US4433805A - Soldering method for electric and or electronic components - Google Patents

Soldering method for electric and or electronic components Download PDF

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Publication number
US4433805A
US4433805A US06/290,340 US29034081A US4433805A US 4433805 A US4433805 A US 4433805A US 29034081 A US29034081 A US 29034081A US 4433805 A US4433805 A US 4433805A
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US
United States
Prior art keywords
soldering
molten solder
inert gas
compressed air
pool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/290,340
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English (en)
Inventor
Akira Kanno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Group Corp
Original Assignee
Aiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiwa Co Ltd filed Critical Aiwa Co Ltd
Assigned to AIWA CO., LTD. reassignment AIWA CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: KANNO, AKIRA
Application granted granted Critical
Publication of US4433805A publication Critical patent/US4433805A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Definitions

  • the present invention relates to a method for soldering electric and or electronic components to a printed circuit board using a pool of molten solder, and more particularly, to a soldering method of a type wherein the soldering is effected under action of bubbles formed in a pool of molten solder.
  • a main object of the present invention is to provide a novel soldering method eliminating disadvantages as described hereinbefore.
  • Another object of the present invention is to provide a soldering method for soldering to a printed circuit board, electric and/or electronic components temporarily fixed thereto by blowing air into a pool of molten solder and by striking air bubbles against the board and the components during soldering operation.
  • This object is achieved by providing a soldering method wherein during soldering operation, air bubbles are formed in the pool of molten solder by blowing, compressed air thereinto and the air bubbles strike against the printed circuit board and the components temporarily fixed thereto which are conveyed along the top of the molten solder to effect soldering of the board and the components to each other. After soldering, inert gas is introduced into the molten solder to minimize its oxidation.
  • FIG. 1 is a transverse cross-sectional view showing a preferred embodiment of a soldering apparatus suitable to carry out a soldering method according to the present invention.
  • FIG. 2 is a longitudinal cross-sectional view of the soldering apparatus as shown in FIG. 1.
  • a bubble type pool of molten solder 10 which comprises a nozzle unit 12 disposed in the pool of molten solder for blowing gases thereinto.
  • the nozzle unit 12 is connected to a pipe 14 at its forward end and, at the other end, the pipe 14 is connected to an air supply line 16 and an inert gas supply line 18 which are connected to a source of compressed air 20 and a gas cylinder 22 containing inert gas such as nitrogen gas, respectively.
  • the air supply line 16 includes regulator 24 for regulating flow of the compressed air from the source 20 and an electromagnetic valve 26 for controlling supply of the compressed air through the pipe 14 to the nozzle unit 12.
  • the inert gas supply line 18 includes a regulator 28 for regulating flow of the inert gas from the cylinder 22 and an electromagnetic valve 30 for controlling supply of the inert gas through the pipe 14 to the nozzle unit 12.
  • Printed circuit board 32 having electric and/or electronic components 34, including chip type components, temporarily fixed thereto are conveyed along the top of the pool of molten solder 10, following a path as indicated by arrows a, b, c, d and e in FIG. 2 of the drawings.
  • a device 36 is provided for detecting a position b of the circuit board 32 approaching the top of the molten solder before soldering and a position d of the board 32 leaving from the top of the molten solder after soldering to electrically actuate the electromagnetic valves 26 and 30.
  • the electromagnetic valve 26 is opened to supply the compressed air from its source 20 to the nozzle unit 12 whereas the electromagnetic valve 30 is closed.
  • the electromagnetic valve 26 is closed whereas the electromagnetic valve 30 is opened to supply the inert gas from its cylinder 22 to the nozzle unit 12.
  • the soldering apparatus is operated as follows:
  • detecting device 36 electrically senses the board 32 at position b to actuate the electromagnetic valve 26 from its closed position to an open position while keeping the electromagnetic valve 30 closed. Then, compressed air from the air supply line 16 and pipe 14 is blown through the nozzle unit 12 into the molten solder to form air bubbles 38 which rapidly rise toward the top of the molten solder.
  • the rising air bubbles strike against the printed circuit board 32 with the chip components 34 temporarily bonded thereto, which is conveyed from the approaching position b to a soldering position c where the chip components 34 are uniformely soldered to the circuit board 32 under the action of the rising air bubbles 38 without reading out any molten solder through apertures (not shown) in the board.
  • the board 32 is conveyed from the soldering position c to the leaving position d where the detecting device 36 electrically senses existance of the board 32 to close the valve 26 for interruption of the supply of air and to open the valve 30 for introduction of insert gas from its cylinder 22 through the gas supply line 18, pipe 14 and nozzle unit 12 into the molten solder.
  • the introduction of the inert gas into the molten solder causes any air remaining in the pipe 14 to expel out of the pipe 14 and the nozzle unit 12 thereby preventing the molten solder from being oxidized in the nozzle unit 12 and removing any solder dross accumulated on the nozzle unit 12.
  • the valve 30 is closed for interruption of the supply of the inert gas by actuating it through a timer (not shown) in the detecting device 36.
  • introduction of the inert gas into the molten solder may be continued until air begins to be blown into the molten solder for soldering.
  • soldering method for soldering to a printed circuit board, electric and/or electronic components temporarily fixed thereto using a bubble type pool of molten solder, wherein compressed air is introduced into the molten solder during soldering to form air bubbles which rapidly rise in the molten solder toward its top, the rising bubbles strike against the board and components to solder them together, and after soldering, the supply of air is interrupted while inert gas is introduced into the molten solder.
  • production of undesirable solder dross can be reduced by blowing air into the molten solder for a short time to be required for soldering.
  • any air remaining in the pipe and the nozzle unit after interruption of the supply of air thereto is expelled into the molten solder by introducing the inert gas through the pipe and the nozzle unit into the molten solder to minimize production of undesirable solder dross in the nozzle unit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
US06/290,340 1981-04-10 1981-08-05 Soldering method for electric and or electronic components Expired - Lifetime US4433805A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP56-53040 1981-04-10
JP56053040A JPS57169295A (en) 1981-04-10 1981-04-10 Method of soldering electric part or like

