US4367115A - Device for controlling a panel press for the assembly of _multilayer printed circuit boards - Google Patents

Device for controlling a panel press for the assembly of _multilayer printed circuit boards Download PDF

Info

Publication number
US4367115A
US4367115A US06/310,929 US31092981A US4367115A US 4367115 A US4367115 A US 4367115A US 31092981 A US31092981 A US 31092981A US 4367115 A US4367115 A US 4367115A
Authority
US
United States
Prior art keywords
switchover
pressure
count
press
panel press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/310,929
Other languages
English (en)
Inventor
Hans Bohn
Wolfgang Stein
Peter Bernsau
Fred Staubitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROBERTBURKLE & Co GmbH
Robert Buerkle GmbH
Original Assignee
Robert Buerkle GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Buerkle GmbH filed Critical Robert Buerkle GmbH
Assigned to ROBERTBURKLE GMBH & CO. reassignment ROBERTBURKLE GMBH & CO. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BERNSAU, PETER, BOHN, HANS, STAUBITZER, FRED, STEIN, WOLFGANG
Application granted granted Critical
Publication of US4367115A publication Critical patent/US4367115A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B32B38/004—Heat treatment by physically contacting the layers, e.g. by the use of heated platens or rollers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the present invention relates to equipment for the production of printed circuit board and, more particularly, to a device for controlling the pressing action of a panel press with reference to the flux point of thermosetting resinous bonding layers in connection with the assembly of multilayer printed circuit boards.
  • the production of multilayer printed circuit boards involves the assembly of a stack of circuit boards, in alternation with resinous bonding layers and the application to the stack of controlled heat and pressure by means of a heated panel press.
  • the latter is preferably a multi-stage press suitable for the simultaneous production of a number of multilayer printed circuit boards.
  • the application of controlled heat to the resinous bonding layers results in a succession of physical and chemical changes in the resin, beginning with a plastification process which reaches a flux point at which the bonding layer has a minimal viscosity and a high wetting factor for good adhesion.
  • the resin undergoes a polycondensation process, as a result of which it gels and rapidly increases in its viscosity.
  • the resin now undergoes a curing phase, at the end of which it is transformed into a permanently hardened, rigid state.
  • a moderate contact pressure, or heat transfer pressure is applied during the major part of the heat buildup phase, and a much higher curing pressure is applied in the latter part of the curing phase and during at least an initial portion of the cooling phase.
  • the selection of the point in time at which the full curing pressure is applied to the multilayer stack is crucial for the production quality, in terms of the permanent physical characteristics obtained in the interface between the printed circuit boards and the intermediate bonding layers.
  • the switchover from the contact pressure to the curing pressure should take place with a predetermined delay from the point at which the flux point has been reached.
  • the timing of the switchover therefore, rests on a reliable determination of the flux point during the pressing operation.
  • the prior art experimental setup also addresses itself to a source of distortion in the displacement values of the compression graph, distortions which are the result of thermal expansion of the press parts.
  • the report suggests the tracing of a corrective compression graph with a set of non-compressible, fully hardened multilayers, under identical operating conditions.
  • Underlying the present invention is the objective of devising an improvement in the pressure control system of a heated panel press in the form of a device which makes possible the automatic switchover of the press operation from a contact pressure mode to a curing pressure mode, in response to a predetermined compression displacement of the multilayer stacks which is reflective of the attainment of the flux state.
  • the present invention proposes to attain this objective by suggesting a switchover control device which is adapted for use with the pressure control unit of a hydraulically driven heated panel press which includes a displacement transducer producing displacement pulses, a pulse counting unit, a count comparator unit producing a threshold signal, and a signal delaying unit feeding the threshold signal to a pressure switchover circuit in the pressure control unit.
  • the displacement transducer is carried by the upper press plate, reading the upward displacements of the press table and producing displacement pulses which reflect discrete displacement increments.
  • the operation of the pulse counting unit is controlled by the pressure control unit of the press which sends a count initiation signal, following the receipt of a pressure feedback signal indicating that the contact pressure mode has been established.
  • the invention further suggests the use of a direction discriminator in conjunction with the pulse counting unit, for the purpose of eliminating from the pulse count any reverse displacement pulses received from the displacement transducer.
