US7504666B2 - Optical semiconductor package with compressible adjustment means - Google Patents

Optical semiconductor package with compressible adjustment means Download PDF

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Publication number
US7504666B2
US7504666B2 US11/108,624 US10862405A US7504666B2 US 7504666 B2 US7504666 B2 US 7504666B2 US 10862405 A US10862405 A US 10862405A US 7504666 B2 US7504666 B2 US 7504666B2
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United States
Prior art keywords
ring
cylindrical
elastically deformable
support
passage
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Expired - Fee Related, expires
Application number
US11/108,624
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English (en)
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US20050230772A1 (en
Inventor
Julien Vittu
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STMicroelectronics SA
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STMicroelectronics SA
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Assigned to STMICROELECTRONICS S.A. reassignment STMICROELECTRONICS S.A. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VITTU, JULIEN
Publication of US20050230772A1 publication Critical patent/US20050230772A1/en
Priority to US12/364,557 priority Critical patent/US7687819B2/en
Application granted granted Critical
Publication of US7504666B2 publication Critical patent/US7504666B2/en
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of optical semiconductor packages.
  • Optical semiconductor packages which include a plate, on the front of which are fixed an integrated circuit chip electrically linked to this plate and chip encapsulation means, supporting an objective lens situated facing the integrated optical sensor provided on the front of this chip.
  • these encapsulation means comprise a ring holding the lens and threaded externally, and a support with an internally threaded passage.
  • the ring is coupled to the support by threaded coupling and the lens is adjusted relative to the optical sensor of the chip by the number of screw turns.
  • the ring must then be fixed on the support. This is done routinely by an additional bonding operation.
  • An optical semiconductor package in accordance with an embodiment of the present invention comprises a support with a passage to receive a ring holding a lens situated facing an optical sensor.
  • the support has, in said passage, at least one local release recess and the ring is equipped peripherally with a locally projecting, elastically deformable means.
  • the local release recess and elastically deformable means are configured such that, when the ring occupies an angular mounting position, the locally projecting means is engaged in the local recess of the support and, when the ring is pivoted from the aforementioned angular mounting position, the locally projecting means is moved out of said recess of the support and is compressed against the wall of said passage in order to secure the ring relative to the support.
  • the ring has at least one peripheral groove and at least one stud projecting relative to the bottom of this groove, said elastically deformable means comprising an elastically deformable ring engaged in the peripheral groove and passing over said stud to be locally projecting.
  • said ring is in contact with the wall of said passage of said support.
  • the ring has at least one projecting land forming said elastically deformable means.
  • said local release recess is preferably formed by an axial groove opening out from at least one of its ends.
  • the wall of said passage preferably has at least one secondary local recess offset angularly relative to said local release recess, said locally projecting means being engaged in said secondary local recess when the ring is in a holding angular position.
  • said secondary local recess is preferably formed by an axial groove opening out from at least one of its ends.
  • the wall of said passage of the support has at least three peripherally spaced local release recesses and said elastically deformable means has three locally projecting corresponding parts.
  • an optical semiconductor package comprises a first support mounted to a semiconductor supporting base member, an inner surface of the first support having at least one axially extending first groove of a first depth and at least one axially extending second groove of a second depth wherein the first depth is greater than the second depth.
  • a second support is sized and shaped to be received within the first support.
  • At least one elastically deformable projection extends from an outer surface of the second support sized to freely fit within the first depth of the first groove and compressibly fit within the second depth of the second groove.
  • an optical semiconductor package comprises a first support mounted to a semiconductor supporting base member, an inner cylindrical surface of the first support having at least one axially extending first groove of a first depth and a second support sized and shaped to be received within the first support. At least one elastically deformable projection extends from an outer cylindrical surface of the second support sized to freely fit within the first depth of the first groove and compressibly fit against the inner surface of the first support when the second support is rotated within the first support.
  • an optical semiconductor package comprises a base member with an optical semiconductor chip mounted to the base member.
  • a first support is mounted to the base member surrounding the optical semiconductor chip, an inner surface of the first support having at least one axially extending first groove.
  • a second support is sized and shaped to be received within, and to be axially moved along, and to be rotatably moved with respect to, an interior of the first support.
  • At least one elastically deformable projection extends from an outer surface of the second support sized to freely fit within the first depth of the first groove and compressibly fit against the inner surface of the first support following rotation of the second support to fix an axial position of the second support within the interior of the first support.
  • a lens is fixedly mounted within an interior of the second support in axial alignment with the optical semiconductor chip, a distance between the lens and the optical semiconductor chip set by the axial position fixation of the second support within the interior of the first support.
