US3840069A - Heat pipe with a sintered capillary structure - Google Patents

Heat pipe with a sintered capillary structure Download PDF

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Publication number
US3840069A
US3840069A US00245821A US24582172A US3840069A US 3840069 A US3840069 A US 3840069A US 00245821 A US00245821 A US 00245821A US 24582172 A US24582172 A US 24582172A US 3840069 A US3840069 A US 3840069A
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United States
Prior art keywords
heat
pores
capillary structure
group
tube
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Expired - Lifetime
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US00245821A
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English (en)
Inventor
W Fischer
G Gammel
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BBC Brown Boveri AG Switzerland
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Bbc Brown Boveri & Cie
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Publication of US3840069A publication Critical patent/US3840069A/en
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Expired - Lifetime legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the present invention is directed to a head tube having a capillary structure formed at least on its heatreceiving and heat-delivering surfaces and, more particularly, it is directed to a sintered capillary structure containing an arrangement of both fine and coarse pores within the capillary structure.
  • While AT is in many cases on the order of one-tenth of a degree and ATA ATrrTAis on the order of several degrees, ATa ATa' often amount to a multiple of 10. Accordingly, to improve the heat conductivity of heat pipes, itis especially important to make the sum of AToz and ATa as small as possible.
  • This temperature difference which is due to heat transfer to the liquid working medium can be reduced by enlarging the heat transfer area.
  • the enlargement of the heat transfer area is provided in the interior of the heat pipe by means of a capillary structure at the surface where heat transfer takes place so that the ratio of heat transfer area inside the heat pipe to the'corresponding outside area, from which the heat is removed, is greater than one.
  • any heat pipe because the transport of the liquid working medium requires a capillary structure, that is, the inner surface of the heat pipe is increased due to the capillarystructure.
  • the increase in the inner surface is slight and, as a result, the reduction of ATa and ATa is at most relatively small.
  • An additional factor in heat pipes using cellular structures is that the heat contact between the lattice or grid forming the cellular structure and the heat pipe wall or between differentsuperposed lattices or grids is generally poor, and the increased inner surface area cannot be fully utilized because the passage of heat to it is accomplished only imperfectly.
  • Another object of the invention is to provide different methods for the production of the capillary structure within the heat tube for achieving the increased heat transfer area.
  • the problem experienced in the past is solved by only partially filling the capillary structure with a working liquid.
  • a sintered capillary structure formed of a metal powderof the same grain size exhibits a pore size distribution curve in which the maximum number of particular sizes covers a Wide range.
  • there is a certain, if small, number of pores of a smaller diameter Accordingly, sufficient working medium'is supplied into the tube to fill the smaller pores, while the larger pores remain free of the working medium. It should be noted, however, that if the quantity of working medium is too small, there is the danger of the heat-receiving surface drying out.
  • the capillary structure is formed, at least in the heat-receiving and the heat-delivering surfaces, so that the pore sized distribution curve exhibits two pronounced maximum ranges of pore sizes.
  • the metal powder to be sintered consists of grains of two different sizes with the larger of the grains having an oblong configuration and the smaller ones having a spherical configuration.
  • FIG. 1 is a cross sectional view of a portion of a heat pipe illustrating a sintered capillary structure formed thereon in accordance with the present invention
  • FIG. 3 is a graph of the heat flow density in two comparable heat pipes based as a function at the AT, with one heat pipe having a conventional capillary structure and the other having a capillary structure formed in accordance with the present invention.
  • FIG. 4 is a cross sectional view of a heat pipe with a capillary structure formed in accordance with the present invention.
