US8172149B2 - Wireless frequency tag and method for manufacturing wireless frequency tag - Google Patents

Wireless frequency tag and method for manufacturing wireless frequency tag Download PDF

Info

Publication number
US8172149B2
US8172149B2 US12/694,787 US69478710A US8172149B2 US 8172149 B2 US8172149 B2 US 8172149B2 US 69478710 A US69478710 A US 69478710A US 8172149 B2 US8172149 B2 US 8172149B2
Authority
US
United States
Prior art keywords
wireless frequency
frequency tag
antenna
antenna pattern
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US12/694,787
Other languages
English (en)
Other versions
US20100127085A1 (en
Inventor
Takashi Yamagajo
Toru Maniwa
Manabu Kai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MANIWA, TORU, KAI, MANABU, YAMAGAJO, TAKASHI
Publication of US20100127085A1 publication Critical patent/US20100127085A1/en
Application granted granted Critical
Publication of US8172149B2 publication Critical patent/US8172149B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Definitions

  • the embodiments discussed herein are related to a wireless frequency tag and a method for manufacturing a wireless frequency tag.
  • RFID radio frequency identification
  • RFID systems have been known as one type of wireless communication systems.
  • Such an RFID system generally includes a wireless frequency tag (also referred to as an “RFID tag”) and a reader-writer (RW) apparatus, wherein information is read from or written into the wireless frequency tag from the RW apparatus by means of wireless communication.
  • RFID tag wireless frequency tag
  • RW reader-writer
  • Known wireless frequency tags include one type of tags that can operate using a power source embedded in the wireless frequency tag (such a type is referred to as “active tags”) and another type of tags that operate using wireless waves received from an RW apparatus as driving power (such a type is referred to as “passive tags”).
  • the wireless frequency tag operates an embedded integrated circuit, such as an IC or an LSI, using wireless signals from an RW apparatus as driving power, and performs various processing in accordance with received wireless signals (control signals). Transmission from the wireless frequency tag to the RW apparatus is achieved using reflected waves of the received wireless signals. That is, various information, such as a tag ID or results of the processing, is carried on the reflected waves, which is sent to the RW apparatus.
  • an embedded integrated circuit such as an IC or an LSI
  • the UHF band (860 MHz to 960 MHz) is attracting attentions.
  • the UHF band can allow long distance communications more easily than the 13.56 MHz band or the 2.45 GHz band that have been conventionally used. Frequencies around 868 MHz, 915 MHz, and 953 MHz are used in Europe in the United States, and in Japan, respectively.
  • the communication ranges of wireless frequency tags (hereinafter, simply referred to as “tags”) in the UHF band are about between 3 meters and 5 meters, although the ranges depend on an integrated circuit, such as an IC chip or an LSI, used in the tags.
  • the outputs of RW apparatuses are about one watt (W).
  • Patent Reference 1 discloses an RFID tag that includes a dielectric member shaped in the rectangular parallelepiped shape and having a predetermined permittivity, an antenna pattern for sending and receiving which is formed in a loop shape by means of etching or the like on the front face of this dielectric member, and an IC chip that is electrically connected to this antenna pattern via a chip-mounted pad.
  • a miniature loop antenna is formed by the antenna pattern around the dielectric member, which results in formation of a current loop on the object to which the tag is to be adhered.
  • a current loop is formed, which can contribute to increase in the gain of loop antenna, thereby increasing the communication distance.
  • Patent Reference 2 The technique disclosed in Patent Reference 2 is directed to manufacturing an RFID tag that has a longer communication distance and that facilitates printing thereon.
  • the RFID tag of Patent Reference 2 is formed by bonding a first component and a second component.
  • the first component includes a plate-shaped first base made of a dielectric material, and a metal layer covering a first face of the front and back faces of the first base.
  • the second component includes a sheet-like second base, and metal pattern that is formed on the second base and is electrically connected to the metal layer of the first component, forming a communication antenna, and a circuit chip that is connected to the metal pattern and performs wireless communication by the communication antenna, and a bonding material layer for bonding the second base to the second face opposing to the first face of the front and back faces of the first base.
  • the metal layer of the first component and the metal pattern of the second component are electrically connected via a conducting component.
  • Patent Reference 3 is directed to providing an RFID tag that restrains a change in the resonant wavelength and the Q value, thereby assuring satisfactory communication status, even when the tag is disposed inside an apparatus including metal.
  • Patent Reference 3 teaches a tag that is formed from a substrate in a substantial circular shape which has a loop-shaped antenna pattern and an IC, and a disk-shaped magnetic sheet which has a diameter substantially equal to that of the substrate, wherein the inductance can be easily adjusted by providing a cut-out portion of a single like in a part of the circumference of the magnetic sheet.
