US8648975B2 - Liquid crystal display device with potential varying capacitance electrode - Google Patents
Liquid crystal display device with potential varying capacitance electrode Download PDFInfo
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- US8648975B2 US8648975B2 US13/699,369 US201113699369A US8648975B2 US 8648975 B2 US8648975 B2 US 8648975B2 US 201113699369 A US201113699369 A US 201113699369A US 8648975 B2 US8648975 B2 US 8648975B2
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- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
Definitions
- the present invention relates to a liquid crystal display device, and particularly relates to a liquid crystal display device having a configuration in which one pixel is divided into a plurality of sub pixels to improve a viewing angle characteristic.
- pixel division method As one of drive methods of a liquid crystal display device, there is conventionally known a method (hereinafter, “pixel division method”) of “configuring one pixel by a plurality of (typically two) sub pixels, and driving a liquid crystal such that brightness of the plurality of sub pixels becomes mutually different brightness”.
- This pixel division method is a method employed to improve a viewing angle characteristic of the liquid crystal display device.
- FIG. 49 is a diagram schematically showing an example of a circuit configuration of a conventional liquid crystal display device that employs a pixel division method. As shown in FIG. 49 , a pixel formation portion 93 forming one pixel is configured by two sub-pixel portions (a first sub-pixel portion 94 and a second sub-pixel portion 95 ).
- Both of the sub-pixel portions ( 94 , 95 ) include transistors (T 1 , T 2 ) having gate electrodes connected to a scanning signal line GL and having source electrodes connected to a data signal line SL; pixel electrodes (E 1 , E 2 ) connected to drain electrodes of the transistors (T 1 , T 2 ); liquid crystal capacitances (Clc 1 , Clc 2 ) formed by a common electrode 41 to which a constant potential COM is provided as a counter electrode and the pixel electrodes (E 1 , E 2 ); and holding capacitances (Ccs 1 , Ccs 2 ) formed by the pixel electrodes (E 1 , E 2 ) and holding capacitance lines (CS 1 , CS 2 ).
- the transistors T 1 , T 2 when the scanning signal line GL becomes in a selection state, the transistors T 1 , T 2 become in an on state. Since the source electrode of the transistor T 1 and the source electrode of the transistor T 2 are connected to the same data signal line SL, a potential of the pixel electrode E 1 in the first sub-pixel portion 94 and a potential of the pixel electrode E 2 in the second sub-pixel portion 95 become equal. Thereafter, when a potential of one of the holding capacitance lines CS 1 , CS 2 is increased and when a potential of the other holding capacitance line is decreased, the potential of the pixel electrode E 1 and the potential of the pixel electrode E 2 vary in mutually opposite directions. As a result, the potential of the pixel electrode E 1 and the potential of the pixel electrode E 2 become mutually different, and brightness of the first sub-pixel portion 94 and brightness of the second sub-pixel portion 95 become mutually different.
- FIG. 50 is an equivalent circuit diagram of another conventional liquid crystal display device that employs a pixel division method.
- a pixel formation portion 96 is also configured by two sub-pixel portions (a first sub-pixel portion 97 and a second sub-pixel portion 98 ).
- Both of the sub-pixel portions ( 97 , 98 ) include the transistors (T 1 , T 2 ), the pixel electrodes (E 1 , E 2 ), the liquid crystal capacitances (Clc 1 , Clc 2 ), and the holding capacitances (Ccs 1 , Ccs 2 ), as common constituent elements, in a similar manner to that of the example shown in FIG. 49 .
- the second sub-pixel portion 98 further includes a transistor T 3 having a gate electrode connected to a second scanning signal line G 2 L and having a source electrode connected to the pixel electrode E 2 , a capacitance electrode E 3 connected to a drain electrode of the transistor T 3 , and a capacitance Ccs 3 formed by the capacitance electrode E 3 and the holding capacitance line CS 2 .
- a potential of the pixel electrode E 1 in the first sub-pixel portion 97 and a potential of the pixel electrode E 2 in the second sub-pixel portion 98 become equal.
- the transistor T 3 becomes in an on state.
- a predetermined number (typically 12) of holding-capacitance line trunks are formed in a peripheral region of a display panel, and holding capacitance lines arranged in a display region are collected in the holding-capacitance line trunks in the peripheral region.
- 1080 holding capacitance lines are provided in a liquid crystal display device that has 1080 scanning signal lines GL, and the 1080 holding capacitance lines are collected in 12 holding-capacitance line trunks, for example, in the peripheral region.
- a size of a load capacitance of one holding-capacitance line trunk becomes a sum of a capacitance formed by the holding-capacitance line trunk and other electrodes and lines, and a capacitance formed by holding capacitance lines that are connected to the holding-capacitance line trunk and other electrodes and lines. That is, a size of a load capacitance of one holding-capacitance line trunk greatly depends on the number of holding capacitance lines connected to the holding-capacitance line trunk. Therefore, the load capacitance of the holding-capacitance line trunk becomes large with the increase of the number of holding capacitance lines connected to the holding-capacitance line trunk.
- alternating current driving is performed as to the holding capacitance lines. That is, alternating current driving is also performed as to the holding-capacitance line trunk. Therefore, especially in a large-type liquid crystal display device, reduction of a display quality may occur due to a delay of a signal potential provided from an outside. In this respect, reduction of a wiring resistance by increasing a width (a wiring pattern width) of the holding-capacitance line trunk can be considered to prevent the delay of the signal potential. However, because a picture-frame size becomes large by increasing the width of the holding-capacitance line trunk, reduction of the size of the device cannot be realized.
- a sufficient display quality cannot be maintained for the following reason.
- the transistor T 3 becomes in an on state, and a charge shifts between the pixel electrode E 2 and the capacitance electrode E 3 .
- a potential of the capacitance electrode E 3 is held during a period until when the transistor T 3 becomes in an on state next.
- a potential provided to the pixel electrode E 2 when the transistor T 2 becomes in an on state is different depending on a display image. Therefore, a potential provided to the capacitance electrode E 3 when the transistor T 3 becomes in an on state is also different depending on a display image.
- a potential of the capacitance electrode E 3 that is held during a period from when the transistor T 3 becomes in an off state until when the transistor T 3 becomes in an on state is not a constant potential. Therefore, a variation of a potential of the pixel electrode E 2 when the transistor T 3 becomes in an on state is not constant either. Accordingly, for example, a sufficient potential difference does not occur in some cases between the pixel electrode E 1 in the first sub-pixel portion 97 and the pixel electrode E 2 in the second sub-pixel portion 98 .
- An object of the present invention is to realize a narrow picture-frame by decreasing a wiring region without reducing a display quality, in a liquid crystal display device in which one pixel is divided into a plurality of sub pixels.
- a first aspect of the present invention is directed to a liquid crystal display device in which a pixel formation portion forming one pixel includes a first sub-pixel portion and a second sub-pixel portion, the liquid crystal display device comprising:
- a plurality of the pixel formation portions that are respectively provided to correspond to intersections of the plurality of data signal lines and the plurality of first scanning signal lines, and form a pixel matrix
- the first sub-pixel portion includes
- the second sub-pixel portion includes
- a second scanning signal line corresponding to each row in the pixel matrix is selected after a first scanning signal line corresponding to the each row is selected.
- a different potential is provided every one frame period to the potential varying capacitance line.
- the potential varying capacitance line is arranged to extend to a direction parallel with a direction to which the data signal line extends
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line is arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the data signal line and the potential varying capacitance line.
- the potential varying capacitance line is arranged to extend to a direction parallel with a direction to which the data signal line extends
- the first scanning signal line and the second scanning signal line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the data signal line and the potential varying capacitance line.
- the potential varying capacitance line is arranged to extend to a direction parallel with a direction to which the first scanning signal line extends
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line and the potential varying capacitance line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between adjacent two of the data signal lines.
- the potential varying capacitance electrode included in a pixel formation portion in each row in the pixel matrix is laid out such that a capacitance is formed between the potential varying capacitance electrode and the first pixel electrode included in a pixel formation portion in the next row of the each row,
- a data signal line arranged at one side of the each column and a data signal line arranged at the other side in the each column are alternately connected for each one row to the second electrodes of the first switching element and the second switching element in the pixel formation portion, and
- a second scanning signal line corresponding to each row in the pixel matrix is selected after a first scanning signal line corresponding to the next row of the each row is selected.
- the data signal line includes a first data signal line and a second data signal line in each column in the pixel matrix
- the potential varying capacitance line is arranged to extend to a direction parallel with a direction to which the first scanning signal line extends
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line and the potential varying capacitance line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the first data signal line and the second data signal line,
- the first data signal line and the second data signal line are alternately connected for each one row to the second electrodes of the first switching element and the second switching element in the pixel formation portion,
- the potential varying capacitance electrode included in a pixel formation portion in each row in the pixel matrix is laid out such that a capacitance is formed between the potential varying capacitance electrode and the first pixel electrode included in a pixel formation portion in the next row of the each row,
- the plurality of first scanning signal lines are sequentially driven for each one set by using two first scanning signal lines as one set, and
- two second scanning signal lines corresponding to two first scanning signal lines that constitute each one set are selected after two first scanning signal lines that constitute a set which is driven next to the each set are selected.
- the potential varying capacitance line includes a first potential varying capacitance line and a second potential varying capacitance line
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one row or for each one column,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line.
- the liquid crystal display device further comprises a plurality of holding capacitance lines to which a constant potential is provided, wherein
- a capacitance is formed by the holding capacitance line and the first pixel electrode, and
- a capacitance is formed by the holding capacitance line and the second pixel electrode.
- the holding capacitance line is arranged to extend to a direction parallel with a direction to which the data signal line extends.
- the holding capacitance line is arranged to extend to a direction parallel with a direction to which the first scanning signal line extends.
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one column,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line is arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the data signal line and the potential varying capacitance line.
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one column,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line
- the first scanning signal line and the second scanning signal line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the data signal line and the potential varying capacitance line.
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one row,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line and the potential varying capacitance line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between adjacent two of the data signal lines.
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one row,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line
- the data signal line includes a first data signal line and a second data signal line in each column in the pixel matrix
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line and the potential varying capacitance line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the first data signal line and the second data signal line,
- the first data signal line and the second data signal line are alternately connected for each one row to the second electrodes of the first switching element and the second switching element in the pixel formation portion,
- the potential varying capacitance electrode included in a pixel formation portion in each row in the pixel matrix is laid out such that a capacitance is formed between the potential varying capacitance electrode and the first pixel electrode included in a pixel formation portion in the next row of the each row,
- the plurality of first scanning signal lines are sequentially driven for each one set by using two first scanning signal lines as one set, and
- two second scanning signal lines corresponding to two first scanning signal lines that constitute each one set are selected after two first scanning signal lines that constitute a set which is driven next to the each set are selected.
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one row,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line is arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between the data signal line and the potential varying capacitance line.
- the first potential varying capacitance line and the second potential varying capacitance line are provided to alternately correspond to the pixel matrix for each one row,
- a second potential of a relatively low level is provided to the second potential varying capacitance line when a first potential of a relatively high level is provided to the first potential varying capacitance line
- the first potential is provided to the second potential varying capacitance line when the second potential is provided to the first potential varying capacitance line
- the first scanning signal line is arranged to pass between the first pixel electrode and the second pixel electrode in each row in the pixel matrix
- the second scanning signal line and the potential varying capacitance line are arranged to pass between adjacent two rows in the pixel matrix
- the first pixel electrode and the second pixel electrode included in a pixel formation portion in each column in the pixel matrix are laid out between adjacent two of the data signal lines,
- the potential varying capacitance electrode included in a pixel formation portion in each row in the pixel matrix is laid out such that a capacitance is formed between the potential varying capacitance electrode and the first pixel electrode included in a pixel formation portion in the next row of the each row,
- a data signal line arranged at one side of the each column and a data signal line arranged at the other side in the each column are alternately connected for each one row to the second electrodes of the first switching element and the second switching element in the pixel formation portion, and
- a second scanning signal line corresponding to each row in the pixel matrix is selected after a first scanning signal line corresponding to the next row of the each row is selected.
- the liquid crystal display device further comprises a plurality of holding capacitance lines to which a constant potential is provided, wherein
- a capacitance is formed by the holding capacitance line and the first pixel electrode, and
- a capacitance is formed by the holding capacitance line and the second pixel electrode, and
- the holding capacitance line is arranged to extend to a direction parallel with a direction to which the data signal line extends.
- the first switching element, the second switching element, and the third switching element are thin-film transistors made of a metal oxide semiconductor.
- a driving frequency is equal to or higher than 240 Hz.
