US3891514A - Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition - Google Patents

Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition Download PDF

Info

Publication number
US3891514A
US3891514A US417978A US41797873A US3891514A US 3891514 A US3891514 A US 3891514A US 417978 A US417978 A US 417978A US 41797873 A US41797873 A US 41797873A US 3891514 A US3891514 A US 3891514A
Authority
US
United States
Prior art keywords
base body
depressions
portions
layer
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US417978A
Other languages
English (en)
Inventor
Martin Klemm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fritz Buser AG Maschinenfabrik
Original Assignee
Fritz Buser AG Maschinenfabrik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fritz Buser AG Maschinenfabrik filed Critical Fritz Buser AG Maschinenfabrik
Application granted granted Critical
Publication of US3891514A publication Critical patent/US3891514A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves

Definitions

  • a lattice or grid metal layer is made by providing a pp matrix carrier in which, contrary to the prior art, the areas to form the solid portions of the lattice are de- [30] Foreign Application Priority Data pressed into the matrix body and, thereafter, the de- Nov, 28 1972 Switzerland H 17330 72 pressions are filled in with a metal by electrolytic deposition, from which the grid structure can then be [52] us. CI.
  • PATENTEDJIJN 2 4 I975 Fig- 13 5 METHOD TO PREPARE MATRICES TO MANUFACTURE LATTICE OR GRID METAL LAYERS STRUCTURES BY ELECTROLYTIC DEPOSITION
  • the present invention relates to a method for the preparation of matrices for the manufacture of lattice or grid metal layer structures having openings therein of predetermined shape and size, by electrolytic deposition.
  • Grid or lattice structures are usually manufactured by electrolytic deposition; this known method requires a tool, referred to as a matrix. Manufacture of the matrix itself, as well as the matrix structure as such is an expensive and hence time consuming operation.
  • the matrix material is deformed at those regions where the lattice or grid elements are to be placed.
  • the matrix is, therefore deformed in accordance with the grid or lattice network, the deformations are then filled with electrically conductive material and a known electrolytic process may then be utilized to prepare the grid or lattice structures therefrom.
  • FIGS. 1-30 are schematic representations of sequential steps in a formation of a matrix in accordance with the prior art in which FIG. 1 is a schematic top view of a matrix; FIG. 2 is a cross-sectional view along lines lI -II of FIG. 1; FIG. 3 is a cross-sectional view through the upper surface of the embossed matrix; and FIG. 3a is a cross-sectional view through a negative of an embossed matrix;
  • FIGS. 4-9 are sequential cross-sectional views of a matrix body, illustrating sequential steps in the formation of the matrix in accordance with the present invention.
  • FIGS. l14 are cross-sectional views of a matrix body showing sequential steps in accordance with another embodiment of the present invention.
  • FIGS. -18 are cross-sectional views similar to FIGS. 4-9 in accordance with yet another embodiment of the invention.
  • a base body typically a metal cylinder is the initial structure.
  • the base body has, on its surface, a layer of suitable thickness made of a material which can be embossed.
  • a material may be copper, brass, or even soft steel.
  • the surface of the material is made smooth, for example by grinding or polishing, rolling, or by electrolytic polishing.
  • the base body illustrated generally at 4 (FIG. 3) has a pattern of a predetermined shape embossed therein.
  • This pattern corresponds to the structure of the lattice or grid network to be made by the matrix.
  • the embossing step is carried out by a so-called relief or embossing element 1 (FIGS. I, 2).
  • This embossing die is a small, hardened steel cylinder on which the pattern to be embossed is formed, the embossing pattern being a negative of the pattern to be embossed in the matrix body 4.
  • the relief I is made by engraving, or similar technology.
  • the elements of the embossing pattern usually, consist of projecting cones 2, having hexagonal base surfaces, separated from each other by grooves 3.
  • the cones 2 are offset with respect to each other, in honeycomb fashion, as best seen in FIG. I.
  • the surface to be formed thereby will be seamless.
  • the matrix body 4 Upon embossing, the matrix body 4 will have ribs 3 and depressions 2' (FIG. 3) formed therein, which correspond to the embossed projections 2 and grooves 3, respectively, of the embossing die illustrated in FIGS. 1 and 2.
  • FIG. 3 which is the negative of the cross-section seen in FIG. 2.