  • the magnetic sheet can reduce the influence of any metallic member disposed inside an apparatus.
  • the width of the cut-out portion such that the reduction in the inductance of the antenna caused by the metal is offset by an increase in the inductance provided by the magnetic sheet, a change in the resonant wavelength and the Q value can be compensated, thereby assuring satisfactory communication status.
  • Patent Document 1 Japanese Patent Publication No. 2006-53833
  • Patent Document 2 Japanese Patent Publication No. 2006-301690
  • Patent Document 3 Japanese Patent Publication No. 2006-331101
  • the equivalent circuit of a chip mounted in a wireless frequency tag can be represented by the parallel capacitance component Ccp and the parallel resistance component Rcp, the susceptance component B varies dominantly dependent on the capacitance component Ccp. If the capacitance component Ccp becomes too high, design and adjustment of the antenna impedance to be matched with the capacitance component Ccp becomes difficult.
  • one technique to adjust the antenna impedance is increasing the corresponding capacitance component Ccp by modifying (reducing) the relative permittivity of a dielectric material (substrate) on which the antenna pattern is formed, as depicted in FIG. 13 (relative permittivity versus Ccp characteristics). Since reduction in the relative permittivity is limited to a certain level (the minimum value is one which is the relative permittivity of air), however, it is difficult to address to a chip requiring the corresponding capacitance component Ccp of smaller than this limit (ES 2 in FIG. 13 ).
  • matching adjustment may be achieved by modifying the total length of a loop of a loop-shaped antenna pattern, the gain is reduced when the total length of the loop is shortened.
  • a device includes a wireless frequency tag including a chip connecting section that is to be connected to a chip; a loop-shaped antenna pattern that is electrically connected to the chip connecting section; and a conducting member that electrically couples a part of the antenna pattern.
  • a method includes a method for manufacturing a wireless frequency tag including forming a loop-shaped antenna pattern that is electrically connected to a chip connecting section to which a chip is to be connected; and forming a conducting member that electrically couples a part of the antenna pattern.
  • FIG. 1 is a schematic perspective view illustrating a configuration of a wireless frequency tag according to a first embodiment
  • FIG. 2 is a cross-sectional view along Line A-A of the wireless frequency tag depicted in FIG. 1 ;
  • FIG. 3 is a schematic perspective view illustrating a simulation model of the wireless frequency tag depicted in FIG. 1 and FIG. 2 ;
  • FIG. 4 is a Smith chart illustrating an antenna impedance of the simulation model depicted in FIG. 3 ;
  • FIG. 5 is a Smith chart illustrating an antenna impedance of the simulation model depicted in FIG. 3 ;
  • FIG. 6 is a schematic perspective view illustrating a simulation model of wireless frequency tag having a shorter loop length of the loop antenna
  • FIG. 7 is a Smith chart illustrating an antenna impedance of the simulation model depicted in FIG. 6 ;
  • FIG. 8 is a schematic perspective view illustrating a simulation model of the wireless frequency tag depicted in FIG. 3 when a single via is used;
  • FIG. 9 is a Smith chart illustrating an antenna impedance of the simulation model depicted in FIG. 8 ;
  • FIG. 10 is a schematic perspective view illustrating a configuration of a wireless frequency tag according to a second embodiment
  • FIG. 11 is a graph indicating change in the corresponding capacitance component (Ccp) when the location of the side conductor of the wireless frequency tag depicted in FIG. 10 ;
  • FIG. 12 is a schematic perspective view illustrating a configuration of a wireless frequency tag according to a third embodiment.
  • FIG. 13 is a graph indicating change in the corresponding capacitance component (Ccp) when the relative permittivity of substrate (dielectric material) of the wireless is modified.
  • FIG. 1 is a schematic perspective view illustrating a configuration of a wireless frequency tag according to a first embodiment
  • FIG. 2 is a cross-sectional view along Line A-A of the wireless frequency tag depicted in FIG. 1 .
  • the wireless frequency tag of this embodiment includes: a substrate (dielectric member) 1 ; antenna patterns (hereinafter, referred to as “loop antennas”) 2 that have conductor patterns 2 formed continuously on each face other than the side of the long sides of the substrate 1 , that is, formed in a loop- (rectangular-) shape in the cross-sectional view in FIG.
  • chip connecting section (feeding point) 3 that is electrically connected to the loop antenna 2 in the vicinity of the center of the face of the substrate 1 defining the long side of the loop antenna 2 ; vias (also referred to as “through-holes”) 4 as conducting members that electrically couple the loop antenna 2 formed on the front and back faces of the substrate 1 at a plurality of locations (two locations in FIG. 1 and FIG. 2 ); an integrated circuit (chip package) 5 , such as an IC chip or an LSI, which is electrically connected to the chip connecting section 3 ; an exterior resin 6 covering the entire substrate 1 ; and an adhesion layer 7 formed on the attaching (adhering) face to metal or the like of the exterior resin 6 .