- a first switching element and a second switching element in each row that constitutes a pixel matrix, when a first scanning signal line is selected, a first switching element and a second switching element become in an on state. Accordingly, a potential of a first pixel electrode and a potential of a second pixel electrode become substantially equal to a potential of a data signal. That is, the potential of the first pixel electrode and the potential of the second pixel electrode become equal. Thereafter, when a second scanning signal line is selected, a third switching element becomes in an on state. Accordingly, a potential of a potential varying capacitance electrode that is connected to a third electrode of the third switching element varies according to a potential provided to a potential varying capacitance line.
- the potential of the second pixel electrode also varies due to the variation of the potential of the potential varying capacitance electrode.
- the potential of the first pixel electrode and the potential of the second pixel electrode become different potentials.
- the potential of the first pixel electrode and the potential of the second pixel electrode can become different potentials as described above. Therefore, even when a width of a line trunk formed in a peripheral region of a display panel is made small, reduction of a display quality attributable to a delay of a signal potential little occurs.
- a narrow picture-frame can be realized by decreasing a wiring region, without reducing a display quality.
- a viewing angle characteristic can be improved at the maximum.
- a potential varying capacitance line is arranged to extend to a direction parallel with a direction to which a data signal line extends. Therefore, the data signal line does not cross the potential varying capacitance line, and a load of the data signal line becomes relatively small.
- a liquid crystal display device in which one pixel is divided into the plurality of sub pixels, high-speed driving and a narrow picture-frame by decreasing a wiring region can be realized, without reducing a display quality.
- a potential varying capacitance line is arranged to extend to a direction parallel with a direction to which a first scanning signal line extends. Therefore, the first scanning signal line and a second scanning signal line do not cross the potential varying capacitance line, and loads of the first scanning signal line and the second scanning signal line become relatively small. As a result, reduction of a display quality attributable to a delay of a scanning signal can be suppressed.
- a capacitance is formed by a potential varying capacitance electrode in a pixel formation portion in each row in a pixel matrix and a first pixel electrode in a pixel formation portion in the next row of the each row. Further, a second scanning signal line corresponding to each row in the pixel matrix is selected after a first scanning signal line corresponding to the next row of the each row is selected. Therefore, in each row that constitutes a pixel matrix, after a potential of a first pixel electrode and a potential of a second pixel electrode become equal by selection of the first scanning signal line, the potential of the first pixel electrode varies via a capacitance by selection of a second scanning signal line corresponding to a row before the each row.
- the potential of the second pixel electrode varies by selection of a second scanning signal line corresponding to the each row. Consequently, the potential of the first pixel electrode and the potential of the second pixel electrode become different potentials.
- an effect of viewing angle characteristic improvement can be largely obtained, and a narrow picture-frame can be realized by decreasing a wiring region, without reducing a display quality.
- a data signal line includes a first data signal line and a second data signal line.
- the liquid crystal display device can be operated at a high speed.
- a direction of a potential change of a second pixel electrode by selection of a second scanning signal line can be differentiated between adjacent pixel formation portions. Accordingly, reduction of a display quality can be suppressed.
- a narrow picture-frame in a liquid crystal display device in which a capacitance (a holding capacitance) is provided to securely hold a charge in a liquid crystal capacitance or to stabilize a field-through voltage, a narrow picture-frame can be realized by decreasing a wiring region, without reducing a display quality.
- a data signal line and a holding capacitance line do not cross each other, and a load of the data signal line becomes relatively small. Therefore, in a liquid crystal display device in which one pixel is divided into the plurality of sub pixels and in which a holding capacitance is provided, high-speed driving and a narrow picture-frame by decreasing a wiring region can be realized, without reducing a display quality.
- a first scanning signal line and a second scanning signal line do not cross a holding capacitance line, and loads of the first scanning signal line and the second scanning signal line become relatively small. As a result, reduction of a display quality attributable to a delay of a scanning signal can be suppressed.
- a transistor of high mobility is used for a switching element in a pixel formation portion, in the pixel formation portion, charge to a capacitance is quickly performed. Accordingly reduction of a display quality attributable to a shortage of a charge capacity of a switching element (a transistor) can be suppressed. Further, a size of the switching element (the transistor) can be made small, and a liquid crystal display device can be made further small.
- a narrow picture-frame in a liquid crystal display device in which one pixel is divided into the plurality of sub pixels and high speed driving is performed, a narrow picture-frame can be realized by decreasing a wiring region, without reducing a display quality.
- FIG. 1 is an equivalent circuit diagram for describing a concept common to all embodiments of the present invention.
- FIG. 2 is a schematic configuration diagram of a liquid crystal display device according to a first embodiment of the present invention.
- FIG. 3 is a plan view of an active matrix substrate in the first embodiment.
- FIG. 4 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in the first embodiment.
- FIG. 5 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the first embodiment.
- FIG. 6A is a cross-sectional view along line A-A in FIG. 5 .
- FIG. 6B is a cross-sectional view along line B-B in FIG. 5 .
- FIG. 6C is a cross-sectional view along line C-C in FIG. 5 .
- FIG. 6D is a cross-sectional view along line D-D in FIG. 5 .
- FIG. 7 is an equivalent circuit diagram of pixel formation portions in the first embodiment.
- FIG. 8 is a signal waveform diagram for describing a driving method in the first embodiment.
- FIG. 9 is a signal waveform diagram for describing a driving method in the first embodiment.
- FIG. 10 is a plan view of an active matrix substrate in a second embodiment of the present invention.
- FIG. 11 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in the second embodiment.
- FIG. 12 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the second embodiment.
- FIG. 13A is a cross-sectional view along line A-A in FIG. 12 .
- FIG. 13B is a cross-sectional view along line B-B in FIG. 12 .
- FIG. 13C is a cross-sectional view along line C-C in FIG. 12 .
- FIG. 13D is a cross-sectional view along line D-D in FIG. 12 .
- FIG. 14 is an equivalent circuit diagram of pixel formation portions in the second embodiment.
- FIG. 15 is a plan view of an active matrix substrate in a third embodiment of the present invention.
- FIG. 16 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in the third embodiment.
- FIG. 17 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the third embodiment.
- FIG. 18 is an equivalent circuit diagram of pixel formation portions in the third embodiment.
- FIG. 19 is a plan view of an active matrix substrate in a fourth embodiment of the present invention.
- FIG. 20 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in the fourth embodiment.
- FIG. 21 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the fourth embodiment.
- FIG. 22A is a cross-sectional view along line A-A in FIG. 21 .
- FIG. 22B is a cross-sectional view along line B-B in FIG. 21 .
- FIG. 22C is a cross-sectional view along line C-C in FIG. 21 .
- FIG. 22D is a cross-sectional view along line D-D in FIG. 21 .
- FIG. 23 is an equivalent circuit diagram of pixel formation portions in the fourth embodiment.
- FIG. 24 is a signal waveform diagram for describing a driving method in the fourth embodiment.
- FIG. 25 is a plan view of an active matrix substrate in a fifth embodiment of the present invention.
- FIG. 26 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in the fifth embodiment.
- FIG. 27 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the fifth embodiment.
- FIG. 28A is a cross-sectional view along line A-A in FIG. 27 .
- FIG. 28B is a cross-sectional view along line B-B in FIG. 27 .
- FIG. 28C is a cross-sectional view along line C-C in FIG. 27 .
- FIG. 28D is a cross-sectional view along line D-D in FIG. 27 .
- FIG. 29 is an equivalent circuit diagram of pixel formation portions in the fifth embodiment.
- FIG. 30 is a signal waveform diagram for describing a driving method in the fifth embodiment.
- FIG. 31 is a signal waveform diagram for describing the driving method in the fifth embodiment.
- FIG. 32 is a signal waveform diagram for describing the driving method in the fifth embodiment.
- FIG. 33 is a signal waveform diagram for describing the driving method in the fifth embodiment.
- FIG. 34 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in a sixth embodiment of the present invention.
- FIG. 35 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the sixth embodiment.
- FIG. 36A is a cross-sectional view along line A-A in FIG. 35 .
- FIG. 36B is a cross-sectional view along line B-B in FIG. 35 .
- FIG. 36C is a cross-sectional view along line C-C in FIG. 35 .
- FIG. 36D is a cross-sectional view along line D-D in FIG. 35 .
- FIG. 37 is an equivalent circuit diagram of pixel formation portions in the sixth embodiment.
- FIG. 38 is a signal waveform diagram for describing a driving method in the sixth embodiment.
- FIG. 39 is a signal waveform diagram for describing the driving method in the sixth embodiment.
- FIG. 40 is a plan view of an active matrix substrate in a seventh embodiment of the present invention.
- FIG. 41 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed in the seventh embodiment.
- FIG. 42 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed in the seventh embodiment.
- FIG. 43A is a cross-sectional view along line A-A in FIG. 42 .
- FIG. 43B is a cross-sectional view along line B-B in FIG. 42 .
- FIG. 43C is a cross-sectional view along line C-C in FIG. 42 .
- FIG. 43D is a cross-sectional view along line D-D in FIG. 42 .
- FIG. 44 is an equivalent circuit diagram of pixel formation portions in the seventh embodiment.
- FIG. 45 is a signal waveform diagram for describing a driving method in the seventh embodiment.
- FIG. 46 is a block diagram showing a configuration example of a display device for a television receiver that uses a liquid crystal display device according to the present invention.
- FIG. 47 is a block diagram showing an entire configuration including a tuner unit of a television receiver that uses a liquid crystal display device according to the present invention.
- FIG. 48 is an exploded perspective view showing a mechanical configuration of the television receiver.
- FIG. 49 is a diagram schematically showing an example of a circuit configuration of a liquid crystal display device that employs a pixel division method in a conventional example.
- FIG. 50 is an equivalent circuit diagram of another conventional liquid crystal display device that employs a pixel division method.
- holding capacitance lines CSL are not necessarily required to be included.
- FIG. 1 is an equivalent circuit diagram of each of pixel formation portions.
- Each pixel formation portion includes two sub-pixel portions (a first sub-pixel portion and a second sub-pixel portion).
- each pixel formation portion includes a first transistor TA which is a switching element having a gate electrode (a first electrode) connected to a first scanning signal line GL and having a source electrode (a second electrode) connected to a data signal line SL; a pixel electrode EA connected to a drain electrode (a third electrode) of the first transistor TA; a liquid crystal capacitance ClcA formed by a common electrode 41 to which a constant potential COM is provided as a counter electrode and the pixel electrode EA; and a holding capacitance CcsA formed by the pixel electrode EA and the holding capacitance line CSL.
- a first transistor TA which is a switching element having a gate electrode (a first electrode) connected to a first scanning signal line GL and having a source electrode (a second electrode) connected to a data signal line SL
- each pixel formation portion includes a second transistor TB which is a switching element having a gate electrode connected to the first scanning signal line GL and having a source electrode connected to the data signal line SL; a pixel electrode EB connected to a drain electrode of the second transistor TB, a liquid crystal capacitance ClcB formed by the common electrode 41 and the pixel electrode EB; a holding capacitance CcsB formed by the pixel electrode EB and the holding capacitance line CSL; a third transistor TC which is a switching element having a gate electrode connected to a second scanning signal line G 2 L and having a source electrode connected to a line SEL; a capacitance electrode EC connected to a drain electrode of the third transistor TC; and a capacitance C 1 formed by the pixel electrode EB and the capacitance electrode EC.
- a second transistor TB which is a switching element having a gate electrode connected to the first scanning signal line GL and having a source electrode connected to the data signal line SL
- a constant potential (typically the same potential as the potential COM provided to the common electrode 41 ) is provided to the holding capacitance line CSL.
- a potential of a relatively high level and a potential of a relatively low level are provided to the line SEL alternately every one frame period. Note that, hereinafter, a potential that sets transistors each having a gate electrode connected to the first scanning signal line GL or the second scanning signal line G 2 L to an on state is called a “gate-on potential”, and a potential that sets these transistors to an off state is called a “gate-off potential”.
- the line SEL is also called a “potential varying capacitance line”
- the capacitance electrode EC is also called a “potential varying capacitance electrode”
- the capacitance C 1 is also called a “potential varying capacitance”.
- the holding capacitance line and the potential varying capacitance line are also collectively called a “capacitance line”.
- the first transistor TA and the second transistor TB when a gate-on potential is provided to the first scanning signal line GL, the first transistor TA and the second transistor TB become in an on state. Accordingly, a potential of the pixel electrode EA and a potential of the pixel electrode EB become substantially equal to a potential of the data signal line SL. That is, at this time point, the potential of the pixel electrode EA and the potential of the pixel electrode EB are equal. Thereafter, a gate-off potential is provided to the first scanning signal line GL, and a gate-on potential is provided to the second scanning signal line G 2 L. Accordingly, the first transistor TA and the second transistor TB become in an off state, and the third transistor TC becomes in an on state.