  • This impression or embossing step is done by rotating the cylinder on which the projecting cone surfaces 2 are located over the base plate 4.
  • FIGS. 1 and 2 illustrate the surface in developed form.
  • the pattern which is transferred to the base body 4 is seamless.
  • a plain base plate 4 is fed in synchronism with the embossing die, so that the circumferential speed of the embossing die 1 and the linear surface speed of the plate 4 are identical.
  • base plate 4 is fed longitudinally by a similar distance as the circumferential extent of the embossing die, so that one or more elementary areas 2 are passed over the base plate 4 at the same rate.
  • the embossing die I and the base plate 4 are thus interengaged similar to a toothand-detent arrangement, as in gearing, or in screws, so that, after synchronized embossing feed movement has commenced, the synchronism will be automatically and inherently maintained.
  • This embossing or ruling operation may be carried out in several passes in order to obtain the requisite embossing depth; after one or more passes through a ruling machine carrying out such a sequence of operations, a finished base matrix 4 has been obtained.
  • the depressed portions 2' of the base body 4 are cleaned, and then filled with an electrically nonconductive material, for example a lacquer, or suitable resin.
  • an electrically nonconductive material for example a lacquer, or suitable resin.
  • the embossed surface is entirely covered with the lacquer, which is then removed, for example by grinding or polishing, to the extent that the projecting portions 3' of the base body 4 are again uncovered.
  • the base body 4 is thus finished and, the depressions 2 being filled with non-conductive, insulating material, this base body is now referred to as a matrix or, when circular, as a matrix roller.
  • the matrix is then placed into a galvanic bath, prefer ably a nickel bath, and coated galvanically. Those portions of the matrix, which are exposed to the bath, will have nickel deposited thereon. This deposition will, of course, in accordance with the pattern of the projections 3', be in lattice or mesh or sieve-like form.
  • Galvanic deposition is carried out for a suitable time until a sufficiently thick layer of electrically deposited metal, typically nickel, has been obtained.
  • the nickel plating is then interrupted and the resulting, perforated skin of nickel can be stripped off the matrix by means of a suitable stripping device. A seamless, completely perforated nickel lattice or grid structure has been obtained.
  • the sequence of steps to obtain the nickel lattice or grid structure, as described, and in accordance with the prior art, has several disadvantages; the most serious one of these disadvantages is that it is difficult to provide large depressions 2' in the base body 4', approximately two-thirds of the surface of the base body must be formed with depressions, the projections forming the remainder and a smaller proportion of the surface of the base body 4. To obtain such large depressions, the compressive force exerted on the base body 4 is high.
  • the ruling, or embossing machine must be capable of transmitting substantial forces, must therefore be heavy and very sturdy, and the base body itself must be made of highly stable and strong materials. This then leads to high weights of the matrix which heavy matrices must be handled in the nickel bath, thus substantially increasing the cost of the entire process.
  • embossing die 1 it has been customary, as above explained in connection with FIGS. 1 and 2, to form the embossing die 1 such that projecting cones, or pyramids 2 are formed on the embossing die.
  • the volume of the depression 2', formed in the base body, then will be much greater than the volume of the rib 3' extending in the grooves between the pyramids or cones 2 of die I.
  • the embossing forces can, therefore, be reduced only by changing the volumetric relationship of depressions to be formed in the base body with respect to the remaining ribs.
  • the ribs are embossed into the base body, rather than the depressions.
  • the volume to be displaced during the embossing step thus is substantially reduced with respect to the volume which must be displaced in a customary process as above explained. Decreasing the displacement volume permits substantial decrease of the embossing forces.
  • a suitable embossing pattern thus can be readily made by using a pattern similar to that of FIG. I, embossing a master pattern of soft steel with the negative of the pattern illustrated in FIG. I, and subsequently hardening the surface.
  • FIG. 3a which is the negative of the cross section of FIG. 2, and formed with pyramidal or conical depressions 2", separated by ribs 3".
  • the depressions 2", if made separately, may have a flat bottom, and need not be hexagonal.