  • the chip package 5 is not illustrated in FIG. 1 , and illustration of the exterior resin 6 is partially omitted.
  • the substrate 1 is made of a dielectric material having a predetermined permittivity, and can be formed from any suitable resins, such as polytetrafluoroethylene (PTFE), polyphenylene ether (PPE), or the like, for example.
  • PTFE polytetrafluoroethylene
  • PPE polyphenylene ether
  • the antenna patterns 2 can be formed by processing (e.g., performing etching or resist processing on) a metal conductor, such as copper or silver.
  • the antenna patterns 2 may include a symmetric pattern in which the width thereof is increased from the feeding point 3 toward the ends in the longitudinal on the front face of the substrate 1 , as depicted in FIG. 1 , for example, so that a desired gain is achieved.
  • the vias 4 can be formed by providing an electrically conductive layer on the inner walls of holes extending through the substrate 1 by means of plating of the conductor, for example, and, in the example depicted in FIG. 1 and FIG. 2 , are provided at locations that are symmetric with respect to the feeding point 3 .
  • a part of the conductor patterns 2 i.e., the conductor patterns 2 formed on two opposing faces (front face and back face) of the substrate 1 are electrically connected (coupled) by the vias 4 .
  • a first loop pattern 2 a having the conductor pattern 2 formed on the faces (the front and back faces and the side faces) of the substrate 1 as the outer periphery (long sides and short sides)
  • a second loop pattern 2 b having the conductor pattern 2 formed on the faces (the front and back faces) of the substrate 1 and the vias 4 as the inner periphery
  • two current loops may be defined primarily by each of the loop patterns 2 a and 2 b.
  • the vias 4 may not necessarily be provided in symmetric locations, the required gain can be achieved more easily when they are provided in symmetric locations.
  • the number of vias provided may be one (i.e., may be provided at a single location). That is, the second loop pattern 2 b sharing a part of the loop pattern 2 ( 2 a ) may be suffice.
  • the second loop pattern 2 b is formed without changing the loop length of the first loop pattern 2 a , it is possible to rotate (change) the antenna impedance counterclockwise on the Smith chart while preventing a drop in the gain. In other words it is possible to increase the corresponding capacitance component Ccp of the antenna pattern 2 .
  • by changing (narrowing) the distance between the vias 4 it is possible to adjust (increase) the corresponding capacitance component Ccp.
  • an integrated circuit 5 hereinafter, also referred to as a “chip 5 ” or “tag LSI 5 ” having a greater susceptance component.
  • change in the antenna impedance is illustrated in the Smith chart in FIG. 4 when the antenna pattern 2 is modeled when it is assumed that a wireless frequency tag has an exterior dimension of a length of 69 mm, a width of 35 mm, and a thickness 5 mm, as depicted in FIG. 3 , the antenna pattern 2 has a thickness (conductor thickness) of 11 ⁇ and an electrical conductivity of 5 ⁇ 10 6 S/m, and the vias 4 are provided in the antenna pattern 2 .
  • the location indicated by 0 represents an antenna impedance at 950 MHz when the vias 4 are not provided
  • the location indicated by 1 represents a antenna impedance when the vias 4 are provided.
  • the corresponding capacitance component Ccp of the antenna pattern 2 can be increased when the antenna impedance is rotated (shifted) counterclockwise.
  • FIG. 5 it becomes possible to achieve matching with the chip 5 having a greater capacitance component that is in the complex conjugate relationship with the location indicated by 1 on the Smith chart.
  • the number of vias 4 may be one.
  • the model depicted in FIG. 8 is similar to the model illustrated in FIG. 3 , except for the number of vias. Even for the case where the number of vias is set to one as described above, the present inventor has confirmed through simulations that it is possible to rotate the antenna impedance counterclockwise on the Smith chart, as depicted in FIG. 9 , and that a gain comparable to the case where two vias 4 are provided.
  • FIG. 10 is a schematic perspective view illustrating the configuration of the configuration of a wireless frequency tag according to a second embodiment of the present invention.
  • the wireless frequency tag depicted in FIG. 10 includes a conductor pattern (side conductor) 8 that extends a part of the antenna pattern 2 on the face of the substrate 1 (front face) on which the feeding point 3 is located (two symmetric locations with respect to the feeding point 3 ) to the ends of the width direction of the substrate 1 , and communicates with the antenna pattern 2 on the face opposite to the front face (back face) through the side faces of the long sides of the substrate 1 .
  • a conductor pattern (side conductor) 8 that extends a part of the antenna pattern 2 on the face of the substrate 1 (front face) on which the feeding point 3 is located (two symmetric locations with respect to the feeding point 3 ) to the ends of the width direction of the substrate 1 , and communicates with the antenna pattern 2 on the face opposite to the front face (back face) through the side faces of the long sides of the substrate 1 .
  • the antenna patterns 2 that are provided through side face on the front and back faces of the substrate 1 are electrically coupled via the side conductor 8 , which means the side conductor 8 plays a role similar to the vias 4 as a conducting member.
