as constrictions.
  • the phase change memory material may have different geometries in each of the different memory regions to achieve the different resistances and programming conditions.
  • the invention also relates to a method of operation of such a phase change memory cell.
  • FIG. 1 is a top view of a first embodiment of the invention
  • FIG. 2 is a top view of a second embodiment of the invention.
  • FIG. 3 is a side view of a third embodiment of the invention.
  • FIG. 4 is a side view of a fourth embodiment of the invention.
  • FIG. 5 is a top view of a fifth embodiment of the invention.
  • FIG. 6 is a side view of a sixth embodiment of the invention.
  • a first embodiment relates to a lateral two-bit phase change memory cell.
  • a phase change memory material 2 extends laterally between a first electrode 4 and a second electrode 6 with a number of memory regions 8 . Note that the electrodes 4 , 6 are in the embodiment above the phase change memory material 2 to allow contacting to the electrodes.
  • the phase change memory material has firstly a first flap 10 of constant width, followed by a first tapered region 12 decreasing in width to a first constriction 14 having a constant width W 1 and length L 1 . This is followed by an intermediate region 16 of width W 2 and length L 2 , and a second constriction 18 of length L 3 and width L 3 .
  • a second tapered region 20 then expands the width to join to second flap 22 which is in turn connected to the second electrode.
  • the first and second constrictions 14 , 18 are the first and second memory regions 8 .
  • the first and second memory regions are arranged in series.
  • the widths and lengths, especially of the first and second constrictions 14 , 18 are selected to allow independent writing to the first and second memory regions 8 and also to allow them to be independently read.
  • L 3 W 3 so that the second constriction is square, W 3 ⁇ W 1 to achieve a higher current density in the second constriction 18 compared with the first constriction 14 . This ensures that the current required to reset the second constriction to the high resistance state is less than the current required to reset the first constriction to the high resistance state.
  • L 1 is approximately twice W 1 so that the resistance of the first constriction 14 is approximately double that of the second constriction 18 .
  • the phase change memory material 2 in this example is a chalcogenide glass that can be converted from a crystalline state to an amorphous state by the application of current and back again by the application of voltage.
  • first and second constrictions 14 , 18 are crystalline with a low resistance.
  • the resistance between first and second electrodes 4 , 6 is approximately 1 k ⁇ .
  • a current of approximately 0.5 mA is passed between the first and second electrodes 4 , 6 .
  • the resistivity of the second constriction 18 is about 500 k ⁇ per square and since the length is approximately the width the resistance between electrodes 4 , 6 is dominated by the second constriction and approximately 500 k ⁇ .
  • the first constriction (which has a length approximately twice the width) has a resistance of approximately 1 M ⁇ , so the total resistance between electrodes 4 , 6 is approximately 1.5 M ⁇ .
  • a set voltage of about 0.3 V can be applied across the electrodes 4 , 6 .
  • the resistance is higher in the first constriction 14
  • the length of the second constriction 18 is only approximately one quarter the length of the first constriction 14 and so the electric field applied is double in the second constriction 18 compared with the first constriction 14 .
  • This voltage is sufficient to render the second constriction crystalline (i.e. conducting) leaving just the high resistance of the first constriction, namely about 1 M ⁇ .
  • the resistance can be 1 k ⁇ , 500 k ⁇ , 1 M ⁇ or 1.5 M ⁇ , and accordingly a single resistance measurement unambiguously confirms the state of both of the constrictions 14 , 18 .
  • this memory cell is a two bit cell where both of the bits can be read independently using a single resistance measurement.
  • each constriction i.e. each memory region
  • each memory region can be separately controlled to be in a fully amorphous or a fully crystalline state, that is to say each memory region stores a bit.
  • the electrodes 4 , 6 are in the embodiment above the phase change memory material 2 to allow contacting to the electrodes.
  • the electrodes may also be below the phase change memory material, with the PCM flaps overlapping only partially and leaving space for making top contacts.
  • An alternative programming approach uses different programming times to program the different regions. For example, in the above embodiment, applying 0.8V for a very short time may also be used to set only one region. When a voltage of 0.8V is applied, the first constriction 14 and the second constriction 18 will start to crystallize. Because the current density is higher in the second constriction 18 , it will have a higher crystallization rate than the first constriction 14 . As a consequence, the second constriction crystallizes before the first constriction 14 . By interrupting the set pulse at the right time, only the second constriction is rendered crystalline leaving just the high resistance of the first constriction, namely about 1 M ⁇ . A longer voltage pulse of 0.8V can be applied to crystallize both constrictions.
  • the tapered regions 12 , 20 can be differently formed, omitted, or replaced by non-tapered regions.
  • both the reset current required to reset each constriction should be different as well as the set voltage required to set each constriction. In this way, the memory elements can be independently programmed.
  • a particular state can be achieved by setting one or more memory elements and then resetting one or more elements to achieve the desired state.