  • any pore distribution is suitable for achieving the effect described herein. Even if the pore size distribution has a very limited maximum range, at least by filling with a suitable quantity of the liquid working medium, thefine pores, those pores whose radius or size is only slightly less than that of the coarse pores, become filled while the coarse pores remain open or free of the working medium.
  • the filling of the pores in the heat-receiving and heat-delivering or discharging surfaces depends not only on the quantity of the liquid charged into the tube and on the capillary action but also on the quantity of heat supplied. The dependence on these factors is particularly noted in capillary structures where the pore size distribution has a very narrow maximum range. To be able to operate at all times in the vicinity of the minimum AT, even at variable heat flow, it is important to obtain the pore size distribution shown in FIG. 2.
  • heat pipe 1 a 2 mm sintered layer of copper particles having a grain size range of 125 to 250 microns was formed.
  • the pore size distribution curve was relatively pointed, that is it did not have a broad maximum size range.
  • Just enough water was placed in the heat pipe so that all of the pores were full of water.
  • a 2 mm sintered layer consisting of copper filings having an oblong shape with a length of about 1.5 mm and copper particles of spherical shape with a diameter of about 50 microns. Before the sintering operation, the coarse and fine particles were mixed in a ratio by weight of 2:1.
  • the quantity of water was varied until the temperature difference between a pore in the heat-receiving surface of the heat tube and the interior of the heat tube assumed a minimum at constant heat supply.
  • FIG. 3 the temperature differences measured on heat tube 1 and heat tube 2 in the heat-receiving sur-v face are plotted as a function of the heat flow density at the heat-receiving surfaces.
  • the heat tube 2 greater heat flow densities were attained at equal temperature differences.
  • the temperature difference AT can be reduced.
  • the range'between the upwardly extending dashed lines represents ebullient boiling while the space to the left of the left hand dashed line represents surface evaporation.
  • FIG. 3 by changing over from heat tube 1 to heat tube 2 the passage from the range of ebullient boiling to surface evaporation is facilitated. In the region of the change-over from surface evaporation to ebullient boiling the reduction in AT is greater because in this region the curve is flatter.
  • a heat pipe comprising a closed tube having a heat-receiving surface and a heat-delivery surface, a layer of capillary structure sintered to the inside surface of said tube at least on the heat-receiving surface and the heat-delivery surface therein and another capillary structure interconnecting the heat-receiving and the heat-delivery surface for liquid transport therebetween, said tube and layer ofcapillary structure defining an enclosed space in the heat pipe for transporting vapor between the heat-receiving surface and the heat delivery surface, wherein the improvement comprises that the layer of capillary structure consists of pores of different sizes, and a vaporizable liquid filled into said tube in a quantity to fill only the smaller sized pores by capillary force, said pores are of a size in which capillary force takes effect and consists of a first group having a range of pores of relatively small sizes and a second group having a range of pores of relatively large sizes and within each of said first group and said second group there is a broad range of a maximum number
  • a heat pipe as set forth in claim 1, wherein said pores in said first group have approximately the same total volume as said pores in said second group.
  • a heat pipe comprising a closed tube having a heat-receiving surface and a heat-delivery surface, a layer of capillary structure sintered to the inside surface of said tube at least on the heat-receiving surface and the heat-delivery surface therein and another capillary structure interconnecting the heat-receiving and the heat-delivery surface for liquid transport therebetween, said tube and layer of capillary structure defining an enclosed space in the heat pipe for transporting vapor between the heat-receiving surface and the heatdelivery surface, wherein the improvement comprises that the layer of capillary structure consists of pores of different sizes, and a vaporizable liquid filled into said tube in a quantity to fill only the smaller sized pores by capillary force, said pores comprise a first group of pores and a second group of pores and the pores in said first group being distinctly smaller and of substantially the same size as compared to the pores in said second group which are of substantially the same size and both of said first and second groups having a maximum number of pores as compared to

