US7281832B2 - Vehicular lamp - Google Patents

Vehicular lamp Download PDF

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Publication number
US7281832B2
US7281832B2 US10/850,369 US85036904A US7281832B2 US 7281832 B2 US7281832 B2 US 7281832B2 US 85036904 A US85036904 A US 85036904A US 7281832 B2 US7281832 B2 US 7281832B2
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United States
Prior art keywords
light emitting
emitting element
semiconductor light
vehicular lamp
sealing member
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Expired - Fee Related, expires
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US10/850,369
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English (en)
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US20040233678A1 (en
Inventor
Hiroyuki Ishida
Kiyoshi Sazuka
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Koito Manufacturing Co Ltd
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Koito Manufacturing Co Ltd
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Assigned to KOITO MANUFACTURING CO., LTD. reassignment KOITO MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHIDA, HIROYUKI, SAZUKA, KIYOSHI
Publication of US20040233678A1 publication Critical patent/US20040233678A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
    • B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/155—Surface emitters, e.g. organic light emitting diodes [OLED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/50—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by aesthetic components not otherwise provided for, e.g. decorative trim, partition walls or covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a vehicular lamp. More particularly, the present invention relates to a vehicular lamp used in a vehicle.
  • the light distribution pattern is formed by an optical system using a reflector and a lens as disclosed, for example, in Japanese Patent Application Publication (Laid-Open) No. 1994-89601.
  • a semiconductor light emitting element is used in the vehicle headlamp.
  • the semiconductor light emitting element produces light from the emitting area with expansion such as the entire surface thereof. Therefore, if the semiconductor light emitting element is used in the vehicle headlamp, the optical design is complicated, and it is difficult to form a proper light distribution pattern.
  • a vehicular lamp used in a vehicle includes a semiconductor light emitting element for producing light, a sealing member formed of a material through which the light passes for sealing the semiconductor light emitting element, a fixing member for fixing the semiconductor light emitting element by fitting an apparent position of one side of the semiconductor light emitting element when viewed through the sealing member into a reference position to which the semiconductor light emitting element is to be attached, and an optical member for forming at least a part of a cut line, which determines a boundary between bright and dark of a light distribution pattern of the vehicular lamp, by projecting a shape of the one side of the semiconductor light emitting element out of the vehicular lamp.
  • the fixing member may fix the semiconductor light emitting element by fitting the apparent position of the one side into the reference position predetermined within a horizontal plane which includes a light axis of the vehicular lamp.
  • the sealing member may be shaped like a convex lens
  • the fixing member may fix the semiconductor light emitting element by fitting one side of an image of the semiconductor light emitting element magnified by the convex lens-shaped sealing member into the reference position so as to fit the apparent position of the one side of the semiconductor light emitting element into the reference position.
  • FIG. 1 shows a perspective view of a vehicular lamp 10 .
  • FIG. 2 shows a horizontally sectional view of the vehicular lamp 10 .
  • FIG. 3 shows a vertically sectional view AA of a light source unit 20 .
  • FIG. 4 shows a vertically sectional view BB of the light source unit 20 .
  • FIG. 5 shows an example of an image 120 .
  • FIG. 6 shows an example of a light distribution pattern 300 .
  • FIG. 7 shows another example of the configuration of a LED module 100 .
  • FIG. 8 shows a horizontally sectional view AA of a light source unit 20 .
  • FIG. 9 shows a vertically sectional view BB of the light source unit 20 .
  • FIG. 10 shows an example of a light distribution pattern 300 a.
  • FIG. 11 shows an example of a light distribution pattern 300 b.
  • FIGS. 1 and 2 show an example of the configuration of a vehicular lamp 10 according to an exemplary embodiment of the present invention.
  • FIG. 1 shows a perspective view of the vehicular lamp 10 .
  • FIG. 2 shows a horizontally sectional view of the vehicular lamp 10 by a horizontal plane crossing the middle of a light source unit 20 .
  • the vehicular lamp 10 is a vehicle headlamp which is used in a vehicle such as an automobile, emitting light in a forward direction of the vehicle.
