US4191603A - Making semiconductor structure with improved phosphosilicate glass isolation - Google Patents

Making semiconductor structure with improved phosphosilicate glass isolation Download PDF

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Publication number
US4191603A
US4191603A US05/901,901 US90190178A US4191603A US 4191603 A US4191603 A US 4191603A US 90190178 A US90190178 A US 90190178A US 4191603 A US4191603 A US 4191603A
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US
United States
Prior art keywords
layer
phosphosilicate glass
polysilicon
psg
polysilicon material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US05/901,901
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English (en)
Inventor
Paul L. Garbarino
Martin Revitz
Joseph F. Shepard
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International Business Machines Corp
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International Business Machines Corp
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Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US05/901,901 priority Critical patent/US4191603A/en
Priority to CA322,415A priority patent/CA1115856A/en
Priority to EP79100950A priority patent/EP0005166B1/de
Priority to DE7979100950T priority patent/DE2964588D1/de
Priority to JP4209579A priority patent/JPS54144185A/ja
Priority to IT22104/79A priority patent/IT1166764B/it
Application granted granted Critical
Publication of US4191603A publication Critical patent/US4191603A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823406—Combination of charge coupled devices, i.e. CCD, or BBD
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/133—Reflow oxides and glasses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking

Definitions

  • Stil another object of this invention is to eliminate overhang of a dielectric layer over a polycrystalline silicon layer.
  • a still further object of this invention is to seal pin holes in a dielectric layer covering a polycrystalline silicon layer.
  • Such an overhang situation is caused by over etching of the polysilicon material when the dielectric is used as a mask.
  • the amount of overhang is a function of polysilicon etching efficiency; but in order to assure that the polysilicon is etched completely down to the gate oxide, some overhang will always exist. This overhang inevitably produces a difficult topology for an insulating layer and a subsequent level of polysilicon to contour.
  • FIG. 1 is a schematic cross section of a semiconductor structure fabricated in accordance with the prior art.
  • FIG. 2 is a schematic cross section of a semiconductor structure at an early stage in its processing.
  • a monocrystalline silicon substrate 10 supports the entire structure.
  • Substrate 10 can be doped with either P or N type impurities depending on whether N or P channel field effect devices are desired to be fabricated.
  • the substrate may also have formed therein other doped regions formed by either diffusion or ion implantation for specific applications such as charge coupled devices having buried channels, complementary field effect devices, etc.
  • the substrate 10 is covered with a layer 12, usually thermal silicon dioxide.
  • Layer 12 is usually referred to as gate oxide because it is used as the dielectric between the gate electrode and the channel region therebeneath in the substrate.
  • Gate oxide 12 is formed by exposing the top surface of the silicon 10 to an oxygen containing vapor at an elevated temperature causing the silicon atoms to be converted to silicon dioxide.
  • This thin thermal oxide is then covered by a blanket layer of polysilicon 14.
  • Polysilicon 14 is then covered by a layer of chemical vapor deposited oxide (CVD) 16 which, in turn, is covered by photoresist. The photoresist is exposed and selected portions of CVD layer 16 are etched away by standard photolithographic techniques.
  • CVD chemical vapor deposited oxide
  • the selectively etched CVD layer 16 then becomes the mask for the selective etching of polysilicon layer 14.
  • the etchant will also attack exposed sidewalls of polysilicon 14 causing the CVD layer 16 to have an overhang.
  • This overhang is partially reduced during a reoxidation of the polysilicon material 14 resulting in thermal oxide insulation 17.
  • Some overhang usually remains so that a subsequently applied layer of polysilicon material 18 will have the irregular topology illustrated in FIG. 1.
  • this structure susceptible to dielectric problems between polysilicon 14 and polysilicon 18 but the irregular topology of layer 18 is difficult to achieve.
  • discontinuities and irregularities in layer 18 can cause subsequent problems with the finished device and also can create difficulties in subsequent processing steps.