- the potential of the capacitance electrode EC varies by the third transistor TC becoming in an on state. Then, the potential of the pixel electrode EB also varies due to a variation of the potential of the capacitance electrode EC. As a result, the potential of the pixel electrode EA and the potential of the pixel electrode EB become different potentials.
- a constant potential is provided to the holding capacitance line CSL, and a constant potential is provided to the potential varying capacitance line SEL through one frame period. That is, a signal of a high frequency is not provided to the capacitance line. Therefore, reduction of a display quality attributable to a signal delay does not easily occur, and a capacitance line trunk can be realized by a thin width in a peripheral region of a display panel.
- a potential of the common electrode 41 and a potential of the holding capacitance line CSL are constant, however the present invention is not limited thereto.
- the potential of the common electrode 41 and the potential of the holding capacitance line CSL are not necessarily required to be constant, so long as a desired image display can be realized.
- FIG. 2 is a schematic configuration diagram of a liquid crystal display device according to a first embodiment of the present invention.
- This liquid crystal display device is configured by an active matrix substrate 1 on which TFTs and pixel electrodes are formed; a counter substrate 2 on which the common electrode 41 for applying a voltage to between the common electrode 41 and pixel electrodes with a liquid crystal layer interposed therebetween and color filters for a color image display are formed; polyimide films 5 on which gate driver ICs 3 are mounted by an SOF (System On Film) system; polyimide films 6 on which source driver ICs 4 are mounted by the SOF system; and an external substrate 7 on which a capacitance line driver and a controller that controls operations of the gate driver ICs 3 and the source driver ICs 4 are provided.
- SOF System On Film
- a liquid crystal panel 11 that has a display region as shown by a reference character 8 is formed, by bonding the active matrix substrate 1 and the counter substrate 2 together by a sealing material.
- the polyimide films 5 are fitted to the active matrix substrate 1
- the polyimide films 6 are fitted to the active matrix substrate 1 and the external substrate 7 .
- a gate driver unit described later is realized by the plurality of gate driver ICs 3
- a source driver unit described later is realized by the plurality of source driver ICs 4 .
- Oriented films, orientation control structures, and liquid crystal materials are held between the active matrix substrate 1 and the counter substrate 2 , but these are omitted in FIG. 2 .
- optical films such as polarizing films, a backlight, other optical parts, circuit parts, and bezels that hold these parts at predetermined positions, in addition to the above constituent elements.
- these parts are also omitted in FIG. 2 .
- the gate driver ICs 3 are provided at both end sides of the active matrix substrate 1 (at a left-side side and a right-side side of the active matrix substrate 1 , in FIG. 2 ), however, the present invention is not limited thereto.
- the gate driver ICs 3 may be provided at only one end side of the active matrix substrate 1 .
- the source driver ICs 4 are provided at only one end side of the active matrix substrate 1 (at an upper-side side of the active matrix substrate 1 , in FIG. 2 ), however, the present invention is not limited thereto.
- the source driver ICs 4 may be provided at both end sides of the active matrix substrate 1 .
- FIG. 3 is a plan view of the active matrix substrate 1 in the present embodiment. As shown in FIG. 3 , a region on the active matrix substrate 1 that constitutes the liquid crystal panel 11 is divided into a display region 8 and a peripheral region 9 . On the active matrix substrate 1 , there are provided m first scanning signal lines GL 1 to GLm, m second scanning signal lines G 2 L 1 to G 2 Lm, n data signal lines SL 1 to SLn, pixel formation portions that are provided at intersections of the first scanning signal lines and the data signal lines at one to one (that is, m ⁇ n pixel formation portions), the holding capacitance lines CSL, first potential varying capacitance lines (hereinafter, abbreviated as “first capacitance lines”) SEL 1 , and second potential varying capacitance lines (hereinafter, abbreviated as “second capacitance lines”) SEL 2 that are arranged to extend in parallel with the data signal lines, and a holding-capacitance line trunk 18 , a first capacitance
- a pixel matrix of m rows ⁇ n columns is formed by the m ⁇ n pixel formation portions.
- the holding capacitance lines CSL are provided to correspond to the data signal lines at one to one.
- the first capacitance lines SEL 1 and the second capacitance lines SEL 2 are provided to alternately correspond to the pixel matrix for each one column.
- FIG. 3 out of the m ⁇ n pixel formation portions, only four pixel formation portions PIX 1 to PIX 4 are shown. Two sub-pixel portions (a first sub-pixel portion and a second sub-pixel portion) are included in each pixel formation portion. In the present embodiment, a first sub-pixel portion and a second sub-pixel portion are laid out to sandwich a first scanning signal line. A second sub-pixel portion is laid out in a region between a first scanning signal line and a second scanning signal line.
- the pixel formation portion PIX 1 is provided to correspond to an intersection of an i-th row first scanning signal line GLi and a j-th column data signal line SLj.
- the pixel formation portion PIX 2 is provided to correspond to an intersection of an (i+1)-th row first scanning signal line GLi+1 and the j-th column data signal line SLj.
- the pixel formation portion PIX 3 is provided to correspond to an intersection of the i-th row first scanning signal line GLi and an (j+1)-th column data signal line SLj+1.
- the pixel formation portion PIX 4 is provided to correspond to an intersection of the (i+1)-th row first scanning signal line GLi+1 and the (j+1)-th column data signal line SLj+1.
- the pixel formation portion PIX 1 includes a first sub-pixel portion PIX 1 A and a second sub-pixel portion PIX 1 B.
- the holding capacitance line CSL is arranged to be superimposed with the pixel formation portion PIX 1 in a vertical direction on the active matrix substrate 1 , and a capacitance is formed by the holding capacitance line CSL and an electrode in the pixel formation portion PIX 1 . This is similarly applied to the pixel formation portions PIX 2 to PIX 4 .
- the first scanning signal lines GL 1 to GLm and the second scanning signal lines G 2 L 1 to G 2 Lm are connected to a gate driver unit 21 .
- the gate driver unit 21 provides a scanning signal to the first scanning signal lines GL 1 to GLm and the second scanning signal lines G 2 L 1 to G 2 Lm.
- a potential of the scanning signal is a gate-on potential or a gate-off potential.
- the data signal lines SL 1 to SLn are connected to the source driver unit 22 .
- the source driver unit 22 provides a data signal according to an image to be displayed, to the data signal lines SL 1 to SLn.
- the holding-capacitance line trunk 18 , the first capacitance line trunk 19 , and the second capacitance line trunk 20 are connected to a capacitance line driver unit 23 .
- the capacitance line driver unit 23 provides a constant potential to the holding-capacitance line trunk 18 , and provides a potential of a relatively high level and a potential of a relatively low level to the first capacitance line trunk 19 and the second capacitance line trunk 20 alternately every one frame period.
- FIG. 4 is a plan view of a region in which the pixel formation portions PIX 1 to PIX 4 are formed.
- the data signal line SLj is arranged along one side (a left side in FIG. 4 ) of the pixel formation portions PIX 1 , PIX 2
- the first capacitance line SEL 1 is arranged along the other side (a right side in FIG. 4 ) of the pixel formation portions PIX 1 , PIX 2
- the data signal line SLj+1 is arranged along one side of the pixel formation portions PIX 3 , PIX 4
- the second capacitance line SEL 2 is arranged along the other side of the pixel formation portions PIX 3 , PIX 4 .
- the holding capacitance lines CSL are arranged to pass on the pixel formation portions PIX 1 , PIX 2 and on the pixel formation portions PIX 3 , PIX 4 , respectively.
- the first scanning signal line GLi is arranged to pass between two pixel electrodes 29 a , 29 b that are included in the pixel formation portion PIX 1 and between two pixel electrodes 69 a , 69 b that are included in the pixel formation portion PIX 3 .
- the first scanning signal line GLi+1 is arranged to pass between two pixel electrodes 49 a , 49 b that are included in the pixel formation portion PIX 2 and between two pixel electrodes 89 a , 89 b that are included in the pixel formation portion PIX 4 . Further, a second scanning signal line G 2 Li is arranged along one side (a lower side in FIG. 4 ) of the pixel formation portions PIX 1 , PIX 3 , and a second scanning signal line G 2 Li+1 is arranged along one side of the pixel formation portions PIX 2 , PIX 4 . Because all pixel formation portions have a similar structure, a description is made below by mainly focusing attention on only the pixel formation portion PIX 1 .
- FIG. 5 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- a first transistor TFT 1 a and a second transistor TFT 1 b are provided to be connected respectively to the first scanning signal line GLi.
- the first transistor TFT 1 a and the second transistor TFT 1 b share a source electrode 24 , and the source electrode 24 is formed to extend in parallel with the first scanning signal line GLi from the data signal line SLj.
- a drain electrode 25 a of the first transistor TFT 1 a is connected to an electrode 27 a by a drain lead line 26 a .
- the electrode 27 a is connected to the pixel electrode 29 a via a contact 28 a .
- a drain electrode 25 b of the second transistor TFT 1 b is connected to an electrode 27 b by a drain lead line 26 b .
- the electrode 27 b is connected to the pixel electrode 29 b via a contact 28 b.
- a third transistor TFT 1 c is provided to be connected to the second scanning signal line G 2 Li.
- a source electrode 24 c of the third transistor TFT 1 c is formed integrally with the first capacitance line SEL 1 .
- a drain electrode 25 c of the third transistor TFT 1 c is connected to a capacitance electrode (a potential varying capacitance electrode) 31 by a drain lead line 26 c .
- the capacitance electrode 31 is formed to extend in parallel with the first capacitance line SEL 1 .
- the holding capacitance line CSL and the pixel electrode 29 a are laid out to be superimposed in a vertical direction on the active matrix substrate 1 . Accordingly, a holding capacitance Ccs 1 a is formed.
- the holding capacitance line CSL and the pixel electrode 29 b are laid out to be superimposed in a vertical direction on the active matrix substrate 1 . Accordingly, a holding capacitance Ccs 1 b is formed.
- the capacitance electrode 31 and the pixel electrode 29 b are laid out to be superimposed in a vertical direction on the active matrix substrate 1 . Accordingly, the potential varying capacitance C 1 is formed.
- FIG. 6A is a cross-sectional view along line A-A in FIG. 5 .
- FIG. 6B is a cross-sectional view along line B-B in FIG. 5 .
- FIG. 6C is a cross-sectional view along line C-C in FIG. 5 .
- FIG. 6D is a cross-sectional view along line D-D in FIG. 5 .
- the active matrix substrate 1 and the counter substrate 2 are laid out to opposed to each other with a liquid crystal layer 44 interposed therebetween.
- the first scanning signal line GLi On a glass substrate 10 , there are formed the first scanning signal line GLi, the second scanning signal line G 2 Li, gate electrodes 32 , 32 c , and the holding capacitance lines CSL, and there is formed a gate insulation layer 33 made of nitride silicon as an inorganic material so as to cover them.
- the gate electrode 32 In the first transistor TFT 1 a and the second transistor TFT 1 b , the gate electrode 32 is formed integrally with the first scanning signal line GLi.
- the gate electrode 32 c is formed integrally with the second scanning signal line G 2 Li.
- an interlayer insulation layer 35 is formed on the gate insulation layer 33 on the first transistor TFT 1 a and the second transistor TFT 1 b .
- a semiconductor layer 34 On the gate insulation layer 33 on the first transistor TFT 1 a and the second transistor TFT 1 b , there are formed a semiconductor layer 34 , the source electrode 24 that is in contact with the semiconductor layer 34 , and the drain electrodes 25 a , 25 b , and there are formed the data signal line SLj, the drain lead lines 26 a , 26 b , and the electrodes 27 a , 27 b near them.
- an interlayer insulation layer 35 is formed on a further upper layer.
- the gate insulation layer 33 in the third transistor TFT 1 c there are formed a semiconductor layer 34 c , and the source electrode 24 c and the drain electrode 25 c that are in contact with the semiconductor layer 34 c , and there are formed the drain lead line 26 c and the capacitance electrode 31 near them.
- the interlayer insulation layer 35 is formed on a further upper layer.
- the source electrode 24 c of the third transistor TFT 1 c is formed integrally with the first capacitance line SEL.
- the semiconductor layers 34 , 34 c are made of an intrinsic amorphous silicon layer (an i layer), and a phosphorus-doped n + -type amorphous silicon layer (an n + layer).
- the n + layer has a role of a contact layer for performing an electric connection between a semiconductor material of the i layer and the like and a metal material of the source electrodes 24 , 24 c , the drain electrodes 25 a , 25 b , 25 c , and the like.
- the n + layer is removed by etching and the like, and this region is made of only the i layer.
- the interlayer insulation layer 35 is made of nitride silicon as an inorganic material.