  • the side conductor 8 plays a role similar to the vias 4 as a conducting member.
  • reference symbol S 2 indicates the gap of the side conductor 8 .
  • the side conductor 8 may not be necessarily located at locations symmetric with respect to the feeding point 3 in this example, and it may be provided at a single location on one side face of the substrate 1 .
  • a first loop pattern having the conductor pattern 2 formed on the front and back faces of the substrate 1 as the outer periphery (long sides and short sides), and a second loop pattern having a part of the conductor pattern 2 formed on the front and back faces of the substrate 1 and the side conductor 8 as the inner periphery are defined.
  • FIG. 11 change in the corresponding capacitance component Ccp when the spacing S 2 of the side conductor 8 is varied is illustrated in FIG. 11 when it is assumed that the substrate 1 has a dimension of a length of 70 mm, a width of 44 mm, and a thickness of 3.14 mm, the relative permittivity ⁇ r of the substrate 1 is 6.05, the current displacement angle tan ⁇ is 0.003, the width W of the antenna pattern 2 is 25 mm, the width of extending from the antenna pattern 2 to the side conductor 8 is 5 mm.
  • FIG. 12 is a schematic perspective view illustrating the configuration of a wireless frequency tag according to a third embodiment of the present invention.
  • the wireless frequency tag illustrated in FIG. 12 instead of the vias 4 described above, square pole shaped through-holes 9 having a cross-sectional area greater than that of the vias 4 are provided, and metal plating (conductor plating) 91 that electrically couple with the antenna patterns 2 formed on the front and back faces of the substrate 1 are provided at least one of the side walls (inner walls) of the through-holes 9 .
  • the antenna patterns 2 formed on the front and back faces of the substrate 1 are electrically coupled to each other by means of the metal plating 91 provided on the side walls of the through-hole 9 , and the metal plating 91 plays a role similar to the above-described vias 4 as a conducting member.
  • the through-holes 9 may not be necessarily provided at locations symmetric with respect to the feeding point 3 in this example, and they may be provided only at a single location.
  • the shape of the through-hole 9 is not limited to the square pole shape, and may take a triangle pole shape or a cylindrical shape.
  • the metal plating 91 is provided on the entire face of the side wall that is located at the furthest from the feeding point 3 among the four side walls of the through-hole 9 , it may be provided on other side wall(s). The metal plating 91 may also be applied only on a part of the side wall.
  • the metal plating 91 may be provided only a part of a side wall since disturbance to the current distribution at the antenna pattern 2 tends to be increased, causing a drop in the gain if the metal plating 91 is provided on the entire face of a side wall (inner wall) of a through-hole 9 having a larger cross-sectional area (radius) which has a larger cross-sectional area.
  • metal plating 91 in the form of a line may be provided on a surface of a side wall. That is, the greater the radius of the through-holes 9 is, the smaller the area of the conductor portion is preferred.
  • a first loop pattern having the conductor pattern 2 formed on the front face of the substrate 1 as the long sides (two sides that are opposing each other) and the short sides (the other two sides that are opposing each other), and a second loop pattern having a part of the conductor pattern 2 formed on the front face of the substrate 1 as the long sides and the metal plating 91 provided on the side walls of the through-holes 9 as the short sides are defined.
  • the wireless frequency tag of the this example it is possible to rotate (change) the antenna impedance in the counterclockwise on the Smith chart while preventing the gain from being dropped by configuring the second loop pattern without modifying the loop length of the first loop pattern. More specifically, it is possible to increase the corresponding capacitance component Ccp of the antenna pattern 2 .
  • the distance the metal plating 91 may also be changed by changing the location on which the metal plating 91 is provided without changing the location at which the through-hole 9 is provided.
  • antenna impedance (primarily, the corresponding capacitance component Ccp) are basically adjusted by varying the number of conducting members or the spacing therebetween of the vias 4 provided in the substrate 1 , the side conductor 8 , the through-hole 9 or the like which communicate with the antenna patterns 2 , other adjustment technique may be employed in combination with the above technique.
  • the width of the antenna patterns 2 may be modified, or their location on the chip 5 of the substrate 1 may be changed, or the permittivity of the substrate 1 may be varied.
  • a wireless frequency tag can be achieved which facilitates matching adjustment with a chip to be mounted while reducing a drop in the gain.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)
  • Support Of Aerials (AREA)
  • Burglar Alarm Systems (AREA)
US12/694,787 2007-08-13 2010-01-27 Wireless frequency tag and method for manufacturing wireless frequency tag Expired - Fee Related US8172149B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065804 WO2009022404A1 (ja) 2007-08-13 2007-08-13 無線タグ及び無線タグの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065804 Continuation WO2009022404A1 (ja) 2007-08-13 2007-08-13 無線タグ及び無線タグの製造方法