  • the vehicular lamp 10 includes a plurality of light source units 20 , a cover 12 , a lamp body 14 , a circuit unit 16 , a plurality of heat radiating members 24 , an extension reflector 28 , and cables 22 and 26 .
  • Each of the light source units 20 includes a LED module 100 so as to emit the light of a predetermined distribution pattern based on the light produced by the LED module 100 .
  • the light source units 20 are supported by the lamp body 14 to move obliquely by way of an aiming mechanism for adjustment of the direction of the light axis of the light source units 20 .
  • the light source units 20 may be supported by the lamp body 14 in order that the light axis faces downwards by 0.3 to 0.6 degrees when the vehicular lamp 10 is attached to the vehicle body.
  • the plurality of light source units 20 may have the same or similar light distribution characteristics or different light distribution characteristics from each other. And in another embodiment, one of the light source units 20 may have a plurality of LED module 100 . The light source units 20 may have semiconductor lasers in place of the LED modules 100 .
  • the cover 12 and the lamp body 14 forms a lamp chamber of the vehicular lamp 10 , in which the light source units 20 are contained.
  • the cover 12 and the lamp body 14 may seal or waterproof the light source units 20 .
  • the cover 12 is translucent, made of a material through which the light produced by the LED module 100 passes, provided on a front surface of the vehicle, covering a front of the light source units 20 .
  • the lamp body 14 faces the cover 12 with the light source units 20 interposed therebetween, covering a rear of the light source units 20 .
  • the circuit unit 16 is a module in which a lighting circuit for lighting the LED module 100 is formed.
  • the circuit unit 16 is electrically coupled to the light source units 20 via the cables 22 .
  • the circuit unit 16 is electrically coupled to the outside of the vehicular lamp 10 via the cables 26 .
  • the heat radiating members 24 are heat sinks which are provided contacting at least a part of the light source units 20 .
  • the heat radiating member 24 is made of a material whose coefficient of thermal conductivity is higher than air such as metal.
  • the heat radiating members 24 are pivotally movable on the aiming mechanism, accompanying the light source units 20 within a range of the movement of the light source units 20 , also having a sufficient space against the lamp body 14 to adjust the light axis of the light source units 20 .
  • the heat radiating members 24 may be integrally formed as a metal member. In this case, the entire heat radiating members 24 can dissipate heat efficiently.
  • the extension reflector 28 is made of a thin metal plate, reaching the cover 12 from the bottoms of the light source units 20 .
  • the extension reflector 28 covers at least a part of an inner surface of the lamp body 14 so as to conceal the inner surface of the lamp body 14 , thereby improving the appearance of the vehicular lamp 10 .
  • the extension reflector 28 touches the light source units 20 and/or the heat radiating members 24 .
  • the extension reflector 28 functions as a heat conducting member for conducting the heat produced by the LED module 100 to the cover 12 . Accordingly, the extension reflector 28 dissipates the heat of the LED module 100 .
  • a part of the extension reflector 28 is fixed to the cover 12 or the lamp body 14 .
  • the extension reflector 28 may be shaped to cover the top, bottom, and sides of the light source units 20 .
  • the light source units 20 can be small.
  • the degree of freedom for arrangement of the light source units 20 is improved, so it is possible to provide the vehicular lamp 10 of good characteristics for design.
  • FIGS. 3 and 4 show an example of the configuration of the light source unit 20 .
  • FIG. 3 shows a vertically sectional view AA of a light source unit 20 .
  • FIG. 4 shows a vertically sectional view BB of the light source unit 20 .
  • the light source unit 20 is a straight emission type light source unit for emitting the light generated by the LED module 100 in the forward direction through the lens 204 , including a LED module 100 , a lens 204 , a fixing member 202 , an extension 208 , and a housing 206 .
  • the LED module 100 is a light source for emitting white light, producing the light based on the power received from the outside of the light source unit 20 via the cable 22 .
  • the lens 204 is an example of an optical member used in the vehicular lamp 10 (see FIG. 1 ), emitting the light generated by the LED module 100 in the forward direction of the vehicle, thereby forming at least a part of the light distribution pattern of the vehicular lamp 10 .
