US5326015A - Wire bonder tail length monitor - Google Patents

Wire bonder tail length monitor Download PDF

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US5326015A
US5326015A US08/038,843 US3884393A US5326015A US 5326015 A US5326015 A US 5326015A US 3884393 A US3884393 A US 3884393A US 5326015 A US5326015 A US 5326015A
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Prior art keywords
tail
wire
bond
fine wire
length
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James M. Weaver
Ehud Efrat
Daniel J. Muldoon
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Investments Inc
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Priority to JP6059248A priority patent/JPH07106365A/ja
Assigned to KULICKE AND SOFFA INVESTMENTS, INC. reassignment KULICKE AND SOFFA INVESTMENTS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MULDOON, DANIEL JOSEPH, EFRAT, EHUD, WEAVER, JAMES MICHAEL
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Assigned to KULICKE AND SOFFA INDUSTRIES, INC. reassignment KULICKE AND SOFFA INDUSTRIES, INC. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: KULICKE AND SOFFA INVESTMENTS, INC.
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Definitions

  • the present invention relates to a system for monitoring the conditions of a fine wire bonded interconnection and more particularly to a monitoring system which detects the presence and length of a wire tail employed to make a ball in preparation for making proper wire bonded interconnections.
  • VLSI devices are becoming more dense and are employing a greater number of lead out pads (electrodes) that must be wire bonded to lead connections on carriers or packages.
  • lead out pads are becoming smaller and more fragile and the VLSI devices are becoming more expensive.
  • the bonding tool makes direct contact with the lead out pad and can easily destroy the pad and the very expensive VLSI device on the attempt to make the next wire bond interconnection.
  • a restart procedure is employed.
  • an automatic wire bonder having a position sensor and a central processing unit capable of sensing the exact height or Z position of the wire bonding tool above a semiconductor device at predetermined intervals of time.
  • a continuity sensor and monitor is coupled to the fine wire.
  • the Z axis position of the bonding tool is sensed at the lowest bond position, at the wire clamped position and at the Z position when the fine wire breaks.
  • the differences between the lowest bond position and the Z position when the wire breaks is indicative of the length of the wire tail available to make a ball.
  • Logic circuits are employed to determine when a tail is present within predetermined threshold limits that ensure that a good ball can be made and if not present, then measures are taken to avoid damage to the semiconductor device.
  • FIG. 1 is a schematic drawing of a capillary bonding tool at second bond position
  • FIG. 2 is a schematic drawing of a capillary bonding tool raised above the second bond to a desired tail height position
  • FIG. 3 is a schematic drawing of a capillary bonding tool raised above the second bond position to a desired flame-off position showing a proper length tail;
  • FIG. 5 is a schematic drawing of a capillary bonding tool raised to a flame-off position with only a short wire tail;
  • FIG. 6 is a schematic drawing of a capillary bonding tool raised to flame-off position with the second bond lifted from the lead finger and the wire tail still connected to the interconnecting wire;
  • FIG. 7 is a schematic drawing of a capillary bonding tool raised to flame-off position with the wire tail still connected to the fine wire interconnection on the lead finger;
  • FIG. 8 is a schematic circuit diagram of a preferred conductivity logic circuit for monitoring and testing the length of a wire tail
  • FIG. 9 is a wave form of voltage versus time produced by the logic circuit of FIG. 8 when a good tail is produced;
  • FIG. 10 is a wave form of voltage versus time produced by the logic circuit of FIG. 8 when the wire tail does not break at the proper range of vertical axis positions;
  • FIG. 11 is a wave form of voltage versus time produced by the logic circuit of FIG. 8 when the wire tail is not of sufficient length;
  • FIG. 12 is a wave form of voltage versus time produced by the logic circuit of FIG. 8 when the wire tail was too short and the EFO attempted to make a ball;
  • FIG. 13 is a wave form of voltage versus time produced by the logic circuit of FIG. 8 when a short tail is produced by improper gap of the wire clamps;
  • FIG. 14 is a logic block diagram of the preferred embodiment steps performed after making a second bond.
  • FIGS. 1 through 3 showing a sequence of schematic drawings of a capillary bonding tool after making a fine wire interconnection and breaking the tail at second bond.
  • the semiconductor device 10 is shown having an electrode or pad 11 onto which a ball bond 12 has been made.
  • the capillary bonding tool has been raised above the first or ball bond 12 and moved to a position shown while paying out a length of fine wire 13 which forms the fine wire interconnection.
  • the second bond is made on a lead or lead frame 14 onto which a coating or plating 15 is provided for electrical conductivity and protection as well as to enhance the bondability at second bond.
  • the capillary bonding tool 16 is shown in its lower Z axis position in FIG.