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Powder Metallurgy (AREA)
US00245821A 1971-04-27 1972-04-20 Heat pipe with a sintered capillary structure Expired - Lifetime US3840069A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712120475 DE2120475A1 (de) 1971-04-27 1971-04-27 Wärmerohr

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US3840069A true US3840069A (en) 1974-10-08

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US00245821A Expired - Lifetime US3840069A (en) 1971-04-27 1972-04-20 Heat pipe with a sintered capillary structure

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US (1) US3840069A (de)
CH (1) CH539258A (de)
DE (1) DE2120475A1 (de)
NL (1) NL7205382A (de)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129181A (en) * 1977-02-16 1978-12-12 Uop Inc. Heat transfer surface
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
USH971H (en) 1988-10-24 1991-10-01 The United States Of America As Represented By The Secretary Of The Air Force Regidized porous material and method
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US20030042006A1 (en) * 2001-08-28 2003-03-06 Advanced Materials Technologies Pte. Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
US20040040695A1 (en) * 2001-09-20 2004-03-04 Intel Corporation Modular capillary pumped loop cooling system
US20050145374A1 (en) * 1999-05-12 2005-07-07 Dussinger Peter M. Integrated circuit heat pipe heat spreader with through mounting holes
US20050205243A1 (en) * 2003-06-26 2005-09-22 Rosenfeld John H Brazed wick for a heat transfer device and method of making same
US20050247435A1 (en) * 2004-04-21 2005-11-10 Hul-Chun Hsu Wick structure of heat pipe
US20060005951A1 (en) * 2004-07-12 2006-01-12 Lan-Kai Yeh Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
US20060011328A1 (en) * 2004-07-16 2006-01-19 Hsu Hul-Chun Wick structure of heat pipe
WO2006007721A1 (en) * 2004-07-21 2006-01-26 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
US20060175044A1 (en) * 2005-02-10 2006-08-10 Chin-Wei Lee Heat dissipating tube sintered with copper powders
US20060243425A1 (en) * 1999-05-12 2006-11-02 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20060243426A1 (en) * 2004-04-21 2006-11-02 Hul-Chun Hsu Wick Structure of Heat Pipe
US20070089860A1 (en) * 2005-10-21 2007-04-26 Foxconn Technology Co., Ltd. Heat pipe with sintered powder wick
CN100417908C (zh) * 2005-09-16 2008-09-10 富准精密工业(深圳)有限公司 热管、烧结成型该热管毛细结构的粉体及方法
US20080245510A1 (en) * 2005-11-04 2008-10-09 Delta Electronics, Inc. Heat dissipation apparatus, two-phase heat exchange device and manufacturing method thereof
CN100453956C (zh) * 2005-11-01 2009-01-21 富准精密工业(深圳)有限公司 烧结式热管
US20090095448A1 (en) * 2007-10-10 2009-04-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for led chips
WO2020041810A1 (de) * 2018-08-29 2020-03-05 Miba Emobility Gmbh Wärmetransportvorrichtung
CN111761049A (zh) * 2019-04-01 2020-10-13 广州力及热管理科技有限公司 一种用于制作均温板中毛细结构的金属浆料
EP3815815A1 (de) * 2019-10-31 2021-05-05 Sunonwealth Electric Machine Industry Co., Ltd. Dampfkammer und kapillarfilm davon
US20220196338A1 (en) * 2020-12-23 2022-06-23 Abb Schweiz Ag Heat-transfer device and method to produce such a device
US20230324091A1 (en) * 2021-04-28 2023-10-12 Furukawa Electric Co., Ltd. Evaporation unit structure and heat transport member including evaporation unit structure
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919188C2 (de) * 1979-05-12 1986-10-30 Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart Verfahren zur Behandlung einer Oberfläche einer metallischen Wand für die Übertragung von Wärme und dessen Anwendung
DE3613802A1 (de) * 1986-04-24 1987-10-29 Dornier System Gmbh Integrierter kapillarverdampfer als waermeaufnehmendes element eines thermalkreislaufs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519067A (en) * 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US3525670A (en) * 1968-12-17 1970-08-25 Atomic Energy Commission Two-phase fluid control system
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3661202A (en) * 1970-07-06 1972-05-09 Robert David Moore Jr Heat transfer apparatus with improved heat transfer surface

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519067A (en) * 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US3525670A (en) * 1968-12-17 1970-08-25 Atomic Energy Commission Two-phase fluid control system
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3661202A (en) * 1970-07-06 1972-05-09 Robert David Moore Jr Heat transfer apparatus with improved heat transfer surface