  • the fixing member 202 is shaped like a plate whose surface faces in the forward direction of the vehicle, on which a bottom surface of the LED module 100 is supportably fixed. Accordingly, the fixing member 202 makes the LED module 100 emit light in the forward direction of the vehicle. And the fixing member 202 is made of a material whose coefficient of thermal conductivity is higher than air such as metal, functioning as a radiating plate for dissipating the heat produced by the LED module 100 . In this embodiment, the fixing member 202 is touching the housing 206 at its one end, so that it conducts the heat produced by the LED module 100 to the housing 206 , thereby dissipating the heat of the LED module 100 . Accordingly, it is possible to prevent the amount of the light emitted by the LED module 100 from being reduced by the heat.
  • the extension 208 is made of a thin metal plate, extending from the vicinity of the LED module 100 to the vicinity of an edge section of the lens 204 . Accordingly, the extension 208 conceals the gap between an inner surface of the housing 206 and the LED module 100 so as to improve the appearance of the vehicular lamp 10 .
  • the extension 208 may reflect the light produced by the LED module 100 .
  • the housing 206 is shaped like a box for containing the LED module 100 , the fixing member 202 , and the extension 208 . And the housing 206 has an opening in its front face, in which the lens 204 is held.
  • the housing 206 may conduct the heat received from the LED module 100 via the fixing member 202 to the heat radiating members 24 (see FIG. 1 ) and/or the extension reflector 28 (see FIG. 1 ). Accordingly, it is possible to properly dissipate the heat of the LED module 100 .
  • the LED module 100 includes a plurality of electrodes 104 , a base plate 106 , a semiconductor light emitting element 102 , and a sealing member 108 .
  • the electrodes 104 are electrically coupled to the semiconductor light emitting element 102 , supplying the power supplied from the outside of the light source units 20 via the cables 22 to the semiconductor light emitting element 102 .
  • the base plate 106 is a plate-shaped body which is fixed to a surface of the fixing member 202 , holding the semiconductor light emitting element 102 towards the lens 204 . And, at least a part of the base plate 106 is made of a material whose coefficient of thermal conductivity is higher than air such as metal, conducting the heat produced by the semiconductor light emitting element 102 to the fixing member 202 .
  • the semiconductor light emitting element 102 is a light emitting diode element for emitting light from a surface which faces in a direction from the base plate 106 towards the sealing member 108 , facing the fixing member 202 with the base plate 106 therebetween, producing light in response to the power received from the outside of the light source units 20 .
  • the semiconductor light emitting element 102 emits blue light towards a fluorescent material provided on its surface, thereby allowing the fluorescent material to emit yellow light which is complementary to the blue light.
  • the LED module 100 produces white light based on the blue and yellow light produced by the semiconductor light emitting element 102 and the fluorescent material respectively.
  • the semiconductor light emitting element 102 may emit infrared light to the fluorescent material so as to allow the fluorescent material to emit the white light.
  • the surface of the semiconductor light emitting element 102 is an approximate rectangle of 1 mm 2 .
  • the semiconductor light emitting element 102 produces light from its entire surface.
  • the semiconductor light emitting element 102 is an example of a flat light source for producing light from a flat area with expansion.
  • the sealing member 108 is a mold for sealing the semiconductor light emitting element 102 .
  • the sealing member 108 is made of a material through which the white light produced by the semiconductor light emitting element 102 passes such as translucent resin.
  • the sealing member 108 may be made of a material whose index of refraction is larger than air, covering the light emitting surface of the semiconductor light emitting element 102 . Accordingly, it is possible to efficiently take out and use the light produced by the inside of the semiconductor light emitting element 102 .
  • the sealing member 108 is shaped like an approximate sphere whose center lies on the semiconductor light emitting element 102 . Accordingly, the sealing member 108 is shaped like a convex lens. In this embodiment, the sealing member 108 is a hemisphere for sealing the semiconductor light emitting element 102 in its center.
  • the light can properly enter the lens 204 .