  • the embossing pattern can be made in shapes other than those shown in FIG. 1 and by direct working of a cylinder of soft steel, for example, with subsequent surface hardening.
  • the die having a cross section of FIG. 3a is then pressed into a base body 5 (see FIG. 4) to result in a grid or lattice structure formed ofdepressed grooves 6 surrounded by higher surfaces 7.
  • the depth of the grooves 6, as well as their shape, and the shape of the surrounding edges defining the group can be controlled by controlling the embossing pressure, as well as the shape and structure of the embossing die itself.
  • the base body 5, made in accordance with the present invention by embossing therein a negative pattern of the grid structure to be made is covered with a hard chrome layer by galvanic process.
  • This hard chrome layer 8 is deposited on the flat surface 9 of the base body 5, as well as in the grooves 6, to form chrome strips 10 continuous with a top layer 11 (FIG. 5).
  • the chrome layer 8 is then removed to such an extent that the surface portions 9 of the base body 5 are free from chrome, that is, the surface layer 11 is removed. Grinding is a suitable process.
  • the chrome filling I0 within the grooves or notches 6 of the surface 9 of the base body 5 will then have the same level as the base body itself (FIG. 6).
  • the base body, with the chrome strips in the grooves or notches is then placed in an etch bath which is so selected that it attacks only the material of the base body, but not the chrome in the grooves 6 (FIG. 7).
  • the base material is thus removed and leaves depressed portions 12 between the strips formed by the chrome filling 10. These strips will project as ridges from between the depressed portions I2.
  • a suitable non-conductive material 13 is then applied see FIG. 8. This non-conductive or insulating material entirely covers the top surface of the base body 5, with the chrome strips 10 therein.
  • the base body 5 is then subjected to another material removal operation, for example grinding, to remove that portion of the non-conductive material 13 which extends above the chrome strips I0, to result in the structure of FIG. 9, leaving a base body 5, with exposed chrome strips corresponding to the lattice or mesh or grid network to be then made by electric deposition, in accordance with the prior art.
  • the insulating material 13 may, for example, be a suitable insulating lacquer, varnish or resin.
  • the removal operation of excess insulating material 13 is the final operation and the matrix is thus made which is suitable for further manufacture of nickel lattice or grid or mesh structures.
  • the base body 5 prepared in accordance with the present invention to have the depressed grooves therein (FIG. 4) is covered, selectively, with a suitable cover lacquer 14.
  • a suitable cover lacquer 14 Such selective covering extends only over the flat surface; this method is known in gravure printing as surface coating, leaving the depressions free of coating material.
  • the object is to obtain a profiled surface in which a lacquer, or similar material covers only the projecting portions, the depressed portions of the body being, however, free from covering material or lacquer. All the projecting portions 9 of the surface of the base body 5 are covered, therefore, with lacquer 14, as seen in FIG. 10; the grid or mesh depressions 6 are left free from lacquer or other insulating covering material.
  • the base body of FIG. I0 is then electrolytically nickel-coated or chrome-plated.
  • the result obtained after nickel or chrome plating is seen, in cross-section, in FIG. 11', the grooves 6 are filled by the plating metal 15', the electrically non-conductive portions of the base body 5 will remain free from plating or coating since they have been covered by electrically insulating lacquer layer 14.
  • lacquers used in selective inking, or selective surface application to cover only the exposed surface are suitable only for restricted use in galvanizing processes, for example nickel or chrome plating, or other plating processes, used in the manufacture of matrices.
  • the coating 14 may not be sufficiently chemically resistant. Particularly, there may be a lack of chemical resistance with respect to nickel electrolytes, if immersed in such baths over extended periods of time or in repeated processes. In an alternative method, therefore, layer 14 is removed after the first chrome plating step, which had resulted in the structure of FIG. 11.
  • the base body 5, with the coating 14 removed, is seen in cross section in FIG.
  • the surface of the matrix is then covered by another lacquer or resin material which has the property of being highly resistant to nickel electrolytes (although it may not be suitable for selective, surface application only) to result in the structure seen in FIG. 13, where the lacquer or resin layer 13 covers both the surface of the base body 5 as well as the exposed surface of the grid material 15.
