US7480979B2 - Production of antenna devices - Google Patents

Production of antenna devices Download PDF

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Publication number
US7480979B2
US7480979B2 US10/451,437 US45143703A US7480979B2 US 7480979 B2 US7480979 B2 US 7480979B2 US 45143703 A US45143703 A US 45143703A US 7480979 B2 US7480979 B2 US 7480979B2
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United States
Prior art keywords
dielectric substrate
ejecting
producing
antenna
conductive substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
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US10/451,437
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English (en)
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US20040060162A1 (en
Inventor
Stefan Morén
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Laird Connectivity Sweden AB
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AMC Centurion AB
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Assigned to AMC CENTURION AB reassignment AMC CENTURION AB ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOREN, STEFAN
Publication of US20040060162A1 publication Critical patent/US20040060162A1/en
Application granted granted Critical
Publication of US7480979B2 publication Critical patent/US7480979B2/en
Assigned to LAIRD TECHNOLOGIES AB reassignment LAIRD TECHNOLOGIES AB CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: AMC CENTURION AB
Assigned to LAIRD TECHNOLOGIES GOTHENBURG AB reassignment LAIRD TECHNOLOGIES GOTHENBURG AB ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAIRD TECHNOLOGIES, AB
Assigned to LAIRD CONNECTIVITY SWEDEN AB reassignment LAIRD CONNECTIVITY SWEDEN AB ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAIRD TECHNOLOGIES GOTHENBURG AB
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Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • Y10T29/49018Antenna or wave energy "plumbing" making with other electrical component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Definitions