  • the semiconductor light emitting element 102 is viewed from the lens 204 through the sealing member 108 , the semiconductor light emitting element 102 magnified by the convex lens formed by the sealing member 108 has its image 120 whose size and shape is shown as a dashed line in appearance.
  • the size of the image 120 results from multiplying the size of the semiconductor light emitting element 102 by the index of refraction. Accordingly, the size of the image 120 is approximately 1.4 or 1.6 times as large as the size of the semiconductor light emitting element 102 .
  • a part of the sealing member 108 may be shaped like a convex lens.
  • the fixing member 202 includes a plurality of markers 210 provided in response to a reference position to which the semiconductor light emitting element 102 is to be attached, fixing the LED module 100 based on the positions of the markers 210 .
  • the markers 210 indicate the reference position into which one side of the image 120 of the semiconductor light emitting element 102 magnified by the convex lens-shaped sealing member 108 is to fit.
  • the fixing member 202 fixes the semiconductor light emitting element 102 on a predetermined position by fastening the LED module 100 .
  • an apparent position of one side of the semiconductor light emitting element 102 when viewed through the sealing member 108 fits into the reference position, whereby the fixing member 202 fixes the semiconductor light emitting element 102 .
  • the apparent position of the one side of the semiconductor light emitting element 102 viewed through the sealing member 108 fits into the reference position is a position which is optically equivalent to the one side of semiconductor light emitting element 102 when viewed through the sealing member 108 .
  • the reference position into which the one side of the image 120 is to fit is predetermined within a horizontal plane which includes the light axis of the light source units 20 .
  • the reference position is determined on a line which extends in a lateral direction of the vehicle, crossing a focus F of the lens 204 .
  • the fixing member 202 matches the center of the one side of the image 120 such as a lower side with the focus F so as to fix the LED module 100 .
  • the one side of the semiconductor light emitting element 102 such as a lower side is fixed at a position shifted upwards from the reference position by a distance in response to the magnification ratio of the image 120 to the semiconductor light emitting element 102 .
  • the one side of the semiconductor light emitting element 102 may be fixed at a position shifted upwards by half of the difference in size between the image 120 and the semiconductor light emitting element 102 from the reference position into which the one side of the image 120 is to fit.
  • each side of the image 120 is approximately 1.4 to 1.6 times as large as each side of the semiconductor light emitting element 102
  • the lower side of the semiconductor light emitting element 102 is fixed upwards by the distance which is approximately 0.2 to 0.3 times as large as the length of the side of the semiconductor light emitting element 102 extending vertically.
  • the one side of the semiconductor light emitting element 102 may be fixed upwards by the distance in response to the magnification ratio of the image 120 to the semiconductor light emitting element 102 with respect to the light axis of the light source units 20 .
  • the lens 204 projects the shape of the one side of the semiconductor light emitting element 102 to the outside of the vehicular lamp 10 , thereby forming at least a part of a cut line which determines a the boundary between bright and dark of the light distribution pattern of the vehicular lamp 10 . Accordingly, if the one side of the semiconductor light emitting element 102 is fixed, fitting into the focus F., the lens 204 projects the image 120 magnified by the sealing member 108 , whereby the shape of the one side of the semiconductor light emitting element 102 might not be projected with high precision. However, in this embodiment, inconsideration of the effect of the image 120 , the semiconductor light emitting element 102 can be fixed to the lens 204 with high precision.
  • the lens 204 can project the shape of the one side of the semiconductor light emitting element 102 in response to the one side of the image 120 in the forward direction of the vehicle with high precision. And accordingly, the light distribution pattern of the vehicular lamp 10 can be formed with high precision.
  • the focus F is an example of the optical center of the optical member used for the light source unit 20 .
  • the optical center may be a reference point in optical member design.
  • the horizontal plane including the light axis may be a horizontal plane including the light axis if the light axis of the light source units 20 faces in the horizontal direction. If the direction of the light axis of the light source units 20 is adjusted by the aiming mechanism, the reference position into which the one side of the image 120 is to fit may be predetermined in order that its horizontal plane is within a sloping plane in response to the angle by which the light source unit 20 slopes in adjustment. The reference position may be predetermined within a horizontal plane which includes the light axis of the vehicular lamp 10 .