  • FIG. 2 the wire clamps of the automatic wire bonder are in the open position and the capillary bonding tool 16 is raised to a tail height permitting the fine wire to feed through the capillary and form a tail 17 of proper tail length before closing the wire clamps (not shown).
  • FIG. 3 the wire clamps after being closed are raised simultaneously and together with the wire bonding tool 16 causing the tail 17 to break at second bond 19. While FIG. 3 is not drawn to proper scale, it is schematically representative of the relative position of the EFO electrode 18 at the time a ball is made on the tail 17. The proper tail height and flame-off heights for automatic wire bonders are discussed in detail in U.S. Pat. Nos. 4,266,710 and 5,111,986 assigned to Kulicke and Soffa Industries, Inc. the assignee of the present invention.
  • FIG. 4 showing a schematic drawing of the capillary bonding tool 16 raised to a flame-off position having little or no tail 17A.
  • a condition of this type can easily occur when the force of the bonding tool 16 is great enough in conjunction with the ultrasonic scrub to completely sever the fine wire 13 at second bond 19 and there is sufficient drag in the wire clamps to break the wire and cause the tail 17A to raise when the bonding tool is raised. In this condition, it is possible that the fine wire tail 17A is completely drawn into the recess of the capillary bonding tool 16 and would not be seen extending therefrom. Usually, when the EFO electrode 18 is fired, no arc will occur. It is entirely possible that an arc will occur especially if a sharp edge is present on the wire tail 17A.
  • FIG. 5 showing a schematic drawing of a capillary bonding tool raised to flame-off position and having a short tail 17B long enough to make some kind of ball when the EFO electrode 18 fires.
  • the tail 17B is sufficiently long to produce a ball, however, the ball is too small to produce a proper first ball bond 12 of proper strength to permit a proper and reliable interconnection if a first ball bond can be made.
  • this condition is sensed, as will be explained in greater detail hereinafter, it is possible to direct the automatic wire bonder to proceed with a bond-off operation in which the improperly sized ball is bonded to a waste area on the device or the lead frame or even a bond-off station provided on the automatic wire bonder.
  • a proper tail length 17 which is used to make a proper size ball 12 and proceed with the routine of wire bonding on the expensive semiconductor device 10. It has been found that a tail of the length shown in FIG. 5 is sufficient to make a ball which will permit a bond-off operation which in turn permits the making of a proper length tail and a proper size ball so that the automatic wire bonding machine can continue in its automatic mode without supervision.
  • a short tail 17A may permit a restart.
  • a scratch pad which is at or near the bonding site is provided onto which a plurality of gold balls have been made and the wire broken just above the ball.
  • the stub 17A is bonded onto one of the previously provided gold balls on the scratch pad and when the ball sticks to the stub tail 17A, it is then possible to make a proper first bond, then make a short interconnection and a second bond which will permit making a proper length tail 17 so that a proper size ball 12 can be made and the automatic wire bonder can proceed making proper wire bond interconnections on the device 10.
  • FIG. 6 showing a schematic drawing of a capillary bonding tool which is raised to flame-off position with the wire tail 17C still attached to the interconnecting wire 13.
  • This condition is known as no-stick-on-lead, where the second bond pulls loose from the lead frame 14, 15.
  • the automatic wire bonder must be stopped because there is a defective interconnection and any further bonding operation may result in destruction of the semiconductor device 10.
  • the automatic wire bonder may be stopped to permit an attendant to break the wire and restart the machine and take the device from the production line so that it may be reworked.
  • Some devices require such high standards that they cannot be properly reworked and when this condition occurs, it is possible to bond-off on the device, make a proper tail and ball and eject the improper bonded device from the automatic bonding machine and to continue bonding. An attendant is informed that the device was improperly bonded so it will not be carried through the production line. Further, it is possible to stop the bonding process and inform the operator and/or take corrective action in case one of the following defects is detected:
  • the tail is not long enough.
  • FIG. 7 showing a schematic diagram of a capillary bonding tool raised to flame-off position where the wire tail 17D is still attached to the second bond 19.
  • a condition of this type occurs when the wire clamps did not properly grip the wire above the capillary and when the capillary and wire clamps were closed and raised to the tail position shown at flame-off.
  • the wire slipped and formed a tail 17D that did not break at second bond. While it is possible to conduct a procedure which would allow the automatic wire bonder to proceed with automatic wire bonding, the condition of the wire clamps which cause this long tail must be corrected, therefore the automatic wire bonder is preferably stopped immediately, leaving the long tail 17D for the attendant to observe as well as the noted condition on the monitor of the display of the automatic wire bonder. This will allow the attendant to make the adjustment to the wire clamps and do several bond-off operations to assure that the wire clamps are properly adjust and in proper working condition before proceeding with automatic wire bonding.