  • the count comparator has a comparison circuit which allows for the adjustment of a threshold value or trigger count, at the attainment of which the comparator produces the threshold signal.
  • the time delay produced by the signal delaying unit is likewise adjustable.
  • the drawing shows schematically a heated panel press 10 with a vertically movable lower press plate or press table 11 and a stationary upper press plate 12 engaging and compressing between them a multilayer stack of printed circuit boards 15.
  • a hydraulic press cylinder 13 carries the press table 11, forcing it upwards and thereby creating at least two different pressure modes, while heat is supplied to the multilayer stack 15 via the plates which compress it.
  • the panel press is a multi-stage press having several vertically movable plates in addition to the press table and the stationary top plate, so as to form a number of press gaps, each receiving a multilayer stack.
  • a method and device for producing multilayer printed circuit boards in a duplex multi-stage panel press are disclosed in our copending U.S. patent application, Ser. No. 298,722, filed Sept. 2, 1981.
  • the level of pressure generated by the hydraulic press cylinder 13 is determined by a pressure control unit 60 and its pressure control connection 62.
  • a pressure feedback connection 63 links a suitable pressure transducing device (not shown) to the pressure control unit 60.
  • a flux monitoring and pressure switchover circuit 80 To the panel press 10 and its pressure control unit 60 is connected a flux monitoring and pressure switchover circuit 80, the function of which is to determine the point in time at which the resinous bonding layers in the multilayer stack 15 have reached the flux point and, at a predetermined point later, to signal to the pressure control unit 60 to switch from a contact pressure mode to a curing pressure mode in which a maximum level of pressure is applied to the multilayer stack 15, while the latter cures and hardens.
  • the panel press has attached to one of its plates 11 or 12 a displacement transducer 20 which produces displacement pulses reflecting increments of vertical movement of the other plate relative to the transducer-carrying plate.
  • a pulse line 21 transmits the displacement pulses to a pulse counting unit 30.
  • the latter is also connected to the pressure control unit 60 by a counter startup line 61 through which it receives a starting signal for the count, as soon as the pressure control unit 60 receives information from its feedback connection 63 that the contact pressure mode has been established.
  • the pulse counting unit 30 adds up all the displacement pulses received during the counting cycle, beginning with the receipt of the count starting signal from the pressure control unit 60.
  • the size of the count is expressed in a correspondingly changing count signal which is transmitted from the counting unit 30 to a comparator unit 40, via the counter exit line 31.
  • a direction discriminator 35 which eliminates from the pulse count those displacement pulses which result from an opening movement of the press plate. Such reverse displacements may be produced by the thermal conditions of the press plates themselves.
  • the comparator unit 40 has stored in it a threshold count N F which is preadjusted in accordance with an empirically determined height reduction of the multilayer stack under the contact pressure, when the resin of its bonding layers has reached the flux point. As soon as the count signal from the pulse counting unit equals the threshold count, it triggers in the comparator unit a switchover signal which is transmitted to the signal delaying unit 50, via the comparator exit line 32.
  • the signal delaying unit 50 upon receiving a switchover signal from the comparator unit 40, transmits this signal with a predetermined delay ⁇ t to the pressure control unit 60, via the signal connection 33.
  • the amount of delay ⁇ t which is applied to the switchover signal is likewise preadjusted in accordance with empirically established data. These data depend, of course, on the specific material characteristics of the bonding layers which are used in the multilayer stacks.
  • the receipt of the switchover signal by the pressure control unit 60 initiates a change in the pressing action of the panel press 10, the pressure being increased from the comparatively low contact pressure to an elevated curing pressure.
  • the proposed flux monitoring and pressure switchover circuit 80 consisting of the displacement transducer 20, the pulse counting unit 30 with direction discriminator 35, the comparator unit 40, and the signal delaying unit 50, preferably employ only solid state components in an integrated circuit arrangement, thus making is possible for the switchover control device to take the form of a small accessory unit which is attachable to the heated panel press.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
US06/310,929 1980-10-10 1981-10-13 Device for controlling a panel press for the assembly of _multilayer printed circuit boards Expired - Fee Related US4367115A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3038288A DE3038288C1 (de) 1980-10-10 1980-10-10 Vorrichtung zur Erfassung des Fliesspunktes von Harzlaminaten bei der Herstellung von Mehrschichtleiterplatten
DE3038288 1980-10-10