  • the base body is then subjccted to a further material removing step after drying of the lacquer, or hardening or curing of resin for example by grinding, so that the excess lacquer material covering the nickel grid structure 15 is removed, to result in the structure seen, in cross section, in FIG. 14, where the top surface of the matrix is smooth overall, and having the exposed surface portions of the hard nickel, or hard chrome grid or lattice structure 15 with the portions coated by insulating material 13 therebetween.
  • the final material removal step terminates this modification of the second embodiment of the invention, to result in the final matrix which can then be placed, repeatedly, in nickel plating baths in order to make the eventual lattice or mesh or grid structures.
  • the die ridge lines are preferably formed with knife edges to penetrate through the lacquer and into the material of the base body 5.
  • the next step in the process is an electrolytic bath, in which nickel or chrome is deposited in the grooves.
  • the electrolytic deposition is terminated at a time when the metallic portion of groove 18 has been filled entirely with metal, and the entire groove 18 has approximately 20-IOO% of its volume filled by metal 19 (FIG. 16).
  • the surface of the base body 5, prepared to have the aspect of FIG. 16 is worked, for example by grinding, so that a smooth plane surface is obtained extending over the entire base body 5 and formed of portions of insulating material layers 17, interrupted by the metallic portions 19, as best seen in FIG. 18. This surface working operation completes the production of the matrix.
  • the coated base body is treated in a bath in which the lacquer coating 17 is dissolved, leaving depressed portions 20 between which the chrome ridges 19 extend, as seen in FIG. 17.
  • the surface of the base body 5 is coated with an electrically non-conductive material, for example laquer 17 or a resin or lacquer highly resistant to the electrolytic bath which is used to make the final mesh, grid or lattice structure, similarly to the steps explained in connection with FIGS. l2, l3 and 14.
  • Surface 20 is coated with such a lacquer l7 or resin, and the surface is then worked to result in a smooth overall surface as again shown in FIG. 18.
  • the matrix prepared in accordance with the present invention can be used to make all types of sieve or mesh or lattice structures, such as filters, sieve patterns, particularly mesh structures in which the mesh openings must have accurate size and shape, for example as used in screen printing.
  • the material of layer 8 may be:
  • chromium, nickel the filling material l0, l5, 19, to fill the grooves typically is nickel or chromium the material for selectively insulating the surface layer, see material 14 of FIGS. 10, 11, may be: galvanoresist prepaved by asphalt, colophony, beeswax; see eg H. G. Jakob and F. Weissgerber, Walzengravur und Schablomenher ein im Textildrueck, I960 Melliand Vevlag
  • the coating material 13, 17' (FIGS. 13, 14, 18) may be:
  • Araldit A65 106 and hardener HVg53u or Teflon S material 17 (FIGS. l5, 16) may be, for example: ma-
  • the base material for the matrix typically is copper
  • a method to prepare matrices for the manufacture of lattice or grid or mesh metal layer structures including the steps of forming a base body (5) with a surface having electrically conductive portions, in accordance with the solid portions of the grid or mesh structure, and electrically non-conductive portions in accordance with the interstitial openings between the solid portions of the grid and mesh structure, electrolytically depositing a metal layer on the conductive portions, and then removing said metal layer,
  • the base body is of electrically conductive material
  • the step of forming said base body (5) comprises the steps of forming depressions (6, 18) in the surface of the body (5) having a shape, size and surface distribution corresponding to the electrically conductive portions of the surface of the body by penetrating into the material of the base body (5);
  • step of forming the depressions comprises embossing a metallic base body (5) with grooves.
  • step of forming said base body (5) comprises the steps of galvanically applying (FIG. 5) a metal layer (8) to the entire surface of the base body (5) after the depressions have been formed therein;
  • step of removing a portion of the material adjacent the filled depressions comprises removing additional base body material by etching
  • the step of filling the depressed portions comprises covering the entire surface of the base body (5) with a covering of non-conductive material (13);