Publications (1)

Publication Number Publication Date
US4433805A true US4433805A (en) 1984-02-28

Family

ID=12931769

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/290,340 Expired - Lifetime US4433805A (en) 1981-04-10 1981-08-05 Soldering method for electric and or electronic components

Country Status (2)

Country Link
US (1) US4433805A (enrdf_load_stackoverflow)
JP (1) JPS57169295A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523708A (en) * 1982-06-02 1985-06-18 Institute Po Metaloznanie I Technologia Na Metalite Apparatus for soldering the winding to the commutator of an electric machine
US4540114A (en) * 1982-04-02 1985-09-10 Zevatron Gmbh Gesellschaft Fur Fertigungseinrichtungen Der Elektronik Apparatus for soldering workpieces
US5509598A (en) * 1994-05-31 1996-04-23 The Boc Group, Inc. Wave soldering apparatus and process

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
US3874068A (en) 1972-01-19 1975-04-01 Dynamics Corp America Wave soldering electrical connections
US4019671A (en) 1975-03-14 1977-04-26 Bbc Brown Boveri & Company Limited Method for dip-soldering semiconductor components
US4375271A (en) 1980-08-01 1983-03-01 Aiwa Co., Ltd. Soldering method for electric and or electronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122877A (ja) * 1984-07-10 1986-01-31 横山　雅雄 竹刀

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
US3874068A (en) 1972-01-19 1975-04-01 Dynamics Corp America Wave soldering electrical connections
US4019671A (en) 1975-03-14 1977-04-26 Bbc Brown Boveri & Company Limited Method for dip-soldering semiconductor components
US4375271A (en) 1980-08-01 1983-03-01 Aiwa Co., Ltd. Soldering method for electric and or electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4540114A (en) * 1982-04-02 1985-09-10 Zevatron Gmbh Gesellschaft Fur Fertigungseinrichtungen Der Elektronik Apparatus for soldering workpieces
US4523708A (en) * 1982-06-02 1985-06-18 Institute Po Metaloznanie I Technologia Na Metalite Apparatus for soldering the winding to the commutator of an electric machine
US5509598A (en) * 1994-05-31 1996-04-23 The Boc Group, Inc. Wave soldering apparatus and process

Also Published As

Publication number Publication date
JPS6231839B2 (enrdf_load_stackoverflow) 1987-07-10
JPS57169295A (en) 1982-10-18

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