US4829658A - Method for manufacturing terminal contacts for thin-film magnetic heads - Google Patents

Method for manufacturing terminal contacts for thin-film magnetic heads Download PDF

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Publication number
US4829658A
US4829658A US07/221,532 US22153288A US4829658A US 4829658 A US4829658 A US 4829658A US 22153288 A US22153288 A US 22153288A US 4829658 A US4829658 A US 4829658A
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US
United States
Prior art keywords
layer
substrate
permalloy
magnetic heads
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07/221,532
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English (en)
Inventor
Alfred Pichler
Joachim Hertrampf
Horst Pachonik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
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Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT, MUNICH A CORP. OF GERMANY reassignment SIEMENS AKTIENGESELLSCHAFT, MUNICH A CORP. OF GERMANY ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: HERTRAMPF, JOACHIM, PACHONIK, HORST, PICHLER, ALFRED
Application granted granted Critical
Publication of US4829658A publication Critical patent/US4829658A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49043—Depositing magnetic layer or coating
    • Y10T29/49044—Plural magnetic deposition layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/4906—Providing winding
    • Y10T29/49064—Providing winding by coating

Definitions

  • the present invention is directed to a method for manufacturing terminal contacts for thin-film magnetic heads on a substrate that is subdivided along parting lines into individual substrate elements each having two write/read heads.
  • the substrate surface is covered surface-wide with an electrically conductive permalloy layer that has a plurality of contact locations each having contact lugs directed toward the magnetic head and is structured by ion beam etching.
  • the structured permalloy layer is covered surface-wide with a protective layer of aluminum oxide except for the contact locations that are provided with an electro-deposited gold film for the attachment of a bonding wire.
  • the manufacture of terminal contact locations as used, for example, in integrated circuit technology is a technological process step having product-associated as well as manufacture-conditioned features.
  • it is standard in thin-film head technology to photolithographically generate terminal contacts of copper on a substrate having a plurality of integrated magnetic heads. It is particularly important to fashion the terminal contacts such that, first, the magnetic heads, which are buried under an aluminum oxide protective layer, can be tested after their large-area integration on the substrate and, second, the terminal contacts can be manufactured in a cost-effective way and can be easily bonded.
  • a method for manufacturing thin-film magnetic heads is possible wherein contact windows are formed in a protective layer of aluminum oxide that is about 50 ⁇ m thick with a chemically soluble location holder at the end of the photolithographic process. After the contact windows have been exposed in the protective layer, the exposed contact surface is gold-plated by a cover gold layer which is applied surface-wide to the substrate. Before bonding, the gold cover layer in the region of the exposed gold-plated contact surfaces is again removed and a bonding needle having a bonding wire is subsequently brought into the contact window.
  • Critical disadvantages of the described method lie therein. First, the surface-wide application of the gold coat is uneconomical and, second, the adjustment of the bonding wire in extremely small contact windows is difficult. Adjusting the bonding wire is difficult because the walls of the contact windows are frequently contacted when adjusting and, thus, an increased risk of failure of the thin-film magnetic heads results.
  • this object is inventively achieved in a method in which: together with the masking of the electrically conductive permalloy layer of the substrate, interconnects are simultaneously defined that short the contact lugs; the masked permalloy layer is covered with a photoresist layer and contact windows that expose the permalloy layer are formed in this photoresist layer at contact locations by an exposure and development process; a copper layer is electrolytically applied over the exposed permalloy layer in the contact windows, the layer thickness of this copper layer being smaller than that of the photoresistive layer; the residues of the photoresistive layer are again removed from the electrically conductive permalloy layer and this being subsequently structured; the protective aluminum oxide layer is first applied surface-wide over the permalloly layer structured in this fashion, including the copper layer, and is subsequently mechanically eroded to such an extent that the remaining residues of the protective layer form a flush surface with a copper layer; this surface is cleaned and
  • This solution is particularly distinguished in that the manufacture of terminal contacts for thin-film magnetic heads on individual substrate elements of a substrate wafer begins before a laser structuring process for the magnetic heads in terms of the chronological execution of the process; i.e., when an electrically conductive permalloy layer is still present surface-wide and a metallic mask is already completely structured.
  • contact lugs and interconnects are defined on the individual substrate element that has two write/read heads, these contact lugs and interconnects being directed toward the middle or, to a parting line of the substrate element. The interconnects and contact lugs thereby form a short-circuit on the permalloy layer.
  • the solution of the invention thus has the advantage that the complexity of large-area integration of thin-film magnetic heads on a substrate is significantly reduced and the gold consumption is restricted to a necessary minimum.
  • FIG. 1 is a plan view of a structure/substrate wafer subdivided into substrate elements
  • FIG. 2 is a plan view of the fundamental structure of an individual substrate element having two shorted terminal contacts for a thin-film magnetic head;
  • FIGS. 3 through 6 are cross-sectional views depicting the photolithographic manufacture of reinforced terminal contacts on a substrate provided with a permalloy layer.
  • FIG. 1 also shows the schematic division of the wafer surface into individual substrate elements 2.
  • FIG. 2 shows the fundamental structure of a substrate element 2 in an enlarged illustration.
  • the substrate element 2 contains two magnetic heads 20 arranged on an integrating area 3.
  • a respective pair of contact lugs 21 is connected to the magnetic heads and are arranged symmetrically relative to the vertical axis of the substrate element. These contact lugs 21 proceed parallel in pairs and are directed in the direction toward the center of the substrate element 2. Every contact lug 21 has a contact reinforcement 22 at its free end.
  • FIG. 2 further, shows interconnects 23 that short the contact lugs or the magnetic heads 20 on the substrate element 2.
  • One part of the interconnects 23 proceeds on an opposed side of parting lines 24 along which the substrate is divided into the individual substrate elements.
  • FIG. 3 An exemplary embodiment for photolithographic manufacture of reinforced, coherent terminal contacts for thin-film magnetic heads on a substrate 10 is set forth with reference to FIGS. 3 through 6.
  • an electrically conductive permalloy layer 11 is electro-deposited surface-wide onto the substrate 10.
  • the interconnects 23 are simultaneously defined with a metallic mask 12 needed for the structuring of the permalloy layer 11.
  • a photo film 13 that is about 50 ⁇ m thick is subsequently applied over the permalloy layer 11 or over the metallic mask 12. This photo film 13 is in turn entirely removed at contact locations 220 for the contact reinforcements 22, being removed by an exposure and development process.
  • a contact window 221 exposing the permalloy layer 11 serves for the following process step shown in FIG. 4.
  • a copper layer 222 is electro-deposited onto the exposed permalloy layer 11 in the contact window, the thickness of this copper layer 222 being smaller than that of the photo film 13. Then the remaining residues of the photo film 13 still present on the permalloy layer 11, or on the metallic mask 12 are removed and the exposed, masked permalloy layer is converted into a structured permalloy layer 110 by ion beam etching (see FIG. 5).
  • FIG. 5 shows the following integration phase, the application of a protective aluminum oxide layer 14 that covers both the structured permalloy layer as well as the copper layer surface-wide.
  • the transition from FIG. 5 to FIG. 6 is characterized in that the applied protective layer is eroded by lapping to such an extent that a flush surface with the copper layer is produced.
  • a gold film 223 is electro-deposited onto the contact locations 220 on the copper layer 222, this gold film 223 being required for the later bonding of a bond wire 224.
  • the photolithographic process sequence for the substrate is ended in this condition. Only now is the substrate cut along the parting lines 24 shown in FIG. 2 and, thus, the short circuit between the contact lugs 21 is eliminated, this having been necessary for the electro-deposition of the gold film. This cutting of the susbstrate now allows testing of the integrated magnetic heads on the substrate before the expensive, mechanical processing.
  • the described method has the advantage that a galvanic build-up for the reinforced terminal contacts of thin-film magnetic heads is possible by the temporary shorting of interconnects and contact lugs without using an additional, metallic carrier layer as a galvanic underlaymant for the gold film. This results in reducing the technological requirements in the large-area, photolithographic manufacture of terminal contacts for magnetic heads.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Magnetic Heads (AREA)
US07/221,532 1987-09-24 1988-07-19 Method for manufacturing terminal contacts for thin-film magnetic heads Expired - Fee Related US4829658A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3732207 1987-09-24
DE3732207 1987-09-24