  • the fixing member 202 may further have a reference line 212 which is shown as a dashed line in FIG. 4 .
  • the reference line 212 may indicate the position into which the one side of the base plate 106 such as a lower side of the base plate 106 is to fit.
  • the reference line 212 preferably indicates the position into which the one side of the base plate 106 is to fit, parallel to the one side of the image 120 fitting into the reference position.
  • the reference line 212 may be provided at a position predetermined on the basis of the distance between the one side of the image 120 and the one side of the base plate 106 . In this case, the semiconductor light emitting element 102 can be also fixed with high precision.
  • the fixing member 202 may have a level difference for engagement with the one side of the base plate 106 on the position in response to the reference line 212 .
  • FIG. 5 shows an example of the image 120 .
  • the image 120 is a virtual image of the semiconductor light emitting element 102 formed by the convex lens-shaped sealing member 108 , visible to an observer as the light from the surface of the semiconductor light emitting element 102 reaches the observer through the sealing member 108 .
  • the sealing member 108 is shaped like a hemisphere or convex lens whose center matches the center of the semiconductor light emitting element 102 .
  • the sealing member 108 allows the light from the center of the semiconductor light emitting element 102 towards the observer to pass through it straight.
  • the sealing member 108 deflects the light from a section except the center of the semiconductor light emitting element 102 towards the observer to the light axis of the convex lens.
  • the sealing member 108 deflects a part of the light from an edge section of the semiconductor light emitting element 102 towards the observer in a direction perpendicular to the surface of the semiconductor light emitting element 102 .
  • the observer perceives the image 120 magnified by the sealing member 108 in response to the light deflected.
  • the semiconductor light emitting element 102 has the size and shape of the image 120 in appearance when viewed through the sealing member 108 .
  • the width of the semiconductor light emitting element 102 when viewed from its side is 1 .
  • the top view of the semiconductor light emitting element 102 may be an approximate rectangular whose one side is 1 .
  • the observer perceives the image 120 whose width L is 1.4 to 1.6 times as large as 1 in place of the semiconductor light emitting element 102 whose width is 1.
  • the sealing member 108 forms an image of the semiconductor light emitting element 102 whose size and shape responds to the light deflected by the convex lens-shaped section.
  • the semiconductor light emitting element 102 has the size and shape of the image in appearance.
  • FIG. 6 shows an example of a light distribution pattern 300 formed by the vehicular lamp 10 (see FIG. 1 ).
  • the light distribution pattern 300 is a low beam light distribution pattern which is formed on a vertically virtual screen disposed 25 m away from the front of the vehicular lamp 10 .
  • the vehicular lamp 10 forms the light distribution pattern 300 having a the horizontal cut line 302 which determines the boundary between bright and dark in an approximately horizontal direction and an oblique cut line 304 which determines the boundary between bright and dark in an oblique direction by 15 degree against the horizontal direction.
  • the vehicular lamp 10 includes the plurality of light source units 20 whose light distribution characteristics are different from each other, forming the light distribution pattern 300 based on the light produced by each of the light source units 20 .
  • each of the light source units 20 forms a partial area of the light distribution pattern 300 .
  • the light source unit 20 described in connection with FIGS. 3 and 4 forms a partial area 306 of the light distribution pattern 300 .
  • the lens 204 of the light source units 20 emits the light produced by the semiconductor light emitting element 102 forward, projecting the shape of the semiconductor light emitting element 102 in the forward direction of the vehicle so as to form an area 306 .
  • the lens 204 may magnify and project the shape of the semiconductor light emitting element 102 in the horizontal direction.
  • the lens 204 has its focus F on a lower side of the image 120 of the semiconductor light emitting element 102 which extends in the horizontal direction, viewed through the sealing member 108 (see FIG. 3 ). And the lens 204 emits the light produced by the semiconductor light emitting element 102 in order that the light axes of the light source units 20 cross each other. Accordingly, the lens 204 projects the lower side of the image 120 which responds to the lower side of the semiconductor light emitting element 102 as an upper side of the area 306 .