  • the internally mounted antennas may typically be provided as printed circuit antennas.
  • Two techniques frequently employed in this respect are screen-printing and tampon printing. While such techniques are simple and cost effective they are not very flexible since the antenna patterns to be produced have to be determined at an early stage in the production process. Further, they are difficult to use for the production of antenna patterns onto curved surfaces, particularly concave surfaces, if at all possible.
  • Another object of the present invention is to provide a process for mass producing printed circuit antennas, which minimizes the time required to produce such printed circuit antennas.
  • FIG. 2 d illustrates, schematically, a particular embodiment of the system for producing an antenna device as illustrated in FIG. 1 .
  • the system 1 further comprises a carrier 15 in the form of a bench, worktable, or similar, and a means 16 , such as for example a frame or support, for interconnecting ejecting apparatus 3 and carrier 15 in accurately and precisely controlled fashion and for moving the carrier 15 and ejection opening 5 of ejecting apparatus 3 relative each other in a plane substantially perpendicular to the direction of the jet 13 ejected from opening 5 .
  • a carrier 15 in the form of a bench, worktable, or similar
  • a means 16 such as for example a frame or support, for interconnecting ejecting apparatus 3 and carrier 15 in accurately and precisely controlled fashion and for moving the carrier 15 and ejection opening 5 of ejecting apparatus 3 relative each other in a plane substantially perpendicular to the direction of the jet 13 ejected from opening 5 .
  • the solidification of the antenna pattern may be speeded up by means of heating the liquid conductive substance ejected onto the dielectric substrate; or by means of blowing a gas, particularly dry air, over the dielectric substrate and the liquid conductive substance ejected thereon.
  • Such dual antenna pattern may be produced to enhance the RF performance of the antenna device, to allow for multiband operation and/or to form electrical circuits, e.g., matching circuits including capacitors, directly on the dielectric substrate 21 .
  • the liquid conductive substance is conductive ink and the ejecting apparatus is an ink jet printer.
  • FIGS. 2 a and b showing the basic structure of an ink jet printing device for safe, rapid and reliable ejection of droplets of a conductive ink, wherein droplet formation is achieved by means of thermal energy.
  • Ink is supplied from an ink supply tank 38 maintained under a predetermined elevated pressure P 3 to a printing channel 35 via a conduit 37 .
  • the printing channel 35 can be a capillary channel similarly ensuring reliable ink feed from a tank towards a printing opening 39 .
  • the printing channel 35 is formed by means of a base plate 34 and a cover plate 36 provided with an appropriate groove.
  • the resistor 33 can be covered by a thermoconductive foil (not shown), which is in close contact therewith and which protects the resistor against thermal burnout into the ink. Moreover, such foil makes the resistor insensitive to the chemical properties of the ink used.
  • ink jet printing device for use in the present invention has been described in two embodiments by way of example it shall be appreciated that the same can be varied in a plurality of ways. Such further variations regarding ink jet printers and ink jet printing technologies may be found in U.S. Pat. Nos. 4,050,075 issued to Hertz et al. and U.S. Pat. No. 6,155,680 issued to Belon et al., and in references therein, all of which being hereby incorporated by reference.
  • antenna patterns may be formed on essentially non-planar surfaces such as curved, convex and concave surfaces and still maintain a substantially constant distance between the opening of the printing head and the non-planar surface on which the antenna pattern is to be formed.
  • a dielectric substrate 21 having an essentially non-planar surface on which the antenna pattern is to be formed, is mounted at table 63 , whereafter table 63 is moved in the XY-plane and in the Z-direction while ejecting liquid conductive substance from printing head 60 .
  • the movement in the XY-direction is indicative of the antenna pattern to be produced and the movement in the Z-direction is performed to follow the non-planar surface of the dielectric substrate 21 , i.e. to obtain a constant distance to the non-planar surface of the dielectric substrate 21 during production.
  • the movement in the Z-direction is thus performed to keep the opening of printing head 60 on a level with dotted line 66 .
  • FIG. 3 a shows an antenna device comprising a meander pattern 71 produced on a dielectric substrate 21 , for instance a stiff or a flexible substrate.
  • a dielectric substrate 21 for instance a stiff or a flexible substrate.
  • Using a flexible substrate enables the shape of the substrate to be adapted to the shape of the casing of the portable radio communication device in which it is to be mounted.
  • the meander shaped antenna pattern 71 has a feed connection point 72 and a number of parallel feed and ground lines 73 , all connected to a feed point 72 and a ground point 74 via a common main feed line 75 and a ground line 76 , respectively.
  • the antenna element also comprises additional capacitive components 77 and an inductive component 78 connected to ground.
  • the dotted lines 79 illustrate some positions where the length of the antenna pattern 1 can be adjusted.
  • the reference numerals 80 designate short circuiting lines between different points of the antenna element.
  • the capacitive and inductive components 77 , 78 are illustrated as discrete components. However, the desired capacitance or inductance can easily be provided by means of suitable formed conductive path. of the same kind as the conductive path of the antenna element and applied on the same substrate as the antenna element and connected thereto, as is known in the art.
  • FIGS. 3 c and d illustrate, schematically in cross-sectional views, two further antenna patterns as produced according to production methods of the present invention.
  • the conductive ink layer 91 is provided so that a plated metal layer 92 adheres satisfactorily thereto.
  • the conductive ink layer 23 is selectively chemically plated with a metal layer 92 of a conductive metal such as nickel or copper such that the plated metal layer 92 obtains a pattern substantially matching pattern 91 and overlying the same.
  • adhesive in the conductive ink is etched away from the conductive ink layer 91 to make the surface thereof rough, the rough surface of the ink layer 92 is then chemically plated with a conductive metal such as nickel or copper in the presence of a catalyst such as platinum.
  • FIG. 4 is a flow scheme of an iterative production process, a further embodiment of the present invention will be described.
  • the dielectric substrate with said antenna pattern formed thereon and the portable radio communication apparatus of the particular model are disassembled wherein the antenna pattern is electrically disconnected from the RF feed device of the portable radio communication apparatus.
  • the measured antenna characteristic is, in a step 109 , used in a decision model to decide on whether the characteristic is acceptable, if it is not fully acceptable but indicate that it could be acceptable subsequent to certain modification of the antenna pattern, or not all acceptable.
  • the dielectric with the antenna pattern is sorted according to the taken decision: if the characteristic is acceptable the dielectric with the antenna pattern is approved as a produced antenna device, if it is not at all acceptable the dielectric with the antenna pattern is rejected, and if the dielectric with the antenna pattern is to be modified it is, in a step 113 , returned to the ejecting apparatus such that, again in a step 101 , a further modified conductive antenna pattern can be formed on the dielectric.
  • the process then continues with the steps 103 - 111 until the dielectric with the antenna patterns or modified antenna pattern ultimately will be approved or rejected.
  • components 73 , 77 , 78 , pattern length at 79 , and 80 of the antenna pattern illustrated in FIG. 3 a and components 87 and 88 of the antenna pattern illustrated in FIG. 3 b are examples of additional structure that can be applied to an initially formed antenna pattern.
  • dotted circles 81 in the antenna patterns of FIG. 3 a and b can indicate positions where electrical paths are disrupted by means of removing antenna material.
  • the production process described above can be applied in the initial phase of the mass production of a particular antenna device.
  • the ultimately approved antenna device with the modified antenna pattern can used as a template for the mass production of antenna devices for use in portable radio communication apparatus of the particular model.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
US10/451,437 2000-12-29 2001-12-21 Production of antenna devices Expired - Fee Related US7480979B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0004909-8 2000-12-29
SE0004909A SE519904C2 (sv) 2000-12-29 2000-12-29 Tillverkning av antennanordningar
PCT/SE2001/002885 WO2002054841A1 (en) 2000-12-29 2001-12-21 Production of antenna devices