Publications (2)

Publication Number Publication Date
US20100127085A1 US20100127085A1 (en) 2010-05-27
US8172149B2 true US8172149B2 (en) 2012-05-08

Family

ID=40350468

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/694,787 Expired - Fee Related US8172149B2 (en) 2007-08-13 2010-01-27 Wireless frequency tag and method for manufacturing wireless frequency tag

Country Status (6)

Country Link
US (1) US8172149B2 (de)
EP (1) EP2180432B1 (de)
JP (1) JP5115558B2 (de)
KR (1) KR101102199B1 (de)
CN (1) CN101802845B (de)
WO (1) WO2009022404A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130200161A1 (en) * 2012-02-08 2013-08-08 Favite Inc. Electronic tag capable of coupling to metal
US10700433B2 (en) * 2016-12-13 2020-06-30 Murata Manufacturing Co., Ltd. Wireless communication device and article including the same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8141784B2 (en) 2009-09-25 2012-03-27 Hand Held Products, Inc. Encoded information reading terminal with user-configurable multi-protocol wireless communication interface
CN102598413A (zh) * 2009-10-27 2012-07-18 株式会社村田制作所 收发装置及无线标签读取装置
US20110116424A1 (en) * 2009-11-19 2011-05-19 Hand Held Products, Inc. Network-agnostic encoded information reading terminal
TW201134332A (en) * 2010-03-16 2011-10-01 Ind Tech Res Inst Printed circuit board with embedded antenna for RFID tag and method for manufacturing the same
TWI421775B (zh) * 2010-05-28 2014-01-01 China Steel Corp Wireless identification tag with capacitive load
JP5459126B2 (ja) * 2010-07-16 2014-04-02 富士通株式会社 アンテナシート、タグ及びタグ製造方法
US8779898B2 (en) 2011-08-17 2014-07-15 Hand Held Products, Inc. Encoded information reading terminal with micro-electromechanical radio frequency front end
US8596533B2 (en) 2011-08-17 2013-12-03 Hand Held Products, Inc. RFID devices using metamaterial antennas
US10013588B2 (en) 2011-08-17 2018-07-03 Hand Held Products, Inc. Encoded information reading terminal with multi-directional antenna
WO2013145311A1 (ja) * 2012-03-30 2013-10-03 富士通株式会社 Ｒｆｉｄタグ
JP6061035B2 (ja) * 2013-07-31 2017-01-18 富士通株式会社 Ｒｆｉｄタグ、及び、ｒｆｉｄシステム
JP2016201082A (ja) * 2015-04-10 2016-12-01 アイ・スマートソリューションズ株式会社 無線タグユニット