Publications (1)

Publication Number Publication Date
US4829658A true US4829658A (en) 1989-05-16

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US (1) US4829658A (fr)
EP (1) EP0308818A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6170149B1 (en) * 1996-04-30 2001-01-09 Fujitsu Limited Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same
US7469468B1 (en) * 2002-04-05 2008-12-30 Maxtor Corporation Methods of slider-level reader isolation measurement technique for advanced GMR heads
US20160073497A1 (en) * 2013-05-23 2016-03-10 Byd Company Limited Circuit board and method for fabricating the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100191A (nl) * 1991-02-04 1992-09-01 Philips Nv Werkwijze voor het vervaardigen van een magneetkop en magneetkop vervaardigd volgens de werkwijze.
CA3050630A1 (fr) 2017-02-01 2018-08-09 Clinuvel Pharmaceuticals Ltd Analogues d'alpha-msh utilises dans le traitement du xeroderma pigmentosum

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3132452A1 (de) * 1981-08-17 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer nach dem galvanischen aufbau von metallischen strukturen planaren strukturebene
US4613404A (en) * 1984-11-16 1986-09-23 Fuji Photo Film Co., Ltd. Materials which exhibit a surface active effect with vacuum baked photoresists and method of using the same
US4652954A (en) * 1985-10-24 1987-03-24 International Business Machines Method for making a thin film magnetic head
US4759118A (en) * 1986-05-08 1988-07-26 Alps Electric Co., Ltd. Method of manufacturing thin film magnetic head

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3132452A1 (de) * 1981-08-17 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer nach dem galvanischen aufbau von metallischen strukturen planaren strukturebene
US4613404A (en) * 1984-11-16 1986-09-23 Fuji Photo Film Co., Ltd. Materials which exhibit a surface active effect with vacuum baked photoresists and method of using the same
US4652954A (en) * 1985-10-24 1987-03-24 International Business Machines Method for making a thin film magnetic head
US4759118A (en) * 1986-05-08 1988-07-26 Alps Electric Co., Ltd. Method of manufacturing thin film magnetic head

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6170149B1 (en) * 1996-04-30 2001-01-09 Fujitsu Limited Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same
US7469468B1 (en) * 2002-04-05 2008-12-30 Maxtor Corporation Methods of slider-level reader isolation measurement technique for advanced GMR heads
US20160073497A1 (en) * 2013-05-23 2016-03-10 Byd Company Limited Circuit board and method for fabricating the same
US9974171B2 (en) * 2013-05-23 2018-05-15 Byd Company Limited Circuit board and method for fabricating the same

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EP0308818A1 (fr) 1989-03-29

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AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, MUNICH A CORP. OF GERM

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:PICHLER, ALFRED;HERTRAMPF, JOACHIM;PACHONIK, HORST;REEL/FRAME:004926/0586

Effective date: 19880705

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Expired due to failure to pay maintenance fee

Effective date: 19930516

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362