  • the lens 204 forms at least a part of the upper side of the area 306 at the position where at least a part of the horizontal cut line 302 is to be formed. Accordingly, the light source units 20 form at least a part of the horizontal cut line 302 based on the boundary between bright and dark formed by the area 306 .
  • the lens 204 has its focus F on the one side of the image 120 which is optically equivalent to the one side of the semiconductor light emitting element 102 . Therefore, according to this embodiment, it is possible to form the clear horizontal cut line 302 based on the shape of the one side of the semiconductor light emitting element 102 .
  • the light source units 20 may at least a part of the oblique cut line based on the light produced by the semiconductor light emitting element 102 whose lower side is fixed parallel to an oblique direction. According to this embodiment, it is possible to form the clear horizontal cut line 302 .
  • FIG. 7 shows another example of the configuration of the LED module 100 .
  • the LED module 100 includes a plurality of semiconductor light emitting elements 102 .
  • the image 120 is an image which responds to the plurality of semiconductor light emitting elements 102 .
  • the image 120 envelops the outline of the image of each of the semiconductor light emitting elements 102 . In this case, since the one side of the image 120 fits into the reference position, the light distribution pattern can be properly formed. Further, the fixing member 202 (see FIGS.
  • 3 and 4 may fit the one side of the image of one of the semiconductor light emitting elements 102 into the reference position so as to fit the apparent position of the one side of the semiconductor light emitting element 102 into the reference position, thereby fixing the semiconductor light emitting elements 102 .
  • FIGS. 8 and 9 show another example of the configuration of the light source unit 20 .
  • FIG. 8 shows a horizontally sectional view AA of the light source unit 20 .
  • FIG. 9 shows a vertically sectional view BB of the light source unit 20 . Further, matters in FIGS. 8 and 9 given the same symbols as those in FIGS. 3 and 4 except the points to be described later will not be described because they have the same or similar functions as those in FIGS. 3 and 4 .
  • the light source units 20 includes a cover 252 , a plurality of LED modules 100 a and 100 b , a fixing member 202 , and a plurality of reflectors 256 and 260 .
  • the cover 252 is made of a material through which the light produced by the semiconductor light emitting element 102 can pass, translucently formed on the front surfaces of the light source units 20 .
  • the LED modules 100 a and 100 b are fixed to the fixing member 202 , where their bottom surfaces face each other with the fixing member 202 interposed therebetween. Front and rear surfaces of the fixing member 202 face in the lateral direction of the vehicle. And the LED modules 100 a and 100 b are fixed to the front and rear surfaces of the fixing member 202 respectively. In this case, the fixing member 202 fits the one side of the image 120 of each of the LED modules 100 a and 100 b into the corresponding reference position to fix it.
  • the reference position corresponding to the LED module 100 a takes the optical center F′ which is a reference point in designing the reflector 256 as its one end, determined on a line which extends in the horizontal direction.
  • the fixing member 202 matches an apex of the image 120 of the semiconductor light emitting element 102 of the LED module 100 a with the optical center F′and fits the one side of the image 120 into the reference position so as to fix the LED module 100 a .
  • the fixing member 202 matches the optical center F′ of the reflector 260 with an apex of the image 120 of the LED module 100 b so as to fix the LED module 100 b.
  • each of the reflectors 256 and 260 in response to the LED modules 100 a and 100 b respectively is formed to cover the corresponding LED module 100 from the back of the vehicle. Accordingly, each of the reflectors 256 and 260 reflects the light produced by the semiconductor light emitting element 102 of the corresponding LED module 100 in the forward direction of the vehicle. Further, the reflectors 256 and 260 are an example of optical members used in the vehicular lamp 10 (see FIG. 1 ), emitting the light produced by the corresponding semiconductor light emitting elements 102 in the forward direction of the vehicle so as to form at least a part of the light distribution pattern of the vehicular lamp 10 (see FIG. 1 ).
  • the reflector 256 has a plurality of light distribution steps 254 a to 254 f .