  • FIG. 2 there is illustrated an intermediate structure having a substrate 10, preferably monocrystalline silicon covered by a thermal silicon dioxide gate oxide layer 20.
  • Gate oxide 20 is covered with a polysilicon layer 30 which, in turn, is covered with a layer of phosphosilicate glass (PSG) 40.
  • PSG phosphosilicate glass
  • layer 40 is selectively etched by conventional photolithographic techniques and, in turn, becomes a mask for the selective etching of polysilicon 30.
  • polysilicon 30 must be etched completely down to the top surface of gate oxide 20. As the etching proceeds, a portion of the sidewall of polysilicon 30 will also be eroded by the etchant resulting in the illustrated undercut of polysilicon 30--and overhang by PSG layer 40.
  • the additional N type phosphorus impurities obtained from the PSG source further enhance the conductivity characteristics.
  • the exact shape of the reflowed PSG 40' relative to the polysilicon pedestal shaped structure 30 will vary depending on the initial amount of overhang, the thickness of the initial PSG layer 40 as well as the temperature and time duration of the reflow cycle.
  • FIG. 3 shows an exemplary shape which has the same volume as prior to reflow but a lesser lateral extent substantially eliminating the overhang.
  • the sidewalls of polysilicon 30 must be insulated against contact with subsequently deposited conductive lines.
  • the invention of the above referenced Garbarino et al application could here be used to good advantage.
  • One of the exemplary processes there described involves the passivation of the sidewalls of polysilicon 30 with PSG followed by a thermal oxidation step. In the thermal oxidation step, oxygen atoms penetrate the PSG layer converting portions of the polysilicon material 30 in situ, into silicon dioxide. This results in a composite insulating layer described in the above referenced patent application. Other techniques described therein are equally applicable.
  • the sidewall of polysilicon 30 may be thermally oxidized converting the polysilicon atoms, in situ, to silicon dioxide forming insulating layer 50 as shown in FIG. 4.
  • the oxygen atoms oxidize the polysilicon material 30 into silicon dioxide 50, material expansion takes place eliminating whatever overhang might have been left in the FIG. 3 structure.
  • oxygen atoms also penetrate through the gate oxide 20, oxidizing portions of the silicon substrate into somewhat thicker gate oxide regions 22.
  • the reflowed PSG layer provides improved insulation of the top surface of the polysilicon layer not only due to its increased thickness, but also because the heat cycle seals any pin holes that may have been present.
  • the herein described "snap back" phenomenon occurring with PSG has application in other semiconductor fabrication steps requiring self-aligned insulators on a substrate. Further modifications are also possible.
  • the heat cycle to produce the structure of FIG. 3 can be provided in any desired inert ambient such as argon, helium, or even a vacuum. In fact, an oxygen ambient could be used if simultaneous oxidation of the polysilicon is desired.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Formation Of Insulating Films (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
US05/901,901 1978-05-01 1978-05-01 Making semiconductor structure with improved phosphosilicate glass isolation Expired - Lifetime US4191603A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US05/901,901 US4191603A (en) 1978-05-01 1978-05-01 Making semiconductor structure with improved phosphosilicate glass isolation
CA322,415A CA1115856A (en) 1978-05-01 1979-02-27 Semiconductor structure with improved phosphosilicate glass isolation
EP79100950A EP0005166B1 (de) 1978-05-01 1979-03-29 Verfahren zur Herstellung von Halbleiteranordnungen mit isolierten Bereichen aus polykristallinem Silicium und danach hergestellte Halbleiteranordnungen
DE7979100950T DE2964588D1 (en) 1978-05-01 1979-03-29 Method of manufacturing semiconductor devices with insulated areas of polycrystalline silicon and semiconductor devices thus produced
JP4209579A JPS54144185A (en) 1978-05-01 1979-04-09 Semiconductor device having fluid phosphorus silicate glass
IT22104/79A IT1166764B (it) 1978-05-01 1979-04-24 Struttura semiconduttrice con miglior isolamento di vetro al fosfosilicato

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/901,901 US4191603A (en) 1978-05-01 1978-05-01 Making semiconductor structure with improved phosphosilicate glass isolation

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US4191603A true US4191603A (en) 1980-03-04