  • step of forming said base body (5) comprises selectively covering (FIG. 10) with an insulating ma' terial (14) those portions of the surface of the body (5) which correspond to the electrically nonconductive portions after the depressions (6) have been formed in said base body (5 leaving said depressions free from said insulating covering material (14);
  • the step of filling said depressions comprises electrogalvanically over-filling said depressions (6) with metal (15) to form a surface comprising partly metallic ridge portions filling the depressions and partly insulating portions;
  • the step of removing a portion of the material adjacent the over-filled depressions comprises removing the insulating material 114) covering
  • the step of filling the depressed portions comprises filling the surface portions from which the insulating material (14) has been removed with an insulating layer (13).
  • the smooth working step comprises removing so much of said insulating layer to expose the material (10, l5, l9) filling the depressions to provide a smooth overall surface.
  • the covering of insulating material (14) comprises a material suitable for selective application over the surface and without penetration into the depressions (6) formed in the base body (5);
  • the insulating layer (13) comprises a material highly resistant to electrolytic baths used in the step of electrolytically depositing a metal layer over said conducting portions.
  • the step of forming said base body comprises covering the entire surface of the body (5) with a layer of insulating material (17 before the surface of the base body is deformed with said depressions;
  • the step of forming the depressions comprises forming the depressions in the base body by penetrating the layer of insulating material (17) and into the material of the base body;
  • the step of filling said depressions comprises galvanically over-filling said depressions in the base body material with electrically conductive material (19) to form said ridges;
  • the step of removing a portion of the material adjacent the over-filled depressions comprises removing the insulating material (17) covering
  • the step of filling the depressed portions com prises filling the surface portions from which the insulating material (17) has been removed with a non-conductive layer (17'.
  • the step of forming the depressions in the base body by penetrating the layer of non-conductive material (17) and into the material of the base body (5) comprises cutting through the layer of insulating material (17) and into the material of the base body (5) with a knife edge tool.
  • the smooth working step comprises grinding.
  • a method to prepare matrices for the manufacture of lattice or grid or mesh metal layer structures having openings of predetermined shape and size including the steps of forming a base body (5) with a surface having electrically conductive portions, in accordance with the solid portions of the grid or mesh structure and electrically non-conductive portions in accordance with the interstitial openings between the solid portions of the grid and mesh structure, electrolytically depositing a metal layer on the conductive portions, and then removing said metal layer, the improvement wherein the base body is of electrically conductive material; and the step of forming said base body (5 comprises the steps of covering the entire surface of the base body (5) with a layer of nomconductive material forming depressions (18) in the surface of the body (5) having an outline, size, and surface distribution corresponding to the electrically conductive portions of the surface of the body by penetrating into the material of said base body, said layer of nonconductive material covering the undeformed surface of the base body comprising the surface regions between said depressions;
  • step of galvanically filling said depressions comprises filling said depressions to an extent greater than finally required;
  • step of covering the surface of the base body (5) with said layer of non-conductive material comprises covering the surface of the base body after the deformation and penetration step with a material suitable for selective application over the surface thereof and without penetration into the depressions formed in the base body (5).
  • Method according to claim 14, wherein the step of forming the depressions comprises penetrating the layer of non-conductive material (17) and penetrating into the base body by cutting through the layer of insulating material (17) and into the material of the base body with a knife edge tool.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
US417978A 1972-11-28 1973-11-21 Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition Expired - Lifetime US3891514A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1733072A CH591570A5 (es) 1972-11-28 1972-11-28