Publications (1)

Publication Number Publication Date
US4367115A true US4367115A (en) 1983-01-04

Family

ID=6114073

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/310,929 Expired - Fee Related US4367115A (en) 1980-10-10 1981-10-13 Device for controlling a panel press for the assembly of _multilayer printed circuit boards

Country Status (3)

Country Link
US (1) US4367115A (de)
EP (1) EP0049828B1 (de)
DE (1) DE3038288C1 (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499821A (en) * 1984-02-23 1985-02-19 Clouston John L System for immobilizing a plywood press platen during a press cycle
WO1990013425A1 (en) * 1989-05-08 1990-11-15 American Composite Technology Inc. System and method for monitoring pressure during the production of fiber reinforced polymers
US5496433A (en) * 1992-03-27 1996-03-05 Hitachi Techno Engineering Co., Ltd. Hot press for use in production of multilayered substrate
US5578159A (en) * 1993-06-29 1996-11-26 Hitachi Techno Engineering Co., Ltd. Hot press for producing multilayer circuit board
US5673615A (en) * 1994-11-29 1997-10-07 Komatsu Ltd. Slide control method in a hydraulic press
US5772565A (en) * 1995-08-30 1998-06-30 Automated Packaging Systems, Inc. Heat sealer
US20090125141A1 (en) * 2005-11-29 2009-05-14 Takahiro Noda Working apparatus and working method for circuit board
US20170354043A1 (en) * 2016-06-03 2017-12-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3343745A1 (de) * 1983-12-02 1985-06-13 Siemens AG, 1000 Berlin und 8000 München Mehrlagenschaltungen aus thermoplast-kupfer-verbund
US8101196B2 (en) 2001-06-26 2012-01-24 Biointeractions, Ltd. Polysaccharide biomaterials and methods of use thereof
CN101672745B (zh) * 2009-10-14 2012-09-05 攀钢集团攀枝花钢钒有限公司 一种模拟冷轧钢卷径向弹性模量的试验方法
US9567357B2 (en) 2011-06-24 2017-02-14 Biointeractions Ltd. Biocompatible, biomimetic ampholyte materials
WO2014174237A1 (en) 2013-04-26 2014-10-30 Biointeractions Limited Bioactive coatings

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925139A (en) * 1974-01-10 1975-12-09 Package Machinery Co Seal monitoring apparatus
US3935053A (en) * 1969-04-24 1976-01-27 Photocircuits Corporation Process for preparing thermosetting laminates
US3979248A (en) * 1975-09-12 1976-09-07 Images De Luxe, Inc. Decal transfer press
US4264394A (en) * 1978-12-18 1981-04-28 Taihei Industries Co., Ltd. Thermal stamping device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276131A (en) * 1965-04-09 1966-10-04 Clayton W Hahn Linear measuring device
FR2087245A5 (de) * 1970-05-12 1971-12-31 Sagem
US3712125A (en) * 1970-09-25 1973-01-23 Koehring Co Load simulation system
GB1443445A (en) * 1973-04-10 1976-07-21 Wirsbo Bruks Ab Determination of the degree of crosslinking in a polyolefin length