  • the reflector 256 forms at least a part of the oblique cut line of the light distribution pattern of the vehicular lamp 10 based on the light reflected by the light distribution steps 254 a to 254 f.
  • each of the light distribution steps 254 a to 254 f is a part of the reflector 256 which is sectioned in the shaped of a rectangle or obliquely sloping trapezoid, formed of, e.g. a hyperbolic and parabolic surface which is set corresponding to the shape of the oblique cut line supposed to be formed at each position on a parabolic surface.
  • the hyperbolic and parabolic surface is the same as or similar to a curved surface formed of parabolas whose substantially vertical cross-section becomes wider towards the front of the light source unit 20 and whose substantially horizontal cross-section becomes wider towards the back of the light source unit 20 .
  • the reflector 260 includes a plurality of the light distribution steps 258 a to 258 f .
  • the reflector 260 forms at least a part of the horizontal cut line of the light distribution pattern of the vehicular lamp 10 based on the light reflected by the light distribution steps 258 a to 258 f .
  • the light distribution steps 258 a to 258 f may have the same configurations as those of the light distribution steps 254 a to 254 f . According to this embodiment, the light distribution pattern can be properly formed.
  • FIG. 10 shows an example of a light distribution pattern 300 a formed by the reflector 256 .
  • the reflector 256 forms the light distribution pattern 300 a which includes a plurality of areas 602 a to 602 f .
  • Each of the light distribution steps 254 a to 254 f reflects the light produced by the semiconductor light emitting element 102 of the LED module 100 a so as to form the areas 602 a to 602 f respectively.
  • the light distribution step 254 a forms the area 602 a which expands in the approximately horizontal direction.
  • the light distribution steps 254 b to 254 f form the areas 602 b to 602 f which expand in a predetermined oblique direction.
  • the reflector 256 forms at least a part of the oblique cut line 304 based on the boundary between bright and dark of the areas 602 b to 602 f.
  • the semiconductor light emitting element 102 is fixed in order that at least a part of the one side of the image 120 fits into the optical center F′ of the reflector 256 .
  • the light distribution steps 254 a to 254 f are formed to take the optical center F′ as their common reference point in design. Therefore, according to this embodiment, the oblique cut line 304 can be formed with high precision based on the light produced by the LED module 100 a . In addition, the light distribution pattern can be properly formed.
  • FIG. 11 shows an example of a light distribution pattern 300 b formed by the reflector 260 .
  • the reflector 260 forms the light distribution pattern 300 b which includes a plurality of areas 604 a to 604 d .
  • Each of the light distribution steps 258 a to 258 f reflects the light produced by the semiconductor light emitting element 102 of the LED module 100 b so as to form the areas 604 a to 604 d respectively.
  • the reflector 260 forms at least a part of the horizontal cut line 302 based on the boundary between bright and dark of the areas 604 a to 604 d.
  • the semiconductor light emitting element 102 is fixed in order that at least a part of the one side of the image 120 fits into the optical center F′ of the reflector 260 .
  • the light distribution steps 258 a to 258 f are formed to take the optical center F′ as their common reference point in design. Therefore, according to this embodiment, the horizontal cut line 302 can be formed with high precision based on the light produced by the LED module 100 b . In addition, the light distribution pattern can be properly formed.
US10/850,369 2003-05-22 2004-05-21 Vehicular lamp Expired - Fee Related US7281832B2 (en)

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JP2003145278A JP2004349130A (ja) 2003-05-22 2003-05-22 車両用灯具

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KR (1) KR100557719B1 (de)
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KR100557719B1 (ko) 2006-03-07
DE102004025153A1 (de) 2004-12-30
GB2401928A (en) 2004-11-24
CN100472119C (zh) 2009-03-25
CN1573206A (zh) 2005-02-02
GB0411070D0 (en) 2004-06-23
DE102004025153B4 (de) 2011-06-09
FR2855246B1 (fr) 2008-05-16
JP2004349130A (ja) 2004-12-09
GB2401928B (en) 2005-06-01
FR2855246A1 (fr) 2004-11-26
KR20040100966A (ko) 2004-12-02
US20040233678A1 (en) 2004-11-25

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