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129181A (en) * 1977-02-16 1978-12-12 Uop Inc. Heat transfer surface
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4885129A (en) * 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
USH971H (en) 1988-10-24 1991-10-01 The United States Of America As Represented By The Secretary Of The Air Force Regidized porous material and method
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US5320866A (en) * 1988-10-24 1994-06-14 The United States Of America As Represented By The Secretary Of The Air Force Method of wet coating a ceramic substrate with a liquid suspension of metallic particles and binder applying similar dry metallic particles onto the wet surface, then drying and heat treating the article
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US20050145374A1 (en) * 1999-05-12 2005-07-07 Dussinger Peter M. Integrated circuit heat pipe heat spreader with through mounting holes
US20050217826A1 (en) * 1999-05-12 2005-10-06 Dussinger Peter M Integrated circuit heat pipe heat spreader with through mounting holes
US7028760B2 (en) * 1999-05-12 2006-04-18 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20060243425A1 (en) * 1999-05-12 2006-11-02 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20030042006A1 (en) * 2001-08-28 2003-03-06 Advanced Materials Technologies Pte. Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
US6935022B2 (en) * 2001-08-28 2005-08-30 Advanced Materials Technologies Pte, Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
US20040040695A1 (en) * 2001-09-20 2004-03-04 Intel Corporation Modular capillary pumped loop cooling system
US20040050533A1 (en) * 2001-09-20 2004-03-18 Intel Corporation Modular capillary pumped loop cooling system
EP1559982A2 (de) * 2001-09-20 2005-08-03 Intel Corporation Modularer Kühlkreislauf mit Kapillarpumpe
US7770630B2 (en) 2001-09-20 2010-08-10 Intel Corporation Modular capillary pumped loop cooling system
US20090139697A1 (en) * 2003-06-26 2009-06-04 Rosenfeld John H Heat transfer device and method of making same
US20050205243A1 (en) * 2003-06-26 2005-09-22 Rosenfeld John H Brazed wick for a heat transfer device and method of making same
US20060243426A1 (en) * 2004-04-21 2006-11-02 Hul-Chun Hsu Wick Structure of Heat Pipe
US20050247435A1 (en) * 2004-04-21 2005-11-10 Hul-Chun Hsu Wick structure of heat pipe
US7011145B2 (en) * 2004-07-12 2006-03-14 Industrial Technology Research Institute Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
US20060005951A1 (en) * 2004-07-12 2006-01-12 Lan-Kai Yeh Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
US6997244B2 (en) * 2004-07-16 2006-02-14 Hsu Hul-Chun Wick structure of heat pipe
US20060011328A1 (en) * 2004-07-16 2006-01-19 Hsu Hul-Chun Wick structure of heat pipe
WO2006007721A1 (en) * 2004-07-21 2006-01-26 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
US7828046B2 (en) 2004-07-21 2010-11-09 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
US20070084587A1 (en) * 2004-07-21 2007-04-19 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
US20060175044A1 (en) * 2005-02-10 2006-08-10 Chin-Wei Lee Heat dissipating tube sintered with copper powders
CN100417908C (zh) * 2005-09-16 2008-09-10 富准精密工业(深圳)有限公司 热管、烧结成型该热管毛细结构的粉体及方法
US20070089860A1 (en) * 2005-10-21 2007-04-26 Foxconn Technology Co., Ltd. Heat pipe with sintered powder wick
CN100453956C (zh) * 2005-11-01 2009-01-21 富准精密工业(深圳)有限公司 烧结式热管
US20080245510A1 (en) * 2005-11-04 2008-10-09 Delta Electronics, Inc. Heat dissipation apparatus, two-phase heat exchange device and manufacturing method thereof
US9080817B2 (en) 2005-11-04 2015-07-14 Delta Electronics, Inc. Method for manufacturing two-phase heat exchange device
US20090095448A1 (en) * 2007-10-10 2009-04-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for led chips
WO2020041810A1 (de) * 2018-08-29 2020-03-05 Miba Emobility Gmbh Wärmetransportvorrichtung
CN111761049A (zh) * 2019-04-01 2020-10-13 广州力及热管理科技有限公司 一种用于制作均温板中毛细结构的金属浆料
CN111761049B (zh) * 2019-04-01 2022-08-05 广州力及热管理科技有限公司 一种用于制作均温板中毛细结构的金属浆料
EP3815815A1 (de) * 2019-10-31 2021-05-05 Sunonwealth Electric Machine Industry Co., Ltd. Dampfkammer und kapillarfilm davon
US20220196338A1 (en) * 2020-12-23 2022-06-23 Abb Schweiz Ag Heat-transfer device and method to produce such a device
US20230324091A1 (en) * 2021-04-28 2023-10-12 Furukawa Electric Co., Ltd. Evaporation unit structure and heat transport member including evaporation unit structure
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer

Also Published As

Publication number Publication date
DE2120475A1 (de) 1972-11-02
CH539258A (de) 1973-07-15
NL7205382A (de) 1972-10-31

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