Publications (2)

Publication Number Publication Date
US20040060162A1 US20040060162A1 (en) 2004-04-01
US7480979B2 true US7480979B2 (en) 2009-01-27

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US10/451,437 Expired - Fee Related US7480979B2 (en) 2000-12-29 2001-12-21 Production of antenna devices

Country Status (6)

Country Link
US (1) US7480979B2 (de)
EP (1) EP1346616A1 (de)
KR (1) KR100562769B1 (de)
CN (1) CN1235455C (de)
SE (1) SE519904C2 (de)
WO (1) WO2002054841A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100026583A1 (en) * 2006-10-17 2010-02-04 Laird Technologies Ab method of production of an antenna pattern
WO2013130842A1 (en) * 2012-03-02 2013-09-06 Pulse Electronics, Inc. Deposition antenna apparatus and methods
US9325060B2 (en) 2014-02-12 2016-04-26 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
US9833802B2 (en) 2014-06-27 2017-12-05 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
US10020561B2 (en) 2013-09-19 2018-07-10 Pulse Finland Oy Deposited three-dimensional antenna apparatus and methods

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4251041B2 (ja) * 2002-08-30 2009-04-08 セイコーエプソン株式会社 液体噴射装置
JP2006156943A (ja) * 2004-09-28 2006-06-15 Seiko Epson Corp 配線パターンの形成方法、配線パターンおよび電子機器
US7354794B2 (en) 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors
CA2516141A1 (en) * 2005-08-17 2007-02-17 Intelligent Devices Inc. Printing press control system
EP1855514A1 (de) * 2006-05-10 2007-11-14 AMC Centurion AB Herstellung von Antennenbauelementen
KR100845117B1 (ko) * 2007-02-21 2008-07-10 김효순 안테나 및 그 제조방법
GB2453765A (en) 2007-10-18 2009-04-22 Novalia Ltd Product packaging with printed circuit and means for preventing a short circuit
KR100857615B1 (ko) * 2008-01-22 2008-09-09 (주)휴먼테크 Rfid안테나 제조방법
US7898484B1 (en) * 2008-05-12 2011-03-01 The United States Of America As Represented By The Secretary Of The Navy Electrolytic fluid antenna
WO2009141817A2 (en) * 2008-05-19 2009-11-26 Galtronics Corporation Ltd. Conformable antenna
CN102148422A (zh) * 2011-02-23 2011-08-10 中兴通讯股份有限公司 一种调频天线实现装置及移动终端
TWI482361B (zh) * 2012-01-18 2015-04-21 Cirocomm Technology Corp 平板天線的自動檢測修正調整方法及其系統
CN104178721B (zh) * 2013-05-22 2016-08-10 中国科学院理化技术研究所 室温下直接制作导电薄膜的装置及方法
DE202014103821U1 (de) * 2014-07-09 2014-09-09 Carmen Diegel Flexible elektrische Leiterstruktur
CN104966684A (zh) * 2015-06-10 2015-10-07 江苏杰进微电子科技有限公司 一种集成电路芯片胶装设备及其工作方法
US10164328B2 (en) 2016-09-08 2018-12-25 The United States Of America As Represented By Secretary Of The Navy Method and apparatus for optical agitation of electrolytes in a fluid-based antenna
CN110137687A (zh) * 2019-05-29 2019-08-16 兰州大学 一种制备柔性超材料的方法