  • FIG. 8 showing a schematic circuit diagram of a preferred embodiment conductivity logic circuit used for monitoring and testing the length of the wire tail.
  • the second bond 19 is made on the conductive coating 15 of the lead 14 leaving the interconnecting wire 13.
  • the capillary 16 is raised to the flame-off height after breaking the wire 21 and leaving a proper tail 17 juxtaposed the EFO electrode 18.
  • the wire clamps 22 are shown in their closed position, however, it will be understood that the conductive wire 21 is engaged against the conductive electrodes so as to present a continuous electrical path to the line 23 through the wire 21 even when open.
  • Line 23 is shown connected to a analog switch 24 which is normally open during continuity testing.
  • the current and voltage for continuity testing through the wire 21 is provided by a D.C.
  • the Z axis processor 36 is provided with software and/or hardware shown as a wire bonder monitoring system logic (WBMS) 37.
  • WBMS wire bonder monitoring system logic
  • the Z axis drive 43 is directly coupled to a Z position encoder 44 and the encoder 44 supplies digital information via line 45 to the Z axis processor 36 which enables the Z axis processor 36 to know the exact position of the bonding capillary 16 at all times during the logical operation of the automatic wire bonder.
  • FIG. 9 showing a voltage wave form 46 taken at line 33.
  • a wave form 47 representing the time the wire clamps 22 are instructed to close by the bonder processor 36.
  • the wire clamps are normally closed.
  • the wire 21 breaks at point 48.
  • the voltage drops to ground reference voltage shown at point 49.
  • the main processor 36 When the break is sensed at point 48, the main processor 36 generates a signal on a line not shown which closes the analog switch 24 which is shown closed at point 49 on wave form 46.
  • FIG. 9 corresponds to the proper tail condition shown in FIGS. 3 and 8.
  • Wave form 54 which is produced at line 33 of FIG. 8.
  • the signal indicating that the wire clamps 22 were instructed to close is shown as wave form 47.
  • Wave form 54 has no wave form 48, 49 as shown in FIG. 9, thus indicating that the wire 22 was not broken at the second bond 19 to produce a tail 17.
  • the bonding tool 16 has been raised to flame-off height, there is still continuity at the time the wire should have broken.
  • the EFO did properly fire as shown by points 52 and 53 on wave form 54 we can properly conclude that the wire did break after the analog switch 24 was closed otherwise the discontinuity shown by points 48 and 49 on wave form 46 would be present on wave form 54.
  • This condition represents a fault which must be attended by the operator and is known as a no-stick on the lead (second bond) condition.
  • the tensioning device is disabled and if the computer 36 senses that a tail of sufficient length is made which would permit a bond-off operation to be performed, then a routine may be entered to perform a second bond.
  • the wave form 55 shows voltage drop at the time the EFO was supposed to fire at points 52, 53, thus, there is no ball. If a short tail is present, it may be bonded to an off site ball.
  • FIG. 13 showing a wave form 58 having a wire break at point 48 before the wire clamps 22 are completely closed and shortly after the wire clamp signal 47 attempts to close the wire clamps.
  • a condition of this type can occur when the wire clamps are marginally open, but are too tight and require readjustment. Even though a ball may be made on the short tail as indicated by the points 52 and 53, this condition requires an operator to make proper readjustment of the wire clamps, thus, the automatic wire bonder is stopped and the condition is signaled on the monitor panel of the automatic wire bonder.
  • Block 59 represents the start of the wire bond monitoring operation after the second bond is made.
  • the zero vertical height Z O of the bonding tool is recorded at second bond.
  • the WBMS logic senses whether the analog switch 24 is open in block 61 and senses if a break has been made. If a break has been made before the wire clamps are closed, this signal is sensed on line 62 and the logic is instructed to stop the wire bonding operation in block 63 because some malfunction has occurred.
  • the switch 24 is open, the sensor is sensing for a break.
  • the wire clamps are closed at tail height in block 64.
  • the tail length L T After calculating the tail length L T , it is now possible to determine if the tail length is within the preset thresholds in block 69 which insure that a proper bond will be made on the tail. If the tail is too long or too short, this condition is sensed on line 71. It is determined whether a bonding tail is present in block 72 which permits the logic 37 to perform a bond-off site bond in block 73. When a new tail of sufficient length is made at bond-off, it may be tested for a successful operation by repeating the process via line 74. If the tail length is within the preset thresholds as sensed on line 75, the EFO parameters may be set in block 76 to make a proper ball. The operation is then continued by firing the EFO to make the ball in block 77.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
US08/038,843 1993-03-29 1993-03-29 Wire bonder tail length monitor Expired - Lifetime US5326015A (en)