  • this can be achieved by applying a high reset current to bring both of the memory elements into the high resistance state and then applying a moderate set voltage (0.3V in the example above) to bring just the second memory element 18 into the low resistance state to achieve the desired state of both memory element.
  • the number of memory elements is not limited to two and those skilled in the art will readily realise how to implement the invention with three or more memory regions, for example arranged as three or more regions arranged in series. Suitable geometries can be selected to allow each of the memory elements to have different resistances, reset programming currents and set voltages.
  • FIG. 2 shows a second example which does not have memory elements of rectangular or square shape but instead uses tapered constrictions, of different width.
  • FIG. 3 illustrates an alternative to the lateral structures shown in FIGS. 1 and 2 .
  • FIG. 3 shows a vertical structure.
  • a bottom electrode 4 , first constriction 14 , intermediate region 16 , second constriction 18 and top electrode 6 are provided in vias 34 , 36 , 38 in a dielectric 32 on substrate 30 .
  • Each of the constrictions 14 , 18 and intermediate region 16 may be formed of a phase change material.
  • the constrictions function as memory regions 8 .
  • Such structures can be manufactured by a damascene process as follows.
  • the bottom electrode 4 is fabricated.
  • Dielectric 32 is then deposited, and a first via 34 formed stopping on the bottom electrode.
  • the first via is then filled with phase change memory material 2 to form first constriction 14 in a single damascene process.
  • a second layer of dielectric is formed, a second via 36 formed in the dielectric and filled with phase change material to form intermediate region 16 in a second single damascene process.
  • a third layer of dielectric is formed, third via 38 opened and filled with phase change material to form second constriction 18 in a third single damascene process.
  • the top electrode is then deposited and patterned.
  • the damascene processes each deposit the phase change material over the surface and etch back, for example using chemical mechanical polishing (CMP) so that the phase change material is removed from the surface remaining in the respective via.
  • CMP chemical mechanical polishing
  • the via height and area are the relevant parameters that are adjusted to ensure different properties for each of the constrictions.
  • the via fill materials may be of different materials.
  • the constrictions 14 , 18 may be formed of a material such as Ge2Sb2Te5 which is relatively high resistance, thus dissipating more heat making it easier to program, whereas the intermediate region 16 may be made of a lower resistance material such as SbTe.
  • Confinement parts 40 , 42 can be included as illustrated in the alternative embodiment shown in FIG. 4 .
  • the confinement parts 40 , 42 have a lower heat capacity or heat conductivity compared with the electrodes 4 , 6 and so they reduce the heat sinking effect of the top and bottom electrodes 4 , 6 which otherwise reduce the heating effect of the current. In this way, a smaller current can be used to reset the memory elements into the high resistance state so this approach can improve performance.
  • FIG. 5 illustrates an approach with three constrictions, a first central constriction 50 , a second constriction acting as a memory region made up from two regions 52 , 54 one on either side of the first constriction 50 , and a third constriction acting as a memory region made up from two regions 56 , 58 one on either side of the second constriction 52 , 54 between flaps 10 , 22 .
  • a first state corresponds to rendering just the first constriction 50 amorphous
  • in a second state the first constriction 50 and second constriction 52 , 54 is rendered amorphous
  • the second constriction 52 , 54 surrounds the first constriction and the third constriction 56 , 58 surrounds the second constriction; each of the constrictions thus constitutes the wider region for the previous constriction.
  • FIG. 6 illustrates a vertical implementation of the same idea. Again, a central first constriction 50 is surrounded by a second constriction 52 , 54 and a third constriction 56 , 58 .
  • the shape of the via in the above embodiments is circular but other shapes, such as square, rectangular, or indeed any other shape can also be used.
  • dual damascene processes can also be used, for example to manufacture the intermediate region 16 and lower constriction 14 in a single dual damascene step.
  • memory regions shown are formed as constrictions, i.e. narrower regions between wider regions, this is not essential and any suitable form of memory region can be adopted as required.
  • memory regions of can be provided between regions of different material, the regions of different material being of the same width as the memory material.

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  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
US12/935,656 2008-04-01 2009-03-30 Multiple bit phase change memory cell Active 2029-11-13 US8649213B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP08103304 2008-04-01
EP08103304.5 2008-04-01
EP08103304 2008-04-01
PCT/IB2009/051327 WO2009122347A2 (fr) 2008-04-01 2009-03-30 Cellule de mémoire de changement de phase à bits multiples

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US8649213B2 true US8649213B2 (en) 2014-02-11

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EP (1) EP2272113B1 (fr)
JP (1) JP5451740B2 (fr)
CN (1) CN101981721B (fr)
WO (1) WO2009122347A2 (fr)

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JP2011518431A (ja) 2011-06-23
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CN101981721A (zh) 2011-02-23
EP2272113A2 (fr) 2011-01-12
US20120069645A1 (en) 2012-03-22

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