- the pixel electrodes 29 a , 29 b made of an ITO (Indium Tin Oxide) are formed on the interlayer insulation layer 35 .
- ITO Indium Tin Oxide
- the oriented films are omitted in the figure.
- the interlayer insulation layer 35 is hollowed out such that the pixel electrode 29 a and the electrode 27 a are electrically connected.
- the interlayer insulation layer 35 is hollowed out such that the pixel electrode 29 b and the electrode 27 b are electrically connected.
- a black matrix 42 and a colored layer 43 are formed on the glass substrate 40 , and the common electrode (the counter electrode) 41 is formed on a further upper layer.
- an oriented film is formed to cover the common electrode 41 , the oriented film is omitted in the figure. Note that, a structure of the counter substrate 2 side in second and subsequent embodiments is similar to the structure in the present embodiment.
- FIG. 7 is an equivalent circuit diagram of pixel formation portions in the present embodiment.
- the pixel formation portion PIX 1 includes as constituent elements of the first sub-pixel portion PIX 1 A, the first transistor TFT 1 a having a gate electrode connected to the first scanning signal line GLi and having a source electrode connected to the data signal line SLj, the pixel electrode 29 a connected to a drain electrode of the first transistor TFT 1 a , a liquid crystal capacitance Clc 1 a formed by the common electrode 41 to which a constant potential COM is provided and the pixel electrode 29 a , and the holding capacitance Ccs 1 a formed by the pixel electrode 29 a and the holding capacitance line CSL.
- the pixel formation portion PIX 1 includes as constituent elements of the second sub-pixel portion PIX 1 B, the second transistor TFT 1 b having a gate electrode connected to the first scanning signal line GLi and having a source electrode connected to the data signal line SLj, the pixel electrode 29 b connected to a drain electrode of the second transistor TFT 1 b , a liquid crystal capacitance Clc 1 b formed by the common electrode 41 and the pixel electrode 29 b , a holding capacitance Ccs 1 b formed by the pixel electrode 29 b and the holding capacitance line CSL, the third transistor TFT 1 c having a gate electrode connected to the second scanning signal line G 2 Li and having a source electrode connected to the first capacitance line SEL 1 , the capacitance electrode 31 connected to a drain electrode of the third transistor TFT 1 c , and the potential varying capacitance C 1 formed by the pixel electrode 29 b and the capacitance electrode 31 .
- titanium (Ti), aluminum (Al), titanium (Ti) are sequentially deposited on a transparent insulation substrate (the glass substrate 10 in FIG. 6A to FIG. 6D ) of glass, plastics, or the like, by a sputtering method using an argon (Ar) gas, and a gate metal film as a Ti/Al/Ti laminated film is formed.
- a film thickness of titanium is 100 nm, for example, at both an upper layer side and a lower layer side
- a film thickness of aluminum is 300 nm, for example.
- a temperature of the glass substrate 10 when forming the gate metal film is 200° C. to 300° C.
- a photolithography method that is, by a method of forming a resist pattern film by a photoresist material on a film to be processed and patterning the film by using the resist pattern film as a mask, there are formed the first scanning signal line GLi, the second scanning signal line G 2 Li, the gate electrodes 32 , 32 c , and the capacitance electrode 31 from the gate metal film.
- a dry etching method mainly using a chlorine (Cl 2 ) gas, for example, is employed.
- the resist pattern film is removed by using a remover containing organic alkali.
- an indium tin oxide (ITO), or a single metal such as tungsten (W), copper (Cu), chrome (Cr), molybdenum (Mo), aluminum (Al), and titanium (Ti), or a material obtained by including nitrogen, oxygen, or other metal into these metals may be used besides an aluminum and a titanium.
- the gate metal film may be a single layer using the above material, or may have a laminated structure.
- the first scanning signal line and the second scanning signal line may be formed by a Ti/Cu/Ti laminated film using titanium and copper, or a Mo/Cu/Mo laminated film using copper and molybdenum.
- a vapor-deposition method and the like may be used besides the sputtering method.
- a thickness of the gate metal film is not particularly limited.
- a method of etching the gate metal film is not limited to the above dry etching method, and a wet etching method using an etchant such as an acid or other method may be employed.
- a first silicon nitride (SiNx) film serving as the gate insulation layer 33 , an amorphous silicon film serving as the intrinsic amorphous silicon film (the i layer), and an n + -type amorphous silicon film serving as the n + -type amorphous silicon layer (the n + layer).
- a film thickness of the first silicon nitride film is 400 nm, for example, a film thickness of the amorphous silicon film is 200 nm, for example, and a film thickness of the n + -type amorphous silicon film is 50 nm, for example.
- a temperature of the glass substrate 10 when forming these films is 200° C. to 300° C.
- silane (SiH 4 ), ammonium (NH 3 ), hydrogen (H 2 ), and nitrogen (N 2 ) are used in a suitable combination.
- the amorphous silicon film and the n + -type amorphous silicon film are patterned in a predetermined shape, and a primary-processed amorphous silicon film and a primary-processed n + -type amorphous silicon film are obtained.
- a dry etching method using a gas obtained by suitably combining a chlorine (Cl 2 ) gas, a carbon tetrachloride (CF 2 ) gas, and an oxygen (O 2 ) gas, for example.
- a resist pattern film is removed by using a remover containing organic alkali.
- the first silicon nitride film is patterned in a predetermined shape, and the gate insulation layer 33 is formed from the first silicon nitride film.
- a dry etching method using a gas obtained by suitably combining a carbon tetrachloride (CF 2 ) gas and an oxygen (O 2 ) gas, and next, a resist pattern film is removed in a similar manner.
- titanium (Ti), aluminum (Al), and titanium (Ti) are sequentially deposited on the gate insulation layer 33 and on the semiconductor layer 34 (made of an amorphous silicon film and an n + -type amorphous silicon film), and a source metal film as a Ti/Al/Ti laminated film is formed.
- a film thickness of titanium is 100 nm, for example, at both an upper layer side and a lower layer side, and a film thickness of aluminum is 300 nm, for example.
- a method similar to that of etching the gate metal film can be used. In this case, a resist pattern film used for a process by the photolithography method is not removed and is left for the next process.
- materials other than aluminum and titanium may be employed in a similar manner to that for the gate metal film.
- an etching process (channel etching) is performed again to the amorphous silicon film and the n + -type amorphous silicon film, and the semiconductor layers 34 , 34 c made of the intrinsic amorphous silicon layer (the i layer) and the n + -type amorphous silicon layer (the n + layer) are obtained.
- etching is performed to a part of a surface of the amorphous silicon film and the n + -type amorphous silicon film, by using as a mask the resist pattern film that is used to form patterns of the source electrodes 24 , 24 c , the drain electrodes 25 a , 25 b , 25 c , the holding capacitance lines CSL, the first capacitance lines SEL 1 , the data signal line SLj, the drain lead lines 26 a , 26 b , 26 c , and the electrodes 27 a , 27 b , 27 c .
- the source electrode 24 is separated from the drain electrodes 25 a , 25 b , and the source electrode 24 c is separated from the drain electrode 25 c .
- a dry etching method using a gas obtained by suitably combining a chlorine (Cl 2 ) gas, a carbon tetrachloride (CF 2 ) gas, and an oxygen (O 2 ) gas, for example.
- a main reason for performing etching to a part of the surface of the amorphous silicon film is to securely remove the n + -type amorphous silicon film by over-etching.
- a second silicon nitride film serving as the interlayer insulation layer 35 is formed to cover the source electrode 24 , 24 c , the drain electrodes 25 a , 25 b , 25 c , the holding capacitance lines CSL, the first capacitance lines SEL 1 , the data signal line SLj, the drain lead lines 26 a , 26 b , 26 c , the electrodes 27 a , 27 b , 27 c , or the like.
- a plasma CVD method is used.
- a temperature of the glass substrate 10 when forming the second silicon nitride film is 200° C. to 300° C.
- silane (SiH 4 ), ammonium (NH 3 ), hydrogen (H 2 ), nitrogen (N 2 ), or the like are used in a suitable combination.
- a film thickness of the second silicon nitride film is 300 nm, for example.
- etching is performed to the second silicon nitride film serving as the interlayer insulation layer 35 to have a predetermined pattern, by a photolithography method, and the interlayer insulation layer 35 and the contacts 28 a , 28 b , 30 are formed.
- a method similar to that used to etch silicon nitride serving as the gate insulation layer 33 can be used.
- an ITO (Indium Tin Oxide) film for example, is formed to have a film thickness of about 100 nm by a sputtering method or the like, on the interlayer insulation layer 35 . Further, the ITO film is patterned in a predetermined shape by a photolithography method, and the pixel electrodes 29 a , 29 b and a connection electrode 36 are formed. For etching the ITO film, an oxalic acid (HOOC—COOH) and a ferric chloride liquid are used, for example. Lastly, a solution containing an oriented film material is coated to cover the pixel electrodes 29 a , 29 b by an inkjet method or the like, and an oriented film is formed.
- HOOC—COOH oxalic acid
- ferric chloride liquid ferric chloride liquid
- the interlayer insulation layer 35 may be a laminated film obtained by laminating a silicon nitride film and an organic insulation film generated by using a photosensitive material, from a glass substrate 10 side.
- FIG. 8 shows changes of potentials of the first scanning signal line GLi, the second scanning signal line G 2 Li, the first scanning signal line GLi+1, the second scanning signal line G 2 Li+1, the data signal lines SLj, SLj+1, the holding capacitance lines CSL, the first capacitance line SEL 1 , and the second capacitance line SEL 2 .
- FIG. 8 shows changes of potentials of the first scanning signal line GLi, the second scanning signal line G 2 Li, the first scanning signal line GLi+1, the second scanning signal line G 2 Li+1, the data signal lines SLj, SLj+1, the holding capacitance lines CSL, the first capacitance line SEL 1 , and the second capacitance line SEL 2 .
- FIG. 9 shows changes of potentials of the capacitance electrode 31 , the pixel electrodes 29 a , 29 b , the capacitance electrode 51 , the pixel electrodes 49 a , 49 b , the capacitance electrode 71 , the pixel electrodes 69 a , 69 b , the capacitance electrode 91 , and the pixel electrodes 89 a , 89 b .
- Concerning FIG. 8 and FIG. 9 it is assumed that waveforms in odd frames are shown at the left side, and waveforms in even frames are shown at the right side.
- a time interval between dashed lines adjacent in left and right directions is one horizontal scanning period.
- a liquid crystal display device is driven at a frame rate of 120 Hz, one horizontal scanning period is 7.4 ⁇ s, and one vertical scanning period (one frame period) is 8.3 ⁇ s, for example.
- the present invention is not limited to these.
- the present invention can be also applied to a liquid crystal display device that is driven at a frame rate of 240 Hz.
- a gate-on potential Vgh is provided to the first scanning signal line GLi during one horizontal scanning period, and thereafter, the gate-on potential Vgh is provided to the first scanning signal line GLi+1 during one horizontal scanning period.
- the gate-on potential Vgh is sequentially provided to the first scanning signal lines GL 1 to GLm, for each one row.
- the gate-on potential Vgh is provided during one horizontal scanning period during one frame period, and a gate-off potential Vgl is provided during other period.
- a timing at which the gate-on potential Vgh is provided to adjacent two first scanning signal lines is shifted by one horizontal scanning period.
- a gate-on potential Vgh is provided to the second scanning signal line G 2 Li during one horizontal scanning period, and thereafter, the gate-on potential Vgh is provided to the second scanning signal line G 2 Li+1 during one horizontal scanning period.
- the gate-on potential Vgh is also sequentially provided to the second scanning signal lines GL 1 to GLm, for each one row.
- the gate-on potential Vgh is provided during one horizontal scanning period during one frame period, and the gate-off potential Vgl is provided during other period.
- a timing at which the gate-on potential Vgh is provided to adjacent two second scanning signal lines is shifted by one horizontal scanning period. Concerning each row, a timing at which the gate-on potential Vgh is provided to the second scanning signal line is delayed by one horizontal scanning period from the timing at which the gate-on potential Vgh is provided to the first scanning signal line.
- a potential Vsh that is higher than the potential COM of the common electrode 41 is provided in odd frames, and a potential Vsl that is lower than the potential COM is provided in even frames.
- the potential Vsl is provided in odd frames, and the potential Vsh is provided in even frames.
- a potential of a positive polarity and a potential of a negative polarity with reference to the potential COM of the common electrode 41 are provided alternately every one frame period. A polarity reversal between the potential of the positive polarity and the potential of the negative polarity is performed during a blanking period.
- Potentials of adjacent two data signal lines have mutually opposite polarities. That is, when a potential of the positive polarity is provided to a certain data signal line, a potential of the negative polarity is provided to a data signal line adjacent to this data signal line.