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US08/038,843 US5326015A (en) 1993-03-29 1993-03-29 Wire bonder tail length monitor
JP6059248A JPH07106365A (ja) 1993-03-29 1994-03-29 ワイヤボンダのワイヤ尾部長さを監視する装置および方法

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US08/038,843 US5326015A (en) 1993-03-29 1993-03-29 Wire bonder tail length monitor

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Cited By (18)

* Cited by examiner, † Cited by third party
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US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
US5894981A (en) * 1996-11-27 1999-04-20 Orthodyne Electronics Corporation Integrated pull tester with an ultrasonic wire bonder
US6062462A (en) * 1997-08-12 2000-05-16 Kulicke And Soffa Investments, Inc. Apparatus and method for making predetermined fine wire ball sizes
US6085962A (en) * 1997-09-08 2000-07-11 Micron Technology, Inc. Wire bond monitoring system for layered packages
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US6206266B1 (en) * 1997-05-14 2001-03-27 Kabushiki Kaisha Shinkawa Control method for wire bonding apparatus
KR100309129B1 (ko) * 1995-12-01 2001-12-17 박종섭 와이어본딩장치및그를이용한본딩방법
KR100309135B1 (ko) * 1995-11-02 2001-12-17 박종섭 와이어본더의와이어테일제어방법
US6467678B2 (en) * 1999-12-28 2002-10-22 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus
CN100365785C (zh) * 2003-12-23 2008-01-30 三星电子株式会社 用于夹住引线的引线焊接设备和方法
US20100206849A1 (en) * 2005-12-28 2010-08-19 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
CN103972116A (zh) * 2013-01-25 2014-08-06 先进科技新加坡有限公司 导线键合机和校准导线键合机的方法
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
US20150008251A1 (en) * 2013-07-04 2015-01-08 Keng Yew Song Method and apparatus for measuring a free air ball size during wire bonding
US20150200143A1 (en) * 2014-01-15 2015-07-16 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
US20150246411A1 (en) * 2012-11-16 2015-09-03 Shinkawa Ltd. Wire-bonding apparatus and method of wire bonding
US20180151532A1 (en) * 2015-12-25 2018-05-31 Kaijo Corporation Wire bonding apparatus
CN110773409A (zh) * 2018-07-31 2020-02-11 英飞凌科技股份有限公司 用于校准超声键合机的方法