  • FIG. 1 represents a longitudinal cross section of an optical semiconductor package according to the present invention
  • FIG. 2 represents a transverse cross section of the optical semiconductor package of FIG. 1 , in a release position;
  • FIG. 3 represents a transverse cross section of the optical semiconductor package of FIG. 1 , in an adjustment and holding position;
  • FIG. 4 represents a transverse cross section of a variant of the aforementioned optical semiconductor package, in an engaged position
  • FIG. 5 represents a transverse cross section of the optical semiconductor package of FIG. 4 , in an adjustment and holding position.
  • the representation is of an optical semiconductor package 1 which comprises an electrical connection plate 2 on the front of which is bonded the back of an integrated circuit chip 3 , the front of which has an optical sensor 4 .
  • Electrical connection terminals provided on the front of the chip 3 are linked to terminals on the front of the plate 2 by electrical lead wires 5 .
  • annular support 6 which surrounds the chip 3 and the wires 5 at a distance, this support 6 having a cylindrical passage 6 a to receive a cylindrical ring 7 holding in its passage an optical objective lens 8 , situated facing the optical sensor 4 of the chip 3 .
  • the wall of the receiving cylindrical passage 6 a has local release recesses formed by three axial release grooves 9 peripherally spaced at 120° intervals, as well as secondary local recesses formed by three secondary axial grooves 10 peripherally spaced at 120° intervals and offset angularly relative to the main axial grooves 9 , for example by 30°, the axial release grooves 9 and the secondary axial grooves 10 opening out at the front end of the passage 6 .
  • the axial release grooves 9 and the secondary axial grooves 10 have concave rounded bottoms and convex rounded edges.
  • the depth of the axial release grooves 9 is substantially greater than the depth of the secondary axial grooves 10 .
  • the cylindrical ring 7 has a peripheral groove 11 at the bottom of which are provided three projecting studs 12 at 120° intervals that do not reach the edges of this groove 11 .
  • an elastically deformable ring 13 which passes over the studs 12 to form, at three points, locally projecting parts 14 comprising a locally projecting elastically deformable means or elastically deformable local projection relative to the peripheral face of the ring 7 .
  • the ring 7 can be coupled in the support 6 by the following method.
  • the ring 7 is placed axially facing the passage 6 a of the support 6 by placing the locally projecting parts 14 of the elastically deformable ring 13 in line with the axial release grooves 9 .
  • the ring 7 is engaged axially in the passage 6 a of the support 6 as far as an axial adjustment position of the lens 8 relative to the optical sensor 4 of the chip 3 .
  • peripheral groove 11 of the ring 7 , its studs 12 , the ring 13 and the axial release grooves 9 of the support 6 are dimensioned to ensure that this engaging movement is achieved preferably without friction.
  • the ring 7 is pivoted or turned relative to the support 6 . This done, the locally projecting parts 14 of the ring 13 are moved out of the axial release grooves 9 of the support 6 and are compressed against the wall of the passage 6 a of this support.
  • the internal diameter of the passage 6 a of the support 6 , the outer diameter of the ring 7 and the thickness of the locally projecting parts 14 of the ring 13 are adapted accordingly.
  • FIG. 3 shows, when the locally projecting parts 14 of the ring 13 are lined up with the secondary grooves 10 , the rotation of the ring 7 is stopped, these parts 14 expanding slightly into these secondary grooves 10 .
  • the elastic ring 13 can also be in contact with the wall of the passage 6 a of the support 6 to form a protective seal.
  • a variant of the package 1 is represented, in which the locking means of the ring 7 is, this time, formed by three projecting lands 15 extending longitudinally over at least a part of the length of the outer wall of the ring 7 and at 120° intervals.
  • the lands 15 are integral to the ring 7 . As a variant, they could be added on.
  • the lands 15 have a section which reduces from their root to their tip and they are angled.
  • the material chosen to produce the ring 7 is such that the lands 15 are elastically deformable and comprise a locally projecting elastically deformable means or elastically deformable local projection.
  • the coupling of the ring 7 equipped with the lands 15 with the support 6 can be achieved as described in the preceding example, the thickness of the elastically deformable lands 15 being adapted to the compression effect mentioned above. Furthermore, the lands 15 are preferably angled in the direction opposite to the direction of rotation of the ring 7 on coupling.
  • the ring 7 is engaged axially in the passage 6 a of the support 6 by engaging the projecting lands 15 axially in the axial release grooves 9 of this support 6 , as far as an axial adjustment position of the lens 8 relative to the optical sensor 4 of the chip 3 , the lands 13 and the axial release grooves 9 of the support 6 being dimensioned such that this engagement movement is preferably achieved without friction.
  • the ring 7 is pivoted or turned relative to the support 6 . This done, the lands 15 of the ring 7 are moved out of the axial release grooves 9 of the support 6 and are compressed against the wall of the passage 6 a of this support.
  • the internal diameter of the passage 6 a of the support 6 , the external diameter of the ring 7 and the form and the thickness of the projecting lands 15 of this ring 7 are adapted accordingly.
  • FIG. 5 shows, when the lands 15 are lined up with the secondary grooves 10 , the rotation of the ring 7 is stopped, these parts 14 expanding slightly into these secondary grooves 10 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Lens Barrels (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Solid State Image Pick-Up Elements (AREA)
US11/108,624 2004-04-20 2005-04-18 Optical semiconductor package with compressible adjustment means Expired - Fee Related US7504666B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/364,557 US7687819B2 (en) 2004-04-20 2009-02-03 Optical semiconductor package with compressible adjustment means