- a potential provided to a data signal line has a magnitude corresponding to an image to be displayed, a description is made here by assuming that a stationary image of one color is displayed on an entire screen.
- a potential equal to the potential COM of the common electrode 41 is provided to the holding capacitance line CSL.
- the potential COM of the common electrode 41 is maintained at a constant value. Therefore, potentials of the holding capacitance lines CSL are also maintained at a constant value. Note that, the potentials of the holding capacitance lines CSL may be set to a constant value slightly different from the potential COM of the common electrode 41 to prevent occurrence of flicker and burning due to a direct current component applied to the pixel electrode.
- a potential Vcsh of a relatively high level and a potential Vcsl of a relatively low level are provided to the first capacitance lines SEL 1 and the second capacitance lines SEL 2 alternately every one frame period.
- the potential Vcsh is provided to one of the first capacitance line SEL 1 and the second capacitance line SEL 2
- the potential Vcsl is provided to the other capacitance line.
- a timing at which potentials provided to the first capacitance line SEL 1 and the second capacitance line SEL 2 change is preferably in a blanking period such that an inconvenience does not occur in display.
- a potential of the first scanning signal line GLi becomes the gate-on potential Vgh. Accordingly, the first transistors TFT 1 a , TFT 3 a and the second transistors TFT 1 b , TFT 3 b become in an on state.
- a potential of the data signal line SLj is the potential Vsh of the positive polarity
- a potential of the data signal line SLj+1 is the potential Vsl of the negative polarity.
- a potential of the second scanning signal line G 2 Li becomes the gate-on potential Vgh. Accordingly, the third transistors TFT 1 c , TFT 3 c become in an on state.
- the first capacitance line SEL 1 is at the potential Vcsh of a relatively high level
- the second capacitance line SEL 2 is at the potential Vcsl of a relatively low level. Therefore, at the time point t 11 , a potential of the capacitance electrode 31 in the pixel formation portion PIX 1 increases to Vcsh, and a potential of the capacitance electrode 71 in the pixel formation portion PIX 3 decreases to Vcsl.
- K is obtained by the following Equation (2).
- K Cl /( Clc 1 b+Ccs 1 b+Cl ) (2)
- a parasitic capacitance between electrodes of the second transistors TFT 1 b and TFT 3 b is not considered because this capacitance is small, and other small parasitic capacitances that do not directly affect the present invention are not considered either.
- the potential of the pixel electrode 29 b increases from Vsh to Vsh+ ⁇ V.
- the capacitance electrode 71 and the pixel electrode 69 b are capacitance-coupled, the potential of the pixel electrode 69 b also changes due to the change of the potential of the capacitance electrode 71 .
- the potential of the pixel electrode 69 b decreases from Vsl to Vsl ⁇ V.
- ⁇ V is obtained by the above Equation (1)
- K is obtained by the following Equation (2-1).
- ⁇ V can be similarly obtained, by setting values of Ccs 1 b , Ccs 2 b , Ccs 3 b , Ccs 4 b to 0.
- a potential of the first scanning signal line GLi+1 becomes the gate-on potential Vgh. Accordingly, the first transistors TFT 2 a , TFT 4 a and the second transistors TFT 2 b , TFT 4 b become in an on state. Consequently, at the time point t 11 , the potentials of the pixel electrodes 49 a , 49 b in the pixel formation portion PIX 2 increase to Vsh, and the potentials of the pixel electrodes 89 a , 89 b in the pixel formation portion PIX 4 decrease to Vsl.
- a potential of the second scanning signal line G 2 Li+1 becomes the gate-on potential Vgh. Accordingly, the third transistors TFT 2 c , TFT 4 c become in an on state. Consequently, at the time point t 12 , the potential of the capacitance electrode 51 in the pixel formation portion PIX 2 increases to Vcsh, and the potential of the capacitance electrode 91 in the pixel formation portion PIX 4 decreases to Vcsl. Because the capacitance electrode 51 and the pixel electrode 49 b are capacitance-coupled, the potential of the pixel electrode 49 b also changes.
- the potential of the pixel electrode 89 b also changes.
- the potential of the pixel electrode 49 b increases from Vsh to Vsh+ ⁇ V, and the potential of the pixel electrode 89 b decreases from Vsl to Vsl ⁇ V.
- the potentials of the pixel electrodes 29 a , 29 b , 69 a , and 69 b are maintained during a period until when the potential of the first scanning signal line GLi becomes the gate-on potential Vgh in the even frames (during a period up to a time point t 20 ).
- the potentials of the pixel electrodes 49 a , 49 b , 89 a , and 89 b are maintained during a period until when the potential of the first scanning signal line GLi+1 becomes the gate-on potential Vgh in the even frames (during a period up to a time point t 21 ).
- the potential of the pixel electrode of the second sub-pixel portion slightly varies. Consequently, during a major period of one frame period, different potentials are provided to the pixel electrode of the first sub-pixel portion and the pixel electrode of the second sub-pixel portion.
- a third transistor having a gate electrode connected to a second scanning signal line and having a source electrode connected to a potential varying capacitance line, a capacitance electrode (a potential varying capacitance electrode) connected to a drain electrode of the third transistor, and a capacitance (a potential varying capacitance) formed by a pixel electrode and a capacitance electrode.
- the potential of the pixel electrode of the second sub-pixel portion varies based on the potential of the potential varying capacitance line when the third transistor is set to an on state.
- the potential Vcsh of a relatively high level and the potential Vcsl of a relatively low level are provided to the potential varying capacitance line alternately every one frame period.
- the potential COM of a constant level is provided to the holding capacitance line.
- the capacitance line is direct-current driven during each frame period. Therefore, even when a width of a capacitance line trunk formed in a peripheral region of a display panel is set narrow, reduction of a display quality attributable to a delay of a signal potential little occurs.
- a narrow picture-frame by reduction of a wiring region can be realized without reducing a display quality.
- a transistor that uses amorphous silicon for semiconductor layers is employed.
- the present invention is not limited thereto, and a transistor may be employed that uses a microcrystalline silicon film, a polycrystalline silicon film, a metal oxide semiconductor film, or the like for semiconductor layers.
- these semiconductor layers may be a two-layer structure or a multilayer structure made of an intrinsic layer and a low-resistance contact layer, in a similar manner to that when an amorphous silicon TFT is employed.
- the microcrystalline silicon film is a silicon film that internally has a mixed state of a crystal phase made of fine crystal grains and an amorphous phase.
- the polycrystalline silicon film is a film made of a crystal phase and a slight crystal grain boundary present in the crystal phase, and having a very high crystallization rate.
- Many of metal oxide semiconductor films contain zinc (Zn), indium (In), gallium (Ga), titanium (Ti), or the like as main components, as constituent metal elements.
- the metal oxide semiconductor films include a Zn—O based semiconductor (ZnO) film, an In—Ga—Zn—O based semiconductor (IGZO) film, an In—Zn—O based semiconductor (IZO) film, a Zn—Ti—O based semiconductor (ZTO) film, and a Ti—O based semiconductor (titanium dioxide) film. It is particularly preferable that the IGZO film and the ZTO film are amorphous, to have an excellent on-off ratio of transistors.
- a microcrystalline silicon film, a polycrystalline silicon film, and a metal oxide semiconductor film are employed for semiconductor layers, transistors of higher mobility than that of amorphous silicon transistors can be manufactured. Therefore, charge into a capacitance can be quickly performed in each pixel formation portion. Accordingly, reduction of a display quality attributable to a shortage of a charge capacity of a transistor can be suppressed. Because of high mobility, a transistor size can be made small, and a liquid crystal display device can be made further small.
- the gate insulation layer 33 and the interlayer insulation layer 35 may be formed by a silicon oxide (SiOx) film, a silicon nitride oxide (SiNxOy) film, or a laminated film of a silicon oxide film and a silicon nitride film.
- FIG. 10 is a plan view of an active matrix substrate 1 in a second embodiment of the present invention.
- a first sub-pixel portion and a second sub-pixel portion are laid out to sandwich a first scanning signal line and a second scanning signal line.
- Other configurations are similar to those of the first embodiment.
- points different from those of the first embodiment will be mainly described, and descriptions of points similar to those of the first embodiment will be omitted.
- FIG. 11 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed.
- a first scanning signal line GLi and a second scanning signal line G 2 Li are arranged to pass between two pixel electrodes 29 a , 29 b included in the pixel formation portion PIX 1 and between two pixel electrodes 69 a , 69 b included in the pixel formation portion PIX 3
- a first scanning signal line GLi+1 and a second scanning signal line G 2 Li+1 are arranged to pass between two pixel electrodes 49 a , 49 b included in the pixel formation portion PIX 2 and between two pixel electrodes 89 a , 89 b included in the pixel formation portion PIX 4 .
- FIG. 12 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- the first scanning signal line GLi and the second scanning signal line G 2 Li are formed at relatively close places.
- a drain electrode 25 c of a third transistor TFT 1 c is connected to a drain lead line 26 c , and the drain lead line 26 c is connected to a capacitance electrode 31 via a connection electrode 36 and a contact 30 .
- the capacitance electrode 31 and the electrode 27 b are laid out to be superimposed in a vertical direction on the active matrix substrate 1 . Accordingly, a potential varying capacitance Cl is formed.
- FIG. 13A is a cross-sectional view along line A-A in FIG. 12 .
- FIG. 13B is a cross-sectional view along line B-B in FIG. 12 .
- FIG. 13C is a cross-sectional view along line C-C in FIG. 12 .
- FIG. 13D is a cross-sectional view along line D-D in FIG. 12 .
- the first scanning signal line GLi the second scanning signal line G 2 Li
- gate electrodes 32 , 32 c gate electrodes 32 , 32 c , and the capacitance electrode 31
- a glass substrate 10 there is formed a gate insulation layer 33 to cover them.
- the contact 30 is formed by hollowing out a first silicon nitride film (at a portion of the contact 30 ) in a process of forming the gate insulation layer 33 from the first silicon nitride film (refer to the first embodiment).
- FIG. 14 is an equivalent circuit diagram of pixel formation portions in the present embodiment.
- the first embodiment and the second embodiment are different in only a arrangement position of a second scanning signal line, and an electrical circuit configuration itself is the same as that of the first embodiment.
- the present embodiment and the first embodiment are the same in the electrical circuit configuration itself. Therefore, a driving method in the present embodiment is the same as the driving method in the first embodiment.
- FIG. 15 is a plan view of an active matrix substrate 1 in a third embodiment of the present invention.
- a holding-capacitance line trunk 18 is arranged to extend to a region between a display region 8 and a gate driver unit 21 in a peripheral region 9 , and holding capacitance lines CSL are formed to extend from the holding-capacitance line trunk 18 into the display region 8 in parallel with a first scanning signal line and a second scanning signal line.
- the holding capacitance lines CSL are arranged to extend in parallel with the first scanning signal line and the second scanning signal line.
- FIG. 16 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed.
- the holding capacitance lines CSL are arranged to pass on first sub-pixel portions PIX 1 A, PIX 3 A, on second sub-pixel portions PIX 1 B, PIX 3 B, on first sub-pixel portions PIX 2 A, PIX 4 A, and on second sub-pixel portions PIX 2 B, PIX 4 B, respectively.
- FIG. 17 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- the capacitance electrode 31 is also formed to extend in parallel with the data signal line. This is because when the capacitance electrode 31 is formed to extend in parallel with the first scanning signal line and the second scanning signal line, for example, there is a possibility that there occurs a portion where the holding capacitance line CSL and the capacitance electrode 31 are superimposed in a vertical direction on the active matrix substrate 1 .
- the holding capacitance line CSL is arranged to extend in parallel with the first scanning signal line and the second scanning signal line.
- the capacitance electrode 31 is formed to extend in parallel with the first scanning signal line and the second scanning signal line.
- formation of the capacitance electrode 31 is not particularly limited.
- a cross-sectional view along line A-A in FIG. 17 is similar to the cross-sectional view shown in FIG. 6A .
- a cross-sectional view along line B-B in FIG. 17 is similar to the cross-sectional view shown in FIG. 6B .
- a cross-sectional view along line C-C in FIG. 17 is similar to the cross-sectional view shown in FIG. 6C .
- a cross-sectional view along line D-D in FIG. 17 is similar to the cross-sectional view shown in FIG. 6D . Therefore, a description of a cross-sectional structure will be omitted.
- FIG. 18 is an equivalent circuit diagram of pixel formation portions in the present embodiment.
- the present embodiment and the first embodiment are different in a sub-pixel portion connected to each holding capacitance line CSL.