Publications (1)

Publication Number Publication Date
US3891514A true US3891514A (en) 1975-06-24

Family

ID=4424569

Family Applications (1)

Application Number Title Priority Date Filing Date
US417978A Expired - Lifetime US3891514A (en) 1972-11-28 1973-11-21 Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition

Country Status (14)

Country Link
US (1) US3891514A (es)
JP (1) JPS5143981B2 (es)
AR (1) AR203828A1 (es)
AT (1) AT323496B (es)
BR (1) BR7309197D0 (es)
CA (1) CA1012483A (es)
CH (1) CH591570A5 (es)
ES (1) ES420372A1 (es)
FR (1) FR2208001B1 (es)
GB (1) GB1441597A (es)
IN (1) IN142202B (es)
IT (1) IT1001734B (es)
NL (1) NL158559B (es)
ZA (1) ZA738850B (es)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024045A (en) * 1975-03-06 1977-05-17 Fritz Buser Ag Maschinenfabrik Master pattern cylinder
US4205428A (en) * 1978-02-23 1980-06-03 The United States Of America As Represented By The Secretary Of The Air Force Planar liquid crystal matrix array chip
US4301585A (en) * 1979-05-31 1981-11-24 Ricoh Co., Ltd. Method of forming plate having fine bores
US4482511A (en) * 1981-08-21 1984-11-13 Victor Company Of Japan, Ltd. Method of manufacturing a stamper for information storage discs
US4745670A (en) * 1980-10-28 1988-05-24 Rockwell International Corporation Method for making chemical laser nozzle arrays
US4937930A (en) * 1989-10-05 1990-07-03 International Business Machines Corporation Method for forming a defect-free surface on a porous ceramic substrate
NL1015535C2 (nl) * 2000-06-27 2001-12-28 Stork Screens Bv Elektroformeringsmatrijs, werkwijze voor het vervaardigen daarvan, alsmede toepassing daarvan en geÙlektroformeerd product.
US6591496B2 (en) 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US20060121271A1 (en) * 2004-12-03 2006-06-08 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
US20070036951A1 (en) * 2005-08-10 2007-02-15 3M Innovative Properties Company Microfabrication using replicated patterned topography and self-assembled monolayers
US20080095988A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a deposit metal on a polymeric substrate
US20080095985A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
US7968804B2 (en) 2006-12-20 2011-06-28 3M Innovative Properties Company Methods of patterning a deposit metal on a substrate
US20160219697A1 (en) * 2013-12-27 2016-07-28 Lg Chem, Ltd. Conductive film and method for manufacturing same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404060A (en) * 1981-05-08 1983-09-13 Siemens Aktiengesellschaft Method for producing insulating ring zones by galvanic and etch technologies at orifice areas of through-holes in a plate
DE3842610C1 (es) * 1988-12-17 1990-06-21 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De
DE3905679A1 (de) * 1989-02-24 1990-08-30 Heidelberger Druckmasch Ag Metallfolie als aufzug fuer bogenfuehrende zylinder und/oder trommeln an rotationsdruckmaschinen
DE4222856C1 (es) * 1992-07-11 1993-05-27 Buerkert Gmbh

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2123297A (en) * 1934-12-12 1938-07-12 Beynen Laurens Rynhart Process of preparing perforated metal articles
US2529086A (en) * 1946-04-30 1950-11-07 Rca Corp Method of making fine mesh screens
US2805986A (en) * 1952-01-11 1957-09-10 Harold B Law Method of making fine mesh screens

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2702270A (en) * 1952-06-07 1955-02-15 Rca Corp Method of making fine mesh metallic screens

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2123297A (en) * 1934-12-12 1938-07-12 Beynen Laurens Rynhart Process of preparing perforated metal articles
US2529086A (en) * 1946-04-30 1950-11-07 Rca Corp Method of making fine mesh screens
US2805986A (en) * 1952-01-11 1957-09-10 Harold B Law Method of making fine mesh screens

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024045A (en) * 1975-03-06 1977-05-17 Fritz Buser Ag Maschinenfabrik Master pattern cylinder
US4205428A (en) * 1978-02-23 1980-06-03 The United States Of America As Represented By The Secretary Of The Air Force Planar liquid crystal matrix array chip
US4301585A (en) * 1979-05-31 1981-11-24 Ricoh Co., Ltd. Method of forming plate having fine bores
US4745670A (en) * 1980-10-28 1988-05-24 Rockwell International Corporation Method for making chemical laser nozzle arrays
US4482511A (en) * 1981-08-21 1984-11-13 Victor Company Of Japan, Ltd. Method of manufacturing a stamper for information storage discs
US4937930A (en) * 1989-10-05 1990-07-03 International Business Machines Corporation Method for forming a defect-free surface on a porous ceramic substrate
NL1015535C2 (nl) * 2000-06-27 2001-12-28 Stork Screens Bv Elektroformeringsmatrijs, werkwijze voor het vervaardigen daarvan, alsmede toepassing daarvan en geÙlektroformeerd product.
WO2002000966A1 (en) * 2000-06-27 2002-01-03 Stork Prints B.V. Electroforming die, method of manufacturing the same, application thereof and electroformed products
US6591496B2 (en) 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US20030196830A1 (en) * 2001-08-28 2003-10-23 3M Innnovative Properties Company Embedded electrical traces
US6929849B2 (en) 2001-08-28 2005-08-16 3M Innovative Properties Company Embedded electrical traces
US7160583B2 (en) 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
US20060121271A1 (en) * 2004-12-03 2006-06-08 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
US20070098996A1 (en) * 2004-12-03 2007-05-03 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
US7682703B2 (en) 2004-12-03 2010-03-23 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
US20070036951A1 (en) * 2005-08-10 2007-02-15 3M Innovative Properties Company Microfabrication using replicated patterned topography and self-assembled monolayers
US7871670B2 (en) 2005-08-10 2011-01-18 3M Innovative Properties Company Microfabrication using replicated patterned topography and self-assembled monolayers
US20080095988A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a deposit metal on a polymeric substrate
US20080095985A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
US20100203248A1 (en) * 2006-10-18 2010-08-12 3M Innovative Properties Company Methods of patterning a deposit metal on a polymeric substrate
US8764996B2 (en) 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
US7968804B2 (en) 2006-12-20 2011-06-28 3M Innovative Properties Company Methods of patterning a deposit metal on a substrate
US20160219697A1 (en) * 2013-12-27 2016-07-28 Lg Chem, Ltd. Conductive film and method for manufacturing same
US9699898B2 (en) * 2013-12-27 2017-07-04 Lg Chem, Ltd. Conductive film and method for manufacturing same