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JP4786500B2 (ja) 2006-10-26 2011-10-05 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100309135B1 (ko) * 1995-11-02 2001-12-17 박종섭 와이어본더의와이어테일제어방법
US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
KR100309129B1 (ko) * 1995-12-01 2001-12-17 박종섭 와이어본딩장치및그를이용한본딩방법
DE19752319C5 (de) * 1996-11-27 2011-02-17 Orthodyne Electronics Corp., Irvine Ultraschall-Drahtbondingvorrichtung mit einer Einrichtung zum Prüfen einer Bondverbindung und Verfahren zum Prüfen einer mittels eines Ultraschall-Drahtbondingwerkzeugs hergestellten Bondverbindung
US5894981A (en) * 1996-11-27 1999-04-20 Orthodyne Electronics Corporation Integrated pull tester with an ultrasonic wire bonder
US6206266B1 (en) * 1997-05-14 2001-03-27 Kabushiki Kaisha Shinkawa Control method for wire bonding apparatus
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
US6062462A (en) * 1997-08-12 2000-05-16 Kulicke And Soffa Investments, Inc. Apparatus and method for making predetermined fine wire ball sizes
US6085962A (en) * 1997-09-08 2000-07-11 Micron Technology, Inc. Wire bond monitoring system for layered packages
US6467678B2 (en) * 1999-12-28 2002-10-22 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus
CN100365785C (zh) * 2003-12-23 2008-01-30 三星电子株式会社 用于夹住引线的引线焊接设备和方法
US20100206849A1 (en) * 2005-12-28 2010-08-19 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US7857190B2 (en) * 2005-12-28 2010-12-28 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
US20150246411A1 (en) * 2012-11-16 2015-09-03 Shinkawa Ltd. Wire-bonding apparatus and method of wire bonding
US9457421B2 (en) * 2012-11-16 2016-10-04 Shinkawa Ltd. Wire-bonding apparatus and method of wire bonding
CN103972116A (zh) * 2013-01-25 2014-08-06 先进科技新加坡有限公司 导线键合机和校准导线键合机的方法
CN103972116B (zh) * 2013-01-25 2017-04-12 先进科技新加坡有限公司 导线键合机和校准导线键合机的方法
US10163845B2 (en) * 2013-07-04 2018-12-25 Asm Technology Singapore Pte Ltd Method and apparatus for measuring a free air ball size during wire bonding
CN104282591A (zh) * 2013-07-04 2015-01-14 先进科技新加坡有限公司 用于在导线键合过程中测量无空气球尺寸的方法和装置
US20150008251A1 (en) * 2013-07-04 2015-01-08 Keng Yew Song Method and apparatus for measuring a free air ball size during wire bonding
US9165842B2 (en) * 2014-01-15 2015-10-20 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
US20150200143A1 (en) * 2014-01-15 2015-07-16 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
US20180151532A1 (en) * 2015-12-25 2018-05-31 Kaijo Corporation Wire bonding apparatus
US11302667B2 (en) 2015-12-25 2022-04-12 Kaijo Corporation Method of vertically vibrating a bonding arm
CN110773409A (zh) * 2018-07-31 2020-02-11 英飞凌科技股份有限公司 用于校准超声键合机的方法
CN110773409B (zh) * 2018-07-31 2021-11-05 英飞凌科技股份有限公司 用于校准超声键合机的方法
US11646291B2 (en) 2018-07-31 2023-05-09 Infineon Technologies Ag Method for calibrating an ultrasonic bonding machine

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