- the sub-pixel portions PIX 1 A, PIX 1 B, PIX 2 A, and PIX 2 B in FIG. 3 , for example
- the sub-pixel portions PIX 1 A and PIX 3 A in FIG. 15 , for example
- PIX 1 A and PIX 3 A in FIG. 15 for example
- the present embodiment and the first embodiment are different in only a connection relationship between the holding capacitance line CSL and the sub-pixel portion, concerning an electrical circuit configuration.
- all the holding capacitance lines CSL arranged in the display region 8 are driven in a similar manner. Therefore, a driving method in the present embodiment is the same as the driving method in the first embodiment.
- three lines are present per one pixel as lines that cross the first scanning signal line and the second scanning signal line.
- two lines are present per one pixel as lines that cross the first scanning signal line and the second scanning signal line. In this way, according to the present embodiment, the number of intersections between the first scanning signal line, the second scanning signal line and other lines becomes small.
- FIG. 19 is a plan view of an active matrix substrate 1 in a fourth embodiment of the present invention.
- a first capacitance line trunk 19 and a second capacitance line trunk 20 are arranged to extend to a region between a display region 8 and a gate driver unit 21 in a peripheral region 9 .
- a first capacitance line SEL 1 is formed to extend from the first capacitance line trunk 19 into the display region 8 in parallel with a first scanning signal line and a second scanning signal line
- a second capacitance line SEL 2 is formed to extend from the second capacitance line trunk 20 into the display region 8 in parallel with the first scanning signal line and the second scanning signal line.
- the first capacitance line SEL 1 and the second capacitance line SEL 2 are arranged to extend in parallel with the first scanning signal line and the second scanning signal line.
- the first capacitance line SEL 1 and the second capacitance line SEL 2 are provided to alternately correspond to a pixel matrix, for each one row.
- FIG. 20 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed.
- a second scanning signal line G 2 Li is arranged along one side (a lower side in FIG. 20 ) of the pixel formation portions PIX 1 , PIX 3 , and the first capacitance line SEL 1 is arranged along the second scanning signal line G 2 Li.
- a second scanning signal line G 2 Li+1 is arranged along one side of the pixel formation portions PIX 2 , PIX 4 , and the second capacitance line SEL 2 is arranged along the second scanning signal line G 2 Li+1.
- FIG. 21 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- a source electrode 24 c of a third transistor TFT 1 c is connected to a source lead line 37 .
- the source lead line 37 is connected to the first capacitance line SEL 1 via a connection electrode 36 and a contact 30 .
- FIG. 22A is a cross-sectional view along line A-A in FIG. 21 .
- FIG. 22B is a cross-sectional view along line B-B in FIG. 21 .
- FIG. 22C is a cross-sectional view along line C-C in FIG. 21 .
- FIG. 22D is a cross-sectional view along line D-D in FIG. 21 .
- a semiconductor layer 34 c On the gate insulation layer 33 in the third transistor TFT 1 c , there are formed a semiconductor layer 34 c , and a source electrode 24 c and a drain electrode 25 c in contact with the semiconductor layer 34 c , and there are formed a source lead line 37 , a drain lead line 26 c , and a capacitance electrode 31 , near them.
- an interlayer insulation layer 35 is formed on a further upper layer.
- a connection electrode 36 is formed on the interlayer insulation layer 35 .
- the interlayer insulation layer 35 and the gate insulation layer 33 are hollowed out such that the first capacitance line SEL 1 and the source lead line 37 are electrically connected via the connection electrode 36 .
- holding capacitance lines CSL are also formed on the gate insulation layer 33 .
- FIG. 23 is an equivalent circuit diagram of pixel formation portions in the present embodiment.
- the present embodiment and the first embodiment are different in a pixel formation portion connected to each first capacitance line SEL 1 .
- the pixel formation portions PIX 1 and PIX 2 in FIG. 7 , for example
- pixel formation portions PIX 1 and PIX 3 in FIG. 23 , for example
- PIX 1 and PIX 3 in FIG. 23 for example
- the first capacitance line SEL 1 and the second capacitance line SEL 2 are formed to extend in parallel with the data signal lines.
- the first capacitance line SEL 1 and the second capacitance line SEL 2 are formed to extend in parallel with the first scanning signal line and the second scanning signal line.
- a potential Vcsh of a relatively high level and a potential Vcsl of a relatively low level are provided to the first capacitance line SEL 1 and the second capacitance line SEL 2 alternately every one frame period.
- changes of potentials of pixel electrodes 49 a , 49 b , and a capacitance electrode 51 that are included in the pixel formation portion PIX 2 in the present embodiment become the same as changes of the potentials of pixel electrodes 69 a , 69 b , and the capacitance electrode 71 that are included in the pixel formation portion PIX 3 in the first embodiment.
- changes of potentials of the pixel electrodes 69 a , 69 b and a capacitance electrode 71 that are included in the pixel formation portion PIX 3 in the present embodiment become the same as the changes of the potentials of the pixel electrodes 49 a , 49 b and the capacitance electrode 51 that are included in the pixel formation portion PIX 2 in the first embodiment.
- changes of potentials of the capacitance electrode 31 , the pixel electrodes 29 a , 29 b , the capacitance electrode 51 , the pixel electrodes 49 a , 49 b , the capacitance electrode 71 , the pixel electrodes 69 a , 69 b , a capacitance electrode 91 , and pixel electrodes 89 a , 89 b become as shown in FIG. 24 .
- three lines are present per one pixel as lines that cross the first scanning signal line and the second scanning signal line.
- two lines are present per one pixel as lines that cross the first scanning signal line and the second scanning signal line. In this way, according to the present embodiment, the number of intersections between the first scanning signal line, the second scanning signal line and other lines becomes small.
- FIG. 25 is a plan view of an active matrix substrate 1 in a fifth embodiment of the present invention.
- a first capacitance line trunk 19 a second capacitance line trunk 20 , a first capacitance line SEL 1 , and a second capacitance line SEL 2 are formed in a similar manner to that in the fourth embodiment (see FIG. 19 ).
- two data signal lines are provided for each column of a pixel matrix. Specifically, there are provided first data signal lines SL 1 to SLn arranged at a left side of a pixel formation portion in FIG. 25 , and second data signal lines S 2 L 1 to S 2 Ln arranged at a right side of the pixel formation portion in FIG. 25 .
- FIG. 26 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed.
- a first data signal line SLj is arranged along one side (a left side in FIG. 26 ) of pixel formation portions PIX 1 , PIX 2
- a second data signal line S 2 Lj is arranged along the other side (a right side in FIG. 26 ) of the pixel formation portions PIX 1 , PIX 2 .
- a first data signal line SLj+1 is arranged along one side of pixel formation portions PIX 3 , PIX 4
- a second data signal line S 2 Lj+1 is arranged along the other side of the pixel formation portions PIX 3 , PIX 4 .
- a first transistor TFT 1 a and a second transistor TFT 1 b are provided to be connected to the first data signal line SLj, in the pixel formation portion PIX 1 .
- a first transistor TFT 2 a and a second transistor TFT 2 b are provided to be connected to the second data signal line S 2 Lj, in the pixel formation portion PIX 2 .
- a first transistor TFT 3 a and a second transistor TFT 3 b are provided to be connected to the first data signal line SLj+1, in the pixel formation portion PIX 3 .
- a first transistor TFT 4 a and a second transistor TFT 4 b are provided to be connected to the second data signal line S 2 Lj+1, in the pixel formation portion PIX 4 . In this way, when attention is focused on each column of a pixel matrix, pixel formation portions are alternately connected for each one row to a first data signal line and a second data signal line.
- a second scanning signal line G 2 Li is arranged along one side (a lower side in FIG. 26 ) of the pixel formation portions PIX 1 , PIX 3 , and a first capacitance line SEL 1 is arranged along the second scanning signal line G 2 Li. Further, a second scanning signal line G 2 Li+1 is arranged along one side of the pixel formation portions PIX 2 , PIX 4 , and the second capacitance line SEL 2 is arranged along the second scanning signal line G 2 Li+1.
- a capacitance is formed by an electrode electrically connected to a capacitance electrode in a second sub-pixel portion included in each row of the pixel matrix, and a pixel electrode in a first sub-pixel portion included in the next row.
- a capacitance Cc 11 is formed by an electrode 39 connected to a capacitance electrode 31 in a second sub-pixel portion of the pixel formation portion PIX 1 (the capacitance electrode 31 and the electrode 39 are integrally formed), and a pixel electrode 49 a in a first sub-pixel portion of the pixel formation portion PIX 2 .
- FIG. 27 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- a source electrode 24 c of a third transistor TFT 1 c is connected to a source lead line 37 , and the source lead line 37 is connected to the first capacitance line SEL 1 via a connection electrode 36 and a contact 30 .
- a capacitance electrode 100 is formed in a region between a holding capacitance line CSL and the second data signal line S 2 Lj.
- the capacitance electrode 100 and a pixel electrode 29 a are laid out to be superimposed in a vertical direction on the active matrix substrate 1 . Accordingly, a capacitance Cc 01 is formed.
- FIG. 28A is a cross-sectional view along line A-A in FIG. 27 .
- FIG. 28B is a cross-sectional view along line B-B in FIG. 27 .
- FIG. 28C is a cross-sectional view along line C-C in FIG. 27 .
- FIG. 28D is a cross-sectional view along line D-D in FIG. 27 .
- a cross-sectional structure near the first transistor TFT 1 a , the second transistor TFT 1 b , and the third transistor TFT 1 c is similar to that in the fourth embodiment.
- holding capacitance lines CSL, the capacitance electrode 100 , and the second data signal line S 2 Lj are also formed on a gate insulation layer 33 .
- FIG. 29 is an equivalent circuit diagram of pixel formation portions in the present embodiment.
- a first data signal line and a second data signal line are connected to transistors in the pixel formation portions PIX 1 to PIX 4 such that data signals are supplied from the first data signal lines SLj, SLj+1 in the pixel formation portions PIX 1 , PIX 3 , respectively, and that data signals are supplied from the second data signal lines S 2 Lj, S 2 Lj+1 in the pixel formation portions PIX 2 , PIX 4 , respectively.
- the pixel formation portion PIX 1 includes as constituent elements of the first sub-pixel portion PIX 1 A, the first transistor TFT 1 a having a gate electrode connected to the first scanning signal line GLi and having a source electrode connected to the first data signal line SLj, the pixel electrode 29 a connected to a drain electrode of the first transistor TFT 1 a , a liquid crystal capacitance Clc 1 a formed by the common electrode 41 to which a constant potential COM is provided and the pixel electrode 29 a , a holding capacitance Ccs 1 a formed by the pixel electrode 29 a and the holding capacitance line CSL, and the capacitance Cc 01 formed by the capacitance electrode 100 and the pixel electrode 29 a .
- the pixel formation portion PIX 1 includes as constituent elements of a second sub-pixel portion PIX 1 B, the second transistor TFT 1 b having a gate electrode connected to the first scanning signal line GLi and having a source electrode connected to the first data signal line SLj, the pixel electrode 29 b connected to a drain electrode of the second transistor TFT 1 b , a liquid crystal capacitance Clc 1 b formed by the common electrode 41 and the pixel electrode 29 b , a holding capacitance Ccs 1 b formed by the pixel electrode 29 b and the holding capacitance line CSL, the third transistor TFT 1 c having a gate electrode connected to the second scanning signal line G 2 Li and having a source electrode connected to the first capacitance line SEL 1 , the capacitance electrode 31 connected to a drain electrode of the third transistor TFT 1 c , and the potential varying capacitance C 1 formed by the pixel electrode 29 b and the capacitance electrode 31 .
- the pixel formation portion PIX 2 has a configuration similar to that of the pixel formation portion PIX 1 , except that a connection destination of source electrodes of the first transistor TFT 2 a and the second transistor TFT 2 b is the second data signal line S 2 Lj.
- FIG. 30 shows waveforms of potentials of first scanning signal lines.
- gate-on potentials Vgh are sequentially provided for each two rows to the first scanning signal lines.
- a timing at which the gate-on potential Vgh is provided to certain two first scanning signal lines and a timing at which the gate-on potential Vgh is provided to the next two first scanning signal lines are shifted by one horizontal scanning period.
- the gate-on potential Vgh is provided to the first scanning signal lines GLi, GLi+1 during one horizontal scanning period, and thereafter, the gate-on potential Vgh is provided to the second scanning signal lines G 2 Li, G 2 Li+1 during one horizontal scanning period.
- a timing at which the gate-on potential Vgh is provided to the first scanning signal lines GLi, GLi+1 and a timing at which the gate-on potential Vgh is provided to the second scanning signal lines G 2 Li, G 2 Li+1 are shifted by two horizontal scanning periods. In this way, concerning each row, a timing at which the gate-on potential Vgh is provided to the second scanning signal line is delayed by two horizontal scanning periods from a timing at which the gate-on potential Vgh is provided to the first scanning signal line.