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0404133 2004-04-20
FR0404133A FR2869158A1 (fr) 2004-04-20 2004-04-20 Boitier semi-conducteur optique a moyen compressible de reglage

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/364,557 Division US7687819B2 (en) 2004-04-20 2009-02-03 Optical semiconductor package with compressible adjustment means

Publications (2)

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US20050230772A1 US20050230772A1 (en) 2005-10-20
US7504666B2 true US7504666B2 (en) 2009-03-17

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US12/364,557 Active US7687819B2 (en) 2004-04-20 2009-02-03 Optical semiconductor package with compressible adjustment means

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Country Status (4)

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US (2) US7504666B2 (fr)
EP (1) EP1589587A1 (fr)
JP (1) JP2005354039A (fr)
FR (1) FR2869158A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090102033A1 (en) * 2007-10-18 2009-04-23 Elmos Advanced Packaging B.V. Integrated circuit package
DE102010047106A1 (de) * 2010-10-01 2012-04-05 Conti Temic Microelectronic Gmbh Optische Vorrichtung mit Justageelement
US11061190B2 (en) 2017-07-14 2021-07-13 Senko Advanced Components, Inc. Small form factor fiber optic connector with multi-purpose boot assembly

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM382505U (en) * 2010-01-15 2010-06-11 Cheng Uei Prec Ind Co Ltd Video device
CN202003118U (zh) * 2011-03-04 2011-10-05 鸿富锦精密工业（深圳）有限公司 相机模组
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
DE102016013045A1 (de) * 2016-10-24 2018-04-26 Blum-Novotest Gmbh Messsystem zur Messung an Werkzeugen in einer Werkzeugmaschine