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US (1) US4191603A (de)
EP (1) EP0005166B1 (de)
JP (1) JPS54144185A (de)
CA (1) CA1115856A (de)
DE (1) DE2964588D1 (de)
IT (1) IT1166764B (de)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1981000171A1 (en) * 1979-07-06 1981-01-22 American Micro Syst Method for forming voltage-invariant capacitors for mos type integrated circuit device
US4299024A (en) * 1980-02-25 1981-11-10 Harris Corporation Fabrication of complementary bipolar transistors and CMOS devices with poly gates
US4408388A (en) * 1980-04-14 1983-10-11 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a bipolar integrated circuit device with a self-alignment base contact
US4433008A (en) * 1982-05-11 1984-02-21 Rca Corporation Doped-oxide diffusion of phosphorus using borophosphosilicate glass
US4499653A (en) * 1983-11-03 1985-02-19 Westinghouse Electric Corp. Small dimension field effect transistor using phosphorous doped silicon glass reflow process
US4515668A (en) * 1984-04-25 1985-05-07 Honeywell Inc. Method of forming a dielectric layer comprising a gettering material
US4557950A (en) * 1984-05-18 1985-12-10 Thermco Systems, Inc. Process for deposition of borophosphosilicate glass
US4606936A (en) * 1985-04-12 1986-08-19 Harris Corporation Stress free dielectric isolation technology
US4732658A (en) * 1986-12-03 1988-03-22 Honeywell Inc. Planarization of silicon semiconductor devices
US4808555A (en) * 1986-07-10 1989-02-28 Motorola, Inc. Multiple step formation of conductive material layers
US5084418A (en) * 1988-12-27 1992-01-28 Texas Instruments Incorporated Method of making an array device with buried interconnects
US5385852A (en) * 1993-01-14 1995-01-31 Siemens Aktiengesellschaft Method for manufacturing vertical MOS transistors
US5429964A (en) * 1990-12-21 1995-07-04 Siliconix Incorporated Low on-resistance power MOS technology
US5521409A (en) * 1990-12-21 1996-05-28 Siliconix Incorporated Structure of power mosfets, including termination structures
US20080246070A1 (en) * 2007-04-09 2008-10-09 Byron Lovell Williams Methods and apparatus for forming a polysilicon capacitor
US20090090967A1 (en) * 2007-10-05 2009-04-09 Vishay-Siliconix Mosfet active area and edge termination area charge balance
US9431249B2 (en) 2011-12-01 2016-08-30 Vishay-Siliconix Edge termination for super junction MOSFET devices
US9508596B2 (en) 2014-06-20 2016-11-29 Vishay-Siliconix Processes used in fabricating a metal-insulator-semiconductor field effect transistor
US9614043B2 (en) 2012-02-09 2017-04-04 Vishay-Siliconix MOSFET termination trench
US9842911B2 (en) 2012-05-30 2017-12-12 Vishay-Siliconix Adaptive charge balanced edge termination
US9882044B2 (en) 2014-08-19 2018-01-30 Vishay-Siliconix Edge termination for super-junction MOSFETs
US9887259B2 (en) 2014-06-23 2018-02-06 Vishay-Siliconix Modulated super junction power MOSFET devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963840A (en) 1996-11-13 1999-10-05 Applied Materials, Inc. Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3897282A (en) * 1972-10-17 1975-07-29 Northern Electric Co Method of forming silicon gate device structures with two or more gate levels
US3915767A (en) * 1973-02-05 1975-10-28 Honeywell Inc Rapidly responsive transistor with narrowed base
US4028150A (en) * 1973-05-03 1977-06-07 Ibm Corporation Method for making reliable MOSFET device
US4075045A (en) * 1976-02-09 1978-02-21 International Business Machines Corporation Method for fabricating FET one-device memory cells with two layers of polycrystalline silicon and fabrication of integrated circuits containing arrays of the memory cells charge storage capacitors utilizing five basic pattern deliberating steps

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2040180B2 (de) * 1970-01-22 1977-08-25 Intel Corp, Mountain View, Calif. (V.St.A.) Verfahren zur verhinderung von mechanischen bruechen einer duennen, die oberflaeche eines halbleiterkoerpers ueberdeckende isolierschichten ueberziehenden elektrisch leitenden schicht
GB1503017A (en) * 1974-02-28 1978-03-08 Tokyo Shibaura Electric Co Method of manufacturing semiconductor devices
DE2705611A1 (de) * 1977-02-10 1978-08-17 Siemens Ag Verfahren zum bedecken einer auf einem substrat befindlichen ersten schicht oder schichtenfolge mit einer weiteren zweiten schicht durch aufsputtern

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3897282A (en) * 1972-10-17 1975-07-29 Northern Electric Co Method of forming silicon gate device structures with two or more gate levels
US3915767A (en) * 1973-02-05 1975-10-28 Honeywell Inc Rapidly responsive transistor with narrowed base
US4028150A (en) * 1973-05-03 1977-06-07 Ibm Corporation Method for making reliable MOSFET device
US4075045A (en) * 1976-02-09 1978-02-21 International Business Machines Corporation Method for fabricating FET one-device memory cells with two layers of polycrystalline silicon and fabrication of integrated circuits containing arrays of the memory cells charge storage capacitors utilizing five basic pattern deliberating steps
US4085498A (en) * 1976-02-09 1978-04-25 International Business Machines Corporation Fabrication of integrated circuits containing enhancement-mode FETs and depletion-mode FETs with two layers of polycrystalline silicon utilizing five basic pattern delineating steps