- a potential Vsh that is higher than the potential COM of a common electrode 41 is provided in odd frames, and a potential Vsl that is lower than the potential COM is provided in even frames.
- a potential Vsl is provided in odd frames, and the potential Vsh is provided in even frames.
- potentials of adjacent two first data signal lines have mutually opposite polarities.
- potentials of adjacent two second data signal lines have also mutually opposite polarities. Concerning each column, a potential of the first data signal line and a potential of the second data signal line have mutually opposite polarities.
- potentials of the pixel electrodes 29 a , 29 b in the pixel formation portion PIX 1 and potentials of the pixel electrodes 89 a , 89 b in the pixel formation portion PIX 4 increase to Vsh
- potentials of the pixel electrodes 49 a , 49 b in the pixel formation portion PIX 2 and potentials of the pixel electrodes 69 a , 69 b in the pixel formation portion PIX 3 decrease to Vsl.
- a potential of the second scanning signal line becomes the gate-on potential Vgh.
- the second capacitance line SEL 2 is at the potential Vcsl of a relatively low level.
- Equation (1) A magnitude ⁇ V of a potential change of the pixel electrodes 29 a , 69 a is as shown in the above Equation (1).
- K in the Equation (1) as the equation for obtaining the magnitude of ⁇ V is obtained by the following Equation (3).
- K Cc 01/( Clc 1 a+Ccs 1 a+Cc 01 (3)
- the potential of the pixel electrode 29 b increases from Vsh to Vsh+ ⁇ V
- the potential of the pixel electrode 69 b increases from Vsl to Vsl+ ⁇ V
- the potential of the pixel electrode 49 b decreases from Vsl to Vsl ⁇ V
- the potential of the pixel electrode 89 b decreases from Vsh to Vsh ⁇ V.
- the capacitance electrode 31 in the pixel formation portion PIX 1 is connected to the capacitance electrode 39 in the pixel formation portion PIX 2
- the capacitance electrode 71 in the pixel formation portion PIX 3 is connected to the capacitance electrode 79 in the pixel formation portion PIX 4
- a capacitance Cc 11 is formed by the capacitance electrode 39 and the pixel electrode 49 a
- a capacitance Cc 13 is formed by the capacitance electrode 79 and the pixel electrode 89 a .
- the potentials of the pixel electrodes 29 a , 29 b , 49 a , 49 b , 69 a , 69 b , 89 a , and 89 b in the pixel formation portions PIX 1 to PIX 4 are maintained during a period (a period up to a time point t 20 ) until when the potentials of the first scanning signal lines GLi, GLi+1 become the gate-on potential Vgh in even frames.
- the timing at which a potential of the second scanning signal line becomes the gate-on potential Vgh in a row before a row including the pixel formation portion PIX 1 becomes the same as the timing at which a potential of the first scanning signal line GLi provided to the pixel formation portion PIX 1 becomes the gate-on potential Vgh, for example.
- a potential of the capacitance electrode 100 varies during a period when a potential of the pixel electrode 29 a should be set to the potential Vsh of the data signal SLj. Because the capacitance electrode 100 and the pixel electrode 29 a are capacitance-coupled, the potential of the pixel electrode 29 a becomes unstable. Further, after the pixel electrode 29 a is charged based on the data signal SLj, the potential of the pixel electrode 29 a does not vary unlike the variation at the time point t 11 in FIG. 32 .
- first scanning signal lines and second scanning signal lines are driven as shown in FIG. 33 . That is, two first scanning signal lines as one set are sequentially selected. Further, two second scanning signal lines of each set are selected after one horizontal scanning period since two first scanning signal lines of a set next to the each set are selected. Note that, this interval is not necessarily required to be one horizontal scanning period, and a timing at which the second scanning signal lines of each set are selected may be a suitable timing after a pixel electrode is sufficiently charged by selection of first scanning signal lines of a set next to the each set.
- each pixel formation portion after the same potential is provided to both pixel electrodes of the first sub-pixel portion and pixel electrodes of the second sub-pixel portion, the potential of one sub-pixel portion slightly increases and the potential of the other sub-pixel portion slightly decreases. Therefore, a large effect of viewing angle characteristic improvement can be obtained, as compared with the first to fourth embodiments in which a potential of only one sub-pixel portion is varied. Further, in the present embodiment, focusing attention on each column of the pixel matrix, pixel formation portions are alternately connected for each one row to a first data signal line and a second data signal line. That is, as compared with the first embodiment, the number of pixel formation portions to which one data signal line should supply a data signal becomes a half.
- a display device can be operated at a high speed without reducing a display quality.
- a configuration according to the present embodiment can be applied to a display device that has a drive frequency of 240 Hz.
- a narrow picture-frame by reduction of a wiring region can be realized without reducing a display quality, in a similar manner to that in the first embodiment.
- a plan view of an active matrix substrate 1 according to the present embodiment is similar to that in the fourth embodiment as shown in FIG. 19 .
- pixel formation portions are alternately connected for each row to data signal lines arranged along one side (a left side in FIG. 19 ) of the each column and data signal lines arranged along the other side (a right side in FIG. 19 ) of the each column.
- FIG. 34 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed.
- a positional relationship between the pixel formation portions PIX 1 to PIX 4 and first scanning signal lines GLi, GLi+1, second scanning signal lines G 2 Li, G 2 Li+1, holding capacitance lines CSL, a first capacitance line SEL 1 , and a second capacitance line SEL 2 is similar to that in the fourth embodiment (see FIG. 20 ).
- a connection relationship between the pixel formation portions PIX 1 to PIX 4 and data signal lines is different from that in the fourth embodiment. For example, attention is focused on a connection relationship between the pixel formation portions PIX 1 to PIX 4 and a data signal line SLj+1.
- the data signal line SLj+1 is connected to transistors TFT 3 a , TFT 3 b in the pixel formation portion PIX 3 and transistors TFT 4 a , TFT 4 b in the pixel formation portion PIX 4 .
- the data signal line SLj+1 is connected to transistors TFT 3 a , TFT 3 b in the pixel formation portion PIX 3 and transistors TFT 2 a , TFT 2 b in the pixel formation portion PIX 2 .
- pixel formation portions connected to each data signal line are laid out in a zigzag manner.
- FIG. 35 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- a source electrode 24 c of a third transistor TFT 1 c is connected to a source lead line 37 , and the source lead line 37 is connected to a first capacitance line SEL 1 via a connection electrode 36 and a contact 30 .
- a capacitance electrode 100 is formed in a region between the capacitance line CSL and the data signal line SLj+1.
- the capacitance electrode 100 and a pixel electrode 29 a are laid out to be superimposed in a vertical direction on an active matrix substrate 1 . Accordingly, a capacitance Cc 01 is formed.
- FIG. 36A is a cross-sectional view along line A-A in FIG. 35 .
- FIG. 36B is a cross-sectional view along line B-B in FIG. 35 .
- FIG. 36C is a cross-sectional view along line C-C in FIG. 35 .
- FIG. 36D is a cross-sectional view along line D-D in FIG. 35 .
- the holding capacitance line CSL and the capacitance electrode 100 are also formed on a gate insulation layer 33 .
- FIG. 37 is an equivalent circuit diagram of pixel formation portions in the present embodiment.
- a first transistor TFT 1 a and a second transistor TFT 1 b in the pixel formation portion PIX 1 are connected to the data signal line SLj
- a first transistor TFT 2 a and a second transistor TFT 2 b in the pixel formation portion PIX 2 are connected to the data signal line SLj+1
- a first transistor TFT 3 a and a second transistor TFT 3 b in the pixel formation portion PIX 3 are connected to the data signal line SLj+1
- a first transistor TFT 4 a and a second transistor TFT 4 b in the pixel formation portion PIX 4 are connected to the data signal line SLj+2.
- Configurations of the first sub-pixel portion and the second sub-pixel portion in each pixel formation portion are similar to those in the fifth embodiment (see FIG. 29 ), except a connection relationship between transistors and data signal lines (see FIG. 29 ).
- the first scanning signal lines GLi, GLi+1, the data signal lines SLj, SLj+1, the holding capacitance lines CSL, the first capacitance line SEL 1 , and the second capacitance line SEL 2 are driven in a similar manner to that in the first embodiment.
- a gate-on potential Vgh is sequentially provided for each one row to second scanning signal lines GL 1 to GLm, in a similar manner to that in the first embodiment.
- a timing at which the gate-on electrode Vgh is provided to the second scanning signal line is delayed by two horizontal scanning periods from a timing at which the gate-on potential Vgh is provided to the first scanning signal line. Note that, a reason why the timing at which the gate-on potential Vgh is provided to the second scanning signal line is delayed by two horizontal scanning periods from the timing at which the gate-on potential Vgh is provided to the first scanning signal line is the same as that in the fifth embodiment.
- a potential of the first scanning signal line GLi becomes the gate-on potential Vgh. Accordingly, the first transistors TFT 1 a , TFT 3 a and the second transistors TFT 1 b , TFT 3 b become in an on state.
- a potential of the data signal line SLj is a potential Vsh of a positive polarity
- a potential of the data signal line SLj+1 is a potential Vsl of a negative polarity.
- a potential of the first scanning signal line GLi+1 becomes the gate-on potential Vgh. Accordingly, the first transistors TFT 2 a , TFT 4 a and the second transistors TFT 2 b , TFT 4 b become in an on state. Because it is assumed that a stationary image of one color is displayed on an entire screen, the data signal line SLj+2 has the same potential as that of the data signal line SLj. That is, in odd frames, the potential of the data signal line SLj+2 is the potential Vsh of a positive polarity.
- a potential of the second scanning signal line becomes the gate-on potential Vgh.
- the second capacitance line SEL 2 is at the potential Vcsl of a relatively low level.
- potentials of capacitance electrodes 100 , 101 decrease.
- the capacitance electrode 100 and the pixel electrode 29 a are capacitance-coupled. Therefore, the potential of the pixel electrode 29 a decreases from Vsh to Vsh ⁇ V.
- the capacitance electrode 101 and the pixel electrode 69 a are capacitance-coupled. Therefore, the potential of the pixel electrode 69 a decreases from Vsl to Vsl ⁇ V.
- a potential of the second scanning signal line G 2 Li becomes the gate-on potential Vgh. Accordingly, the transistors TFT 1 c , TFT 3 c become in an on state. Further, in the odd frames, the first capacitance line SEL 1 is at the potential Vcsh of a relatively high level. Consequently, at the time point t 12 , the potential of a capacitance electrode 31 in the pixel formation portion PIX 1 and the potential of a capacitance electrode 71 in the pixel formation portion PIX 3 increase to Vcsh. Thus, at the time point t 12 , the potential of the pixel electrode 29 b increases from Vsh to Vsh+ ⁇ V, and the potential of the pixel electrode 69 b increases from Vsl to Vsl+ ⁇ V.
- the capacitance electrode 31 in the pixel formation portion PIX 1 is connected to a capacitance electrode 39 in the pixel formation portion PIX 2
- the capacitance electrode 71 in the pixel formation portion PIX 3 is connected to a capacitance electrode 79 in the pixel formation portion PIX 4
- a capacitance Cc 11 is formed by the capacitance electrode 39 and the pixel electrode 49 a in the pixel formation portion PIX 2
- a capacitance Cc 13 is formed by the capacitance electrode 79 and a pixel electrode 89 a in the pixel formation portion PIX 4 .
- a potential of the second scanning signal line G 2 Li+1 becomes the gate-on potential Vgh. Accordingly, third transistors TFT 2 c , TFT 4 c become in an on state. Further, in the odd frames, the second capacitance line SEL 2 is at the potential Vcsl of a relatively low level. Consequently, at the time point t 13 , the potential of a capacitance electrode 51 in the pixel formation portion PIX 2 and the potential of a capacitance electrode 91 in the pixel formation portion PIX 4 decrease to Vcsl. Thus, at the time point t 13 , the potential of the pixel electrode 49 b increases from Vsl to Vsl ⁇ V, and the potential of the pixel electrode 89 b decreases from Vsh to Vsh ⁇ V.
- the potentials of the pixel electrodes 29 a , 29 b , 69 a , and 69 b are maintained during a period until when the potential of the first scanning signal line GLi becomes the gate-on potential Vgh in the even frames (during a period up to a time point t 20 ).
- the potentials of the pixel electrodes 49 a , 49 b , 89 a , and 89 b are maintained during a period until when the potential of the first scanning signal line GLi+1 becomes the gate-on potential Vgh in the even frames (during a period up to a time point t 21 ).