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153734A (en) 1989-11-30 1992-10-06 Fuji Photo Film Co., Ltd. Solid state image pickup device mounting structure
DE19958229A1 (de) 1998-12-09 2000-06-15 Fuji Electric Co Ltd Optisches Halbleiter-Sensorbauelement
US20020047119A1 (en) 2000-10-19 2002-04-25 Fujitsu Limited Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays
EP1220324A2 (fr) 2000-11-14 2002-07-03 Kabushiki Kaisha Toshiba Appareil de prise d'images, procédé de fabrication, et appareil électrique
EP1271214A1 (fr) 2001-06-14 2003-01-02 STMicroelectronics S.r.l. Dispositif optique, en particulier détecteur d'image
FR2849275A1 (fr) * 2002-12-24 2004-06-25 St Microelectronics Sa Procede d'assemblage d'un systeme optique en avant sur un boitier optique
JP2004222064A (ja) * 2003-01-16 2004-08-05 Seiko Precision Inc 固体撮像装置
US20050169618A1 (en) * 2004-01-30 2005-08-04 Hiroshi Akada Position control device, image blur correction device, and optical apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5400072A (en) * 1988-12-23 1995-03-21 Hitachi, Ltd. Video camera unit having an airtight mounting arrangement for an image sensor chip
FR2835651B1 (fr) * 2002-02-06 2005-04-15 St Microelectronics Sa Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase
FR2854496B1 (fr) * 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153734A (en) 1989-11-30 1992-10-06 Fuji Photo Film Co., Ltd. Solid state image pickup device mounting structure
DE19958229A1 (de) 1998-12-09 2000-06-15 Fuji Electric Co Ltd Optisches Halbleiter-Sensorbauelement
US20020047119A1 (en) 2000-10-19 2002-04-25 Fujitsu Limited Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays
EP1220324A2 (fr) 2000-11-14 2002-07-03 Kabushiki Kaisha Toshiba Appareil de prise d'images, procédé de fabrication, et appareil électrique
EP1271214A1 (fr) 2001-06-14 2003-01-02 STMicroelectronics S.r.l. Dispositif optique, en particulier détecteur d'image
FR2849275A1 (fr) * 2002-12-24 2004-06-25 St Microelectronics Sa Procede d'assemblage d'un systeme optique en avant sur un boitier optique
US7018112B2 (en) * 2002-12-24 2006-03-28 Stmicroelectronics S.A. Method of assembling an optical system with an optical package in advance
JP2004222064A (ja) * 2003-01-16 2004-08-05 Seiko Precision Inc 固体撮像装置
US20050169618A1 (en) * 2004-01-30 2005-08-04 Hiroshi Akada Position control device, image blur correction device, and optical apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Preliminary French Search Report, FR 04 04133, dated Nov. 30, 2004.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090102033A1 (en) * 2007-10-18 2009-04-23 Elmos Advanced Packaging B.V. Integrated circuit package
US8035208B2 (en) * 2007-10-18 2011-10-11 Sencio B.V. Integrated circuit package
DE102010047106A1 (de) * 2010-10-01 2012-04-05 Conti Temic Microelectronic Gmbh Optische Vorrichtung mit Justageelement
US11061190B2 (en) 2017-07-14 2021-07-13 Senko Advanced Components, Inc. Small form factor fiber optic connector with multi-purpose boot assembly

Also Published As

Publication number Publication date
EP1589587A1 (fr) 2005-10-26
US20090184385A1 (en) 2009-07-23
FR2869158A1 (fr) 2005-10-21
US7687819B2 (en) 2010-03-30
US20050230772A1 (en) 2005-10-20
JP2005354039A (ja) 2005-12-22

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