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1981000171A1 (en) * 1979-07-06 1981-01-22 American Micro Syst Method for forming voltage-invariant capacitors for mos type integrated circuit device
US4261772A (en) * 1979-07-06 1981-04-14 American Microsystems, Inc. Method for forming voltage-invariant capacitors for MOS type integrated circuit device utilizing oxidation and reflow techniques
US4299024A (en) * 1980-02-25 1981-11-10 Harris Corporation Fabrication of complementary bipolar transistors and CMOS devices with poly gates
US4408388A (en) * 1980-04-14 1983-10-11 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a bipolar integrated circuit device with a self-alignment base contact
US4433008A (en) * 1982-05-11 1984-02-21 Rca Corporation Doped-oxide diffusion of phosphorus using borophosphosilicate glass
US4499653A (en) * 1983-11-03 1985-02-19 Westinghouse Electric Corp. Small dimension field effect transistor using phosphorous doped silicon glass reflow process
US4515668A (en) * 1984-04-25 1985-05-07 Honeywell Inc. Method of forming a dielectric layer comprising a gettering material
US4557950A (en) * 1984-05-18 1985-12-10 Thermco Systems, Inc. Process for deposition of borophosphosilicate glass
US4606936A (en) * 1985-04-12 1986-08-19 Harris Corporation Stress free dielectric isolation technology
US4808555A (en) * 1986-07-10 1989-02-28 Motorola, Inc. Multiple step formation of conductive material layers
US4732658A (en) * 1986-12-03 1988-03-22 Honeywell Inc. Planarization of silicon semiconductor devices
US5084418A (en) * 1988-12-27 1992-01-28 Texas Instruments Incorporated Method of making an array device with buried interconnects
US5521409A (en) * 1990-12-21 1996-05-28 Siliconix Incorporated Structure of power mosfets, including termination structures
US5429964A (en) * 1990-12-21 1995-07-04 Siliconix Incorporated Low on-resistance power MOS technology
US5385852A (en) * 1993-01-14 1995-01-31 Siemens Aktiengesellschaft Method for manufacturing vertical MOS transistors
US20080246070A1 (en) * 2007-04-09 2008-10-09 Byron Lovell Williams Methods and apparatus for forming a polysilicon capacitor
US7670920B2 (en) * 2007-04-09 2010-03-02 Texas Instruments Incorporated Methods and apparatus for forming a polysilicon capacitor
US20090090967A1 (en) * 2007-10-05 2009-04-09 Vishay-Siliconix Mosfet active area and edge termination area charge balance
US9484451B2 (en) 2007-10-05 2016-11-01 Vishay-Siliconix MOSFET active area and edge termination area charge balance
US9431249B2 (en) 2011-12-01 2016-08-30 Vishay-Siliconix Edge termination for super junction MOSFET devices
US9614043B2 (en) 2012-02-09 2017-04-04 Vishay-Siliconix MOSFET termination trench
US9935193B2 (en) 2012-02-09 2018-04-03 Siliconix Technology C. V. MOSFET termination trench
US9842911B2 (en) 2012-05-30 2017-12-12 Vishay-Siliconix Adaptive charge balanced edge termination
US10229988B2 (en) 2012-05-30 2019-03-12 Vishay-Siliconix Adaptive charge balanced edge termination
US9508596B2 (en) 2014-06-20 2016-11-29 Vishay-Siliconix Processes used in fabricating a metal-insulator-semiconductor field effect transistor
US9887259B2 (en) 2014-06-23 2018-02-06 Vishay-Siliconix Modulated super junction power MOSFET devices
US10283587B2 (en) 2014-06-23 2019-05-07 Vishay-Siliconix Modulated super junction power MOSFET devices
US9882044B2 (en) 2014-08-19 2018-01-30 Vishay-Siliconix Edge termination for super-junction MOSFETs
US10340377B2 (en) 2014-08-19 2019-07-02 Vishay-Siliconix Edge termination for super-junction MOSFETs

Also Published As

Publication number Publication date
EP0005166B1 (de) 1983-01-26
JPS54144185A (en) 1979-11-10
EP0005166A1 (de) 1979-11-14
IT1166764B (it) 1987-05-06
JPS6213814B2 (de) 1987-03-28
DE2964588D1 (en) 1983-03-03
IT7922104A0 (it) 1979-04-24
CA1115856A (en) 1982-01-05

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