- the present embodiment in a similar manner to that in the fifth embodiment, in each pixel formation portion, after the same potential is provided to both pixel electrodes of the first sub-pixel portion and pixel electrodes of the second sub-pixel portion, the potential of one sub-pixel portion slightly increases and the potential of the other sub-pixel portion slightly decreases. Therefore, a large effect of viewing angle characteristic improvement can be obtained. Further, a narrow picture-frame by reduction of a wiring region can be realized without reducing a display quality, in a similar manner to that in the first embodiment.
- FIG. 40 is a plan view of an active matrix substrate 1 in a seventh embodiment of the present invention.
- the configuration in the present embodiment is similar to that in the sixth embodiment, except that the holding capacitance lines CSL and the holding-capacitance line trunk 18 are not provided. Therefore, in the following, points different from those of the sixth embodiment will be mainly described, and descriptions of points similar to those of the sixth embodiment will be omitted.
- FIG. 41 is a plan view of a region in which pixel formation portions PIX 1 to PIX 4 are formed.
- FIG. 42 is an enlarged plan view of a part of a region in which the pixel formation portion PIX 1 is formed.
- the holding capacitance lines CSL are not provided in the present embodiment. Therefore, the holding capacitances Ccs 1 a , Ccs 1 b that are formed by the holding capacitance lines CSL and the pixel electrodes 29 a , 29 b are not included in the pixel formation portion PIX 1 , for example, unlike in the sixth embodiment (see FIG. 34 ).
- FIG. 43A is a cross-sectional view along line A-A in FIG. 42 .
- FIG. 43B is a cross-sectional view along line B-B in FIG. 42 .
- FIG. 43C is a cross-sectional view along line C-C in FIG. 42 .
- FIG. 43D is a cross-sectional view along line D-D in FIG. 42 .
- the holding capacitance lines CSL are not provided on the gate insulation layer 33 , as shown in FIG. 43D .
- FIG. 44 is an equivalent circuit diagram of pixel formation portions in the present embodiment. As described above, the holding capacitance lines CSL are not provided in the present embodiment. Therefore, each pixel formation portion does not include a capacitance formed by a pixel electrode in a first sub-pixel portion and the holding capacitance line CSL and a capacitance formed by a pixel electrode in a second sub-pixel portion and the holding capacitance line CSL.
- a driving method will be described with reference to FIG. 45 and FIG. 39 .
- a first scanning signal line GLi, a second scanning signal line G 2 Li, a first scanning signal line GLi+1, a second scanning signal line G 2 Li+1, data signal lines SLj, SLj+1, a first capacitance line SEL 1 , and a second capacitance line SEL 2 are driven in a similar manner to that in the sixth embodiment. Therefore, a potential of a pixel electrode and a potential of a capacitance electrode in each pixel formation portion change in a similar manner to that in the sixth embodiment (see FIG. 39 ).
- K in the Equation (1) as the equation for obtaining a magnitude of ⁇ V is obtained by the following equation (4).
- K C 1/( Clc 1 b+C 1) (4)
- a size of a capacitance value of the potential varying capacitance C 1 is set the same as that in the first to sixth embodiment, for example, a magnitude ⁇ V of a potential change of a pixel electrode becomes different from magnitudes in the first to sixth embodiments. Therefore, it is necessary to adjust the size of the capacitance value of the potential varying capacitance C 1 such that the potential change of the pixel electrode becomes a desired magnitude.
- the present embodiment in a similar manner to that in the sixth embodiment, in each pixel formation portion, after the same potential is provided to both pixel electrodes of the first sub-pixel portion and pixel electrodes of the second sub-pixel portion, the potential of one sub-pixel portion slightly increases and the potential of the other sub-pixel portion slightly decreases. Therefore, a large effect of viewing angle characteristic improvement can be obtained. Further, a narrow picture-frame by reduction of a wiring region can be realized without reducing a display quality, in a similar manner to that in the first embodiment. Also, because of the configuration that does not have the holding capacitance lines CSL, the wiring region can be effectively reduced, and further narrowing of the frame can be realized.
- FIG. 46 is a block diagram showing a configuration of a display device 800 for a television receiver.
- the display device 800 includes a Y/C dividing circuit 80 , a video chroma circuit 81 , an A/D converter 82 , a liquid crystal controller 83 , a liquid crystal display unit 84 , a backlight driving circuit 85 , a backlight 86 , a microcomputer 87 , and a gradation circuit 88 .
- the liquid crystal display unit 84 contains a liquid crystal panel, and a source driver and a gate driver for driving the liquid crystal panel.
- a composite color video signal Scv as a television signal is inputted from an outside to the Y/C dividing circuit 80 , and the composite color video signal Scv is divided into brightness signal and a color signal.
- the brightness signal and the color signal are converted into analog RGB signals corresponding to three primary colors of light by the video chroma circuit 81 .
- the analog RGB signals are converted into digital RGB signals by the A/D converter 82 .
- the digital RGB signals are inputted to the liquid crystal controller 83 .
- a horizontal synchronization signal and a vertical synchronization signal are also taken out from the composite color video signal Scv inputted from the outside. These synchronization signals are also inputted to the liquid crystal controller 83 via the microcomputer 87 .
- the liquid crystal controller 83 outputs a driver data signal based on the digital RGB signals provided from the A/D converter 82 .
- the liquid crystal controller 83 generates timing control signals for operating the source driver and the gate driver in the liquid crystal display unit 84 , based on the synchronization signals, and provides the timing control signals to the source driver and the gate driver.
- the gradation circuit 88 respective gradation voltages of three primary colors R, G, B for a color display are generated, and these gradation voltages are also supplied to the liquid crystal display unit 84 .
- drive signals (such as a data signal and a scanning signal) are generated by the source driver and the gate driver at an inside based on the driver data signal, the timing control signal, and the gradation voltage.
- a color image is displayed on the liquid crystal panel at the inside, based on the drive signals.
- the backlight driving circuit 85 drives the backlight 86 on the basis of a control of the microcomputer 87 to irradiate a back surface of the liquid crystal panel with light.
- control of the system as a whole is performed by the microcomputer 87 .
- a video signal (a composite color video signal) inputted from the outside
- a video signal picked up by a camera and a video signal supplied via the internet line can be also used, in addition to a video signal based on a television broadcasting. That is, the display device 800 can display an image based on various video signals.
- a tuner unit 90 is connected to the display device 800 , as shown in FIG. 47 .
- the tuner unit 90 takes out, from receiving waves (high-frequency wave signals) received by an antenna, a signal of a channel to be received, and converts the signal into an intermediate frequency signal. Further, the tuner unit 90 detects the intermediate frequency signal, and takes out the composite color video signal Scv as a television signal.
- the composite color video signal Scv is inputted to the display device 800 as described above, and the image based on the composite color video signal Scv is displayed by the display device 800 .
- FIG. 48 is an exploded perspective view showing an example of a mechanical configuration of the display device 800 having the above configuration that is used as a television receiver.
- the television receiver has a first casing 801 and a second casing 806 in addition to the display device 800 , as constituent elements thereof.
- the first casing 801 and the second casing 806 are configured to sandwich the display device 800 while surrounding the display device.
- an opening portion 801 a for transmitting the image to be displayed by the display device 800 is formed.
- the second casing 806 is for covering aback surface side of the display device 800 , and is configured such that an operation circuit 805 for operating the display device 800 is provided and a supporting member 808 is fitted to a lower side.
- a configuration in the display region 8 in the seventh embodiment is that the holding capacitance lines CSL are excluded from the configuration in the sixth embodiment.
- a configuration that the holding capacitance lines CSL are excluded from the configurations in the first to fifth embodiments can be also employed. Accordingly, also in the first to fifth embodiments, a wiring region can be effectively reduced, and further narrowing of the frame can be realized.
- PIX 1 A to PIX 4 A FIRST SUB-PIXEL PORTION
- PIX 1 B to PIX 4 B SECOND SUB-PIXEL PORTION
- G 2 L 1 to G 2 Lm SECOND SCANNING SIGNAL LINE
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- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
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- Liquid Crystal (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Liquid Crystal Display Device Control (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
- [Patent Document 1] Japanese Patent Application Laid-Open Publication No. 2008-33218
- [Patent Document 2] Japanese Patent Application Laid-Open Publication No. 2008-58941
- [Patent Document 3] Japanese Patent Application Laid-Open Publication No. 2008-65334
-
- a first switching element having a first electrode connected to the first scanning signal line and having a second electrode connected to the data signal line, and being in an on state when the first scanning signal line is selected, and
- a first pixel electrode connected to a third electrode of the first switching element and laid out such that a capacitance is formed between the first pixel electrode and the common electrode,
-
- a second switching element having a first electrode connected to the first scanning signal line and having a second electrode connected to the data signal line, and being in an on state when the first scanning signal line is selected,
- a second pixel electrode connected to a third electrode of the second switching element and laid out such that a capacitance is formed between the second pixel electrode and the common electrode,
- a third switching element having a first electrode connected to the second scanning signal line and having a second electrode connected to one of the potential varying capacitance lines, and being in an on state when the second scanning signal line is selected, and
- a potential varying capacitance electrode connected to a third electrode of the third switching element and laid out such that a capacitance is formed between the potential varying capacitance electrode and the second pixel electrode, and
-
- includes a first potential varying capacitance line and a second potential varying capacitance line, and
- is arranged to extend to a direction parallel with a direction to which the data signal line extends,
-
- includes a first potential varying capacitance line and a second potential varying capacitance line, and
- is arranged to extend to a direction parallel with a direction to which the data signal line extends,
-
- includes a first potential varying capacitance line and a second potential varying capacitance line, and
- is arranged to extend to a direction parallel with a direction to which the first scanning signal line extends,
-
- includes a first potential varying capacitance line and a second potential varying capacitance line, and
- is arranged to extend to a direction parallel with a direction to which the first scanning signal line extends,
-
- includes a first potential varying capacitance line and a second potential varying capacitance line, and
- is arranged to extend to a direction parallel with a direction to which the data signal line extends,
-
- includes a first potential varying capacitance line and a second potential varying capacitance line, and
- is arranged to extend to a direction parallel with a direction to which the first scanning signal line extends,
ΔV=(Vcsh−Vcsl)×K (1)
K=Cl/(Clc1b+Ccs1b+Cl) (2)
K=C3/(Clc3b+Ccs3b+C3) (2-1)
Here, for simplicity, concerning the equations that express a change of a potential, the same symbols (ΔV, K) are used for all pixel electrodes, and this is similarly applied hereinafter. Magnitudes of changes of potentials of the
K=C2/(Clc2b+Ccs2b+C2) (2-2)
K=C4/(Clc4b+Ccs4b+C4) (2-3)
Like in an example described later, for the case of a configuration that does not include the holding capacitance line CSL, ΔV can be similarly obtained, by setting values of Ccs1 b, Ccs2 b, Ccs3 b, Ccs4 b to 0.
K=Cc01/(Clc1a+Ccs1a+Cc01 (3)
K=C1/(Clc1b+C1) (4)
In the present embodiment, when a size of a capacitance value of the potential varying capacitance C1 is set the same as that in the first to sixth embodiment, for example, a magnitude ΔV of a potential change of a pixel electrode becomes different from magnitudes in the first to sixth embodiments. Therefore, it is necessary to adjust the size of the capacitance value of the potential varying capacitance C1 such that the potential change of the pixel electrode becomes a desired magnitude.
Claims (21)
Applications Claiming Priority (3)
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JP2010156373 | 2010-07-09 | ||
JP2010-156373 | 2010-07-09 | ||
PCT/JP2011/059100 WO2012005038A1 (en) | 2010-07-09 | 2011-04-12 | Liquid crystal display device |
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US20130069921A1 US20130069921A1 (en) | 2013-03-21 |
US8648975B2 true US8648975B2 (en) | 2014-02-11 |
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US13/699,369 Active US8648975B2 (en) | 2010-07-09 | 2011-04-12 | Liquid crystal display device with potential varying capacitance electrode |
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US (1) | US8648975B2 (en) |
EP (1) | EP2579094A4 (en) |
JP (1) | JP5116903B2 (en) |
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CN (1) | CN102906636B (en) |
WO (1) | WO2012005038A1 (en) |
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Also Published As
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JPWO2012005038A1 (en) | 2013-09-02 |
EP2579094A1 (en) | 2013-04-10 |
US20130069921A1 (en) | 2013-03-21 |
WO2012005038A1 (en) | 2012-01-12 |
CN102906636A (en) | 2013-01-30 |
JP5116903B2 (en) | 2013-01-09 |
CN102906636B (en) | 2013-11-13 |
KR101242219B1 (en) | 2013-03-11 |
KR20130003038A (en) | 2013-01-08 |
EP2579094A4 (en) | 2015-05-13 |
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