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US5768217A (en) * 1996-05-14 1998-06-16 Casio Computer Co., Ltd. Antennas and their making methods and electronic devices or timepieces with the antennas
WO1999043037A2 (en) 1998-02-23 1999-08-26 Qualcomm Incorporated Uniplanar dual strip antenna
EP0954049A2 (de) 1998-04-28 1999-11-03 Matsushita Electric Industrial Co., Ltd. Verbindungsverfahren für Leiterplatte, Verzweigungsschaltung und Methode zum Entwerfen einer derartigen Schaltung, Hohlleiter/Mikrostreifenleiterübergang und seine Verwendung in einer HF-Schaltung, einer Antenne und einem Kommunikationssystem
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US6120588A (en) 1996-07-19 2000-09-19 E Ink Corporation Electronically addressable microencapsulated ink and display thereof
WO2000077854A1 (fr) 1999-06-15 2000-12-21 Gemplus Procede de fabrication de tout ou partie d'un dispositif electronique par jet de matiere
US6175752B1 (en) 1998-04-30 2001-01-16 Therasense, Inc. Analyte monitoring device and methods of use
US6396444B1 (en) * 1998-12-23 2002-05-28 Nokia Mobile Phones Limited Antenna and method of production
US6697694B2 (en) * 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
US6973709B2 (en) * 2001-04-19 2005-12-13 Chunghwa Picture Tubes Method of manufacturing printed-on-display antenna for wireless device
US7102522B2 (en) * 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US7192107B2 (en) * 2003-04-21 2007-03-20 Seiko Epson Corporation Information communicating member, liquid container having information communicating member and liquid ejecting apparatus
US7199033B2 (en) * 2003-05-28 2007-04-03 Seiko Epson Corporation Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus

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US5558504A (en) 1990-02-12 1996-09-24 Mydata Automation Ab Magnetostrictive pump for applying pastes and adhesives
US5768217A (en) * 1996-05-14 1998-06-16 Casio Computer Co., Ltd. Antennas and their making methods and electronic devices or timepieces with the antennas
US6120588A (en) 1996-07-19 2000-09-19 E Ink Corporation Electronically addressable microencapsulated ink and display thereof
WO1999043037A2 (en) 1998-02-23 1999-08-26 Qualcomm Incorporated Uniplanar dual strip antenna
EP0954049A2 (de) 1998-04-28 1999-11-03 Matsushita Electric Industrial Co., Ltd. Verbindungsverfahren für Leiterplatte, Verzweigungsschaltung und Methode zum Entwerfen einer derartigen Schaltung, Hohlleiter/Mikrostreifenleiterübergang und seine Verwendung in einer HF-Schaltung, einer Antenne und einem Kommunikationssystem
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US6697694B2 (en) * 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
EP0991014A2 (de) 1998-09-30 2000-04-05 Toppan Forms Co., Ltd Leitfähige Paste und Verfahren zur Herstellung einer Transpondersantenne
US6396444B1 (en) * 1998-12-23 2002-05-28 Nokia Mobile Phones Limited Antenna and method of production
WO2000077854A1 (fr) 1999-06-15 2000-12-21 Gemplus Procede de fabrication de tout ou partie d'un dispositif electronique par jet de matiere
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US7102522B2 (en) * 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US7192107B2 (en) * 2003-04-21 2007-03-20 Seiko Epson Corporation Information communicating member, liquid container having information communicating member and liquid ejecting apparatus
US7199033B2 (en) * 2003-05-28 2007-04-03 Seiko Epson Corporation Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100026583A1 (en) * 2006-10-17 2010-02-04 Laird Technologies Ab method of production of an antenna pattern
US8115684B2 (en) * 2006-10-17 2012-02-14 First Technologies, LLC Method of production of an antenna pattern
WO2013130842A1 (en) * 2012-03-02 2013-09-06 Pulse Electronics, Inc. Deposition antenna apparatus and methods
US9780438B2 (en) 2012-03-02 2017-10-03 Pulse Electronics, Inc. Deposition antenna apparatus and methods
US10020561B2 (en) 2013-09-19 2018-07-10 Pulse Finland Oy Deposited three-dimensional antenna apparatus and methods
US9325060B2 (en) 2014-02-12 2016-04-26 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
US9833802B2 (en) 2014-06-27 2017-12-05 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation

Also Published As

Publication number Publication date
US20040060162A1 (en) 2004-04-01
SE0004909L (sv) 2001-11-09
EP1346616A1 (de) 2003-09-24
KR100562769B1 (ko) 2006-03-20
WO2002054841A1 (en) 2002-07-11
CN1235455C (zh) 2006-01-04
CN1484935A (zh) 2004-03-24
KR20030064889A (ko) 2003-08-02
SE0004909D0 (sv) 2000-12-29
SE519904C2 (sv) 2003-04-22

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