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08252995A (ja) * 1995-01-19 1996-10-01 Nippondenso Co Ltd Ｉｃカードの製造方法
JP2004048233A (ja) 2002-07-10 2004-02-12 Sanyo Electric Co Ltd アンテナ装置およびアンテナ素子の形成方法
US6879258B2 (en) * 1999-07-29 2005-04-12 Sony Chemicals Corp. IC card having a mica film for stable resonance frequency and enhanced antenna properties
US20050092845A1 (en) 2003-11-03 2005-05-05 Forster Ian J. Self-compensating antennas for substrates having differing dielectric constant values
EP1626364A2 (de) 2004-08-13 2006-02-15 Fujitsu Limited Rfid-etikett und verfahren zu dessen herstellung
WO2006064540A1 (ja) 2004-12-14 2006-06-22 Fujitsu Limited アンテナ及び非接触型タグ
US20060145872A1 (en) 2004-12-16 2006-07-06 Denso Corporation IC tag and IC tag attachment structure
WO2006072990A1 (ja) 2005-01-07 2006-07-13 Fujitsu Limited タグ装置、アンテナ及び携帯型カード
US20060208901A1 (en) * 2004-02-27 2006-09-21 Manabu Kai Radio tag
US20060232418A1 (en) 2005-04-15 2006-10-19 Fujitsu Limited RFID tag set, RFID tag and RFID tag component
JP2006331101A (ja) 2005-05-26 2006-12-07 Mitsubishi Materials Corp Ｒｆｉｄタグ
EP1742296A1 (de) 2005-07-08 2007-01-10 Fujitsu Ltd. Antenne und RFID Etikette für das Anbringen derselben
WO2007029296A1 (ja) 2005-09-02 2007-03-15 Fujitsu Limited Ｒｆタグ及びｒｆタグを製造する方法
JP2007124443A (ja) 2005-10-31 2007-05-17 Toppan Printing Co Ltd Ｒｆｉｄタグ用のインレット及びそのインピーダンス調整方法並びにｒｆｉｄタグ

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08252995A (ja) * 1995-01-19 1996-10-01 Nippondenso Co Ltd Ｉｃカードの製造方法
US6879258B2 (en) * 1999-07-29 2005-04-12 Sony Chemicals Corp. IC card having a mica film for stable resonance frequency and enhanced antenna properties
JP2004048233A (ja) 2002-07-10 2004-02-12 Sanyo Electric Co Ltd アンテナ装置およびアンテナ素子の形成方法
US20050092845A1 (en) 2003-11-03 2005-05-05 Forster Ian J. Self-compensating antennas for substrates having differing dielectric constant values
US20060208901A1 (en) * 2004-02-27 2006-09-21 Manabu Kai Radio tag
US20060032926A1 (en) 2004-08-13 2006-02-16 Fujitsu Limited Radio frequency identification (RFID) tag and manufacturing method thereof
JP2006053833A (ja) 2004-08-13 2006-02-23 Fujitsu Ltd Ｒｆｉｄタグおよびその製造方法
EP1626364A2 (de) 2004-08-13 2006-02-15 Fujitsu Limited Rfid-etikett und verfahren zu dessen herstellung
WO2006064540A1 (ja) 2004-12-14 2006-06-22 Fujitsu Limited アンテナ及び非接触型タグ
US20060145872A1 (en) 2004-12-16 2006-07-06 Denso Corporation IC tag and IC tag attachment structure
US7416135B2 (en) * 2004-12-16 2008-08-26 Denso Corporation IC tag and IC tag attachment structure
WO2006072990A1 (ja) 2005-01-07 2006-07-13 Fujitsu Limited タグ装置、アンテナ及び携帯型カード
JP2006301690A (ja) 2005-04-15 2006-11-02 Fujitsu Ltd Ｒｆｉｄタグセット、ｒｆｉｄタグ、およびｒｆｉｄタグ部品
US20060232418A1 (en) 2005-04-15 2006-10-19 Fujitsu Limited RFID tag set, RFID tag and RFID tag component
JP2006331101A (ja) 2005-05-26 2006-12-07 Mitsubishi Materials Corp Ｒｆｉｄタグ
EP1742296A1 (de) 2005-07-08 2007-01-10 Fujitsu Ltd. Antenne und RFID Etikette für das Anbringen derselben
US20070008134A1 (en) 2005-07-08 2007-01-11 Fujitsu Limited Antenna and RFID tag mounting the same
JP2007019905A (ja) 2005-07-08 2007-01-25 Fujitsu Ltd アンテナ及びこれを搭載するｒｆｉｄ用タグ
WO2007029296A1 (ja) 2005-09-02 2007-03-15 Fujitsu Limited Ｒｆタグ及びｒｆタグを製造する方法
JP2007124443A (ja) 2005-10-31 2007-05-17 Toppan Printing Co Ltd Ｒｆｉｄタグ用のインレット及びそのインピーダンス調整方法並びにｒｆｉｄタグ