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3935053A (en) * 1969-04-24 1976-01-27 Photocircuits Corporation Process for preparing thermosetting laminates
US3925139A (en) * 1974-01-10 1975-12-09 Package Machinery Co Seal monitoring apparatus
US3979248A (en) * 1975-09-12 1976-09-07 Images De Luxe, Inc. Decal transfer press
US4264394A (en) * 1978-12-18 1981-04-28 Taihei Industries Co., Ltd. Thermal stamping device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499821A (en) * 1984-02-23 1985-02-19 Clouston John L System for immobilizing a plywood press platen during a press cycle
WO1990013425A1 (en) * 1989-05-08 1990-11-15 American Composite Technology Inc. System and method for monitoring pressure during the production of fiber reinforced polymers
US5496433A (en) * 1992-03-27 1996-03-05 Hitachi Techno Engineering Co., Ltd. Hot press for use in production of multilayered substrate
US5578159A (en) * 1993-06-29 1996-11-26 Hitachi Techno Engineering Co., Ltd. Hot press for producing multilayer circuit board
US5673615A (en) * 1994-11-29 1997-10-07 Komatsu Ltd. Slide control method in a hydraulic press
US5772565A (en) * 1995-08-30 1998-06-30 Automated Packaging Systems, Inc. Heat sealer
US20090125141A1 (en) * 2005-11-29 2009-05-14 Takahiro Noda Working apparatus and working method for circuit board
US7809461B2 (en) * 2005-11-29 2010-10-05 Panasonic Corporation Working apparatus and working method for circuit board
US20170354043A1 (en) * 2016-06-03 2017-12-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
US10285283B2 (en) * 2016-06-03 2019-05-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
US11044819B2 (en) 2016-06-03 2021-06-22 International Business Machines Corporation Heating of printed circuit board core during laminate cure

Also Published As

Publication number Publication date
EP0049828A1 (de) 1982-04-21
EP0049828B1 (de) 1985-07-17
DE3038288C1 (de) 1982-04-08

Similar Documents

Publication Publication Date Title
CN1061931C (zh) 一种注塑机的注塑方法
US4378717A (en) Circuit arrangement for an adjusting drive for a press ram adjustment
US4399100A (en) Automatic process control system and method for curing polymeric materials
US4238431A (en) Method for the production of tablets and a tablet press
CN1047236C (zh) 确定铸造工厂造型材料的造型技术性能的方法和装置
EP0359830B1 (de) Formmaschine zum spritzprägen und formverfahren durch verwendung derselben
WO1989009125A1 (fr) Procede et dispositif de moulage destines a etre utilises par une machine de moulage par injection-compression
JP3534326B2 (ja) 油圧プレスのスライド制御方法
EP0049828B1 (de) Vorrichtung zur Erfassung des Fliesspunktes von Harzlaminaten bei der Herstellung von Mehrschichtleiterplatten
US4112999A (en) Conveyor control system
EP2310845A1 (de) Härtungsmessung
US3667884A (en) Control apparatus for injection molding press
US4447198A (en) Hydraulic refractory press including product thickness or density control means
US4844847A (en) Method and apparatus for controlling injection molding machines
JP2916946B2 (ja) 加圧鋳造における加圧ピン制御方法およびその装置
US2508301A (en) Apparatus for pressing records
JP3144609B2 (ja) 成形装置の圧力制御システムおよびこれに係わるガラスレンズ成形方法
US5980794A (en) Method of controlling compacting by measuring hydraulic fluid
US4549269A (en) Methods and apparatus for making prevailing torque nuts
JPS6038117A (ja) 熱硬化性樹脂材料の成形進行状態の検知方法及びこの検知方法を用いた成形制御方法並びに成形装置
JP2838329B2 (ja) 成形機の型締制御装置
JPH0970699A (ja) プレス装置
US3550204A (en) Dimensional control system
US4563744A (en) Apparatus for adjusting starting positions of high speed injection
JP2704422B2 (ja) 射出成形装置における成形品の良否判別方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: ROBERTBURKLE GMBH & CO. STUTTGARTER STRASSE 123-12

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:BOHN, HANS;STEIN, WOLFGANG;BERNSAU, PETER;AND OTHERS;REEL/FRAME:003935/0111

Effective date: 19810210

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M170); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 19910106