Also Published As

Publication number Publication date
JPS5143981B2 (es) 1976-11-25
FR2208001A1 (es) 1974-06-21
DE2353692A1 (de) 1974-05-30
JPS4987536A (es) 1974-08-21
CH591570A5 (es) 1977-09-30
NL158559B (nl) 1978-11-15
GB1441597A (en) 1976-07-07
IN142202B (es) 1977-06-11
BR7309197D0 (pt) 1974-08-29
IT1001734B (it) 1976-04-30
AR203828A1 (es) 1975-10-31
ES420372A1 (es) 1976-04-16
AT323496B (de) 1975-07-10
FR2208001B1 (es) 1977-06-10
NL7316250A (es) 1974-05-30
ZA738850B (en) 1974-10-30
DE2353692B2 (de) 1977-05-18
CA1012483A (en) 1977-06-21

Similar Documents

Publication Publication Date Title
US3891514A (en) Method to prepare matrices to manufacture lattice or grid metal layers structures by electrolytic deposition
US4552832A (en) Shear foil having protrusions on its skin-contacting surface thereof
US5191703A (en) Method of making an anilox roller or cylinder
US2226384A (en) Process of electrolytically producing foraminous sheets
DE1231775B (de) Wiederholt verwendbare Matrize zur Herstellung gedruckter Stromkreise
US5055163A (en) Process for producing a two-dimensionally extending metallic microstructure body with a multitude of minute openings and a tool suitable for this purpose
EP0662163B1 (de) Verfahren zur galvanischen abformung von mit strukturen versehenen plattenförmigen körpern
US3726770A (en) Electrodeposition process for producing perforated foils with raised portions at the edges of the holes
DE69111003T2 (de) Verfahren unter Verwendung einer permanenten Matrize zur Herstellung von elektrischen Schaltungen.
CA1061279A (en) Process for producing screen material
DE2524055A1 (de) Verfahren und vorrichtung zum herstellen von metallstraengen unbestimmter laenge
US3548041A (en) Lens mold making by plating lenticulations on a masked conductive support
US2246380A (en) Electrolytic method of producing screens
DE3035714A1 (de) Verfahren zur herstellung einer tiefdruckplatte
DE3027008C2 (de) Dauerform für die Galvanoplastik
EP0402377A1 (de) Verfahren zur herstellung eines mit einem prägemuster versehenen metallischen endlosbandes.
US4987799A (en) Stamping die replica and method of manufacture thereof
DE2728632A1 (de) Schleifzeug und herstellungsverfahren
US3434938A (en) Method and apparatus for producing metal screen sheet
DE2544603A1 (de) Verfahren zur herstellung eines zylindrischen matrizenkoerpers
US3655529A (en) Electrodeposition process for producing perforated foils with raised portions at the edges of the holes
GB1537243A (en) Production of iron foil by electrodeposition
GB1315538A (en) Printing member and method of making the same
US4192719A (en) Method of making a shearfoil for dry shavers
DE2353692C3 (de) Verfahren zur Herstellung von leitende und nichtleitende Flächenbereiche aufweisenden Matrizen für die galvanoplastische Erzeugung von definiert strukturierten Metallschichten