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Dubost G: "A Tuneable Thick Folded-Dipole Operating in Two Octaves" IEEE Group on Antennas and Propagation International Symposium, IEEE, New York, NY, US, Jan. 1, 1975, pp. 248-251, XP002082335.
Extended European Search Report for application No. 07792447.0-1248 dated Oct. 6, 2010.
First Notification Office Action dated Sep. 23, 2011 issued in the corresponding Chinese Patent Application No. 200780100255.3.
International Search Report dated Nov. 13, 2007 received in corresponding PCT/JP2007/065804.
Korean Notice of Preliminary Rejection dated May 30, 2011 for application No. 10-2010-7003270.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130200161A1 (en) * 2012-02-08 2013-08-08 Favite Inc. Electronic tag capable of coupling to metal
US8960560B2 (en) * 2012-02-08 2015-02-24 Favite Inc. Electronic tag capable of coupling to metal
US10700433B2 (en) * 2016-12-13 2020-06-30 Murata Manufacturing Co., Ltd. Wireless communication device and article including the same

Also Published As

Publication number Publication date
JP5115558B2 (ja) 2013-01-09
CN101802845B (zh) 2013-09-04
CN101802845A (zh) 2010-08-11
US20100127085A1 (en) 2010-05-27
EP2180432A4 (de) 2010-11-03
KR101102199B1 (ko) 2012-01-02
KR20100035178A (ko) 2010-04-02
EP2180432B1 (de) 2016-09-14
WO2009022404A1 (ja) 2009-02-19
EP2180432A1 (de) 2010-04-28
JPWO2009022404A1 (ja) 2010-11-11

Similar Documents

Publication Publication Date Title
US8172149B2 (en) Wireless frequency tag and method for manufacturing wireless frequency tag
US8462052B2 (en) RFID tag and manufacturing method thereof
JP4518211B2 (ja) 複合アンテナ
US9905926B2 (en) Antenna device and wireless communication apparatus
EP2251934B1 (de) Drahtlose integrierte schaltung und drahtloses kommunikationssystem
US8531337B2 (en) Antenna diversity system and slot antenna component
KR100859714B1 (ko) 인공자기도체를 이용한 도체 부착형 무선 인식용 태그안테나 및 그 태그 안테나를 이용한 무선인식 시스템
JP5703977B2 (ja) 無線通信デバイス付き金属物品
KR20190128077A (ko) 주파수 선택 요소를 갖는 안테나
WO2008020249A1 (en) Electromagnetic band-gap structure
US9831556B2 (en) Planar antenna
EP2666207B1 (de) Kommunikations- und trackingvorrichtung mit geschlitzter antenne und zugehöriges verfahren
Lee et al. High-efficient compact folded-patch antenna fed by T-shaped L-probe for on-metal UHF RFID tag design
US20120086526A1 (en) Wireless ic device and coupling method for power feeding circuit and radiation plate
Mandal et al. On-chip antennas using standard CMOS technology: A brief overview
JP2007527174A (ja) Ｒｆｉｄタグ用のアンテナ構造体
EP2027627A1 (de) Patch-antenne
TWI360861B (en) Rfid tag and method of manufacturing the same tag
US7573425B2 (en) Antenna for radio frequency identification RFID tags
EP2089933A1 (de) Mehrfrequenzantennen
Erman et al. A Low-Profile Metal-backed Dipole Loaded with Closely Coupled Arc-shaped Open Stubs for On-metal Tag Design with Wide Frequency Tuning Capability

Legal Events

Date Code Title Description
AS Assignment

Owner name: FUJITSU LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YAMAGAJO, TAKASHI;MANIWA, TORU;KAI, MANABU;SIGNING DATES FROM 20091224 TO 20091228;REEL/FRAME